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TSX393IPT

STMicroelectronics

TSX393IPT by STMicroelectronics

TSX393IPT from STMicroelectronics is a dual comparator designed for automotive applications, featuring a max input offset voltage of 6mV and an average bias current of just 1.2nA. It operates within -40 °C to 125 °C and supports supply voltages up to 18V. Its compact SOIC package ensures efficient space utilization in electronic designs.

Median Price

$0.450

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 400 parts In-Stock

1+ parts

$0.319

100+ parts

-

1k+ parts

-

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400

$0.319

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-

-

Future Electronics

Canada . 400 parts In-Stock

1+ parts

$0.450

100+ parts

$0.405

1k+ parts

$0.395

10k+ parts

$0.375

400

$0.450

$0.405

$0.395

$0.375

Mouser Electronics

USA . 3,980 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

$0.413

3,980

$1.100

-

-

$0.413

Rochester

USA . 32,000 parts In-Stock

1+ parts

-

100+ parts

$0.676

1k+ parts

$0.561

10k+ parts

$0.500

32,000

-

$0.676

$0.561

$0.500

Verical

USA . 400 parts In-Stock

1+ parts

-

100+ parts

$0.319

1k+ parts

-

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400

-

$0.319

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Chip1Stop

Japan . 400 parts In-Stock

1+ parts

-

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400

-

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Distributors (In-Stock)

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Digiode

USA . 2,019 parts In-Stock

1+ parts

$0.283

100+ parts

-

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-

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2,019

$0.283

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Vyrian

USA . 1,626 parts In-Stock

1+ parts

$0.291

100+ parts

-

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-

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1,626

$0.291

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ComSIT Distribution GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

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4,000

-

-

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Bristol Electronics

USA . 3,750 parts In-Stock

1+ parts

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3,750

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Anansix

USA . 167 parts In-Stock

1+ parts

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,167 parts In-Stock

1+ parts

$0.268

100+ parts

-

1k+ parts

-

10k+ parts

-

2,167

$0.268

-

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Component Stockers USA

USA . 4,791 parts In-Stock

1+ parts

$0.290

100+ parts

$0.290

1k+ parts

$0.580

10k+ parts

-

4,791

$0.290

$0.290

$0.580

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Vigor

Singapore . 5,000 parts In-Stock

1+ parts

$0.440

100+ parts

-

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5,000

$0.440

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.569

100+ parts

$1.428

1k+ parts

$1.287

10k+ parts

-

500

$1.569

$1.428

$1.287

-

IDEA Electronic Components Group

UK . 283 parts In-Stock

1+ parts

$6.725

100+ parts

-

1k+ parts

$6.053

10k+ parts

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283

$6.725

-

$6.053

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MKK Technologies

India . 235 parts In-Stock

1+ parts

$12.646

100+ parts

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235

$12.646

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DigiPath Technology Company

USA . 235 parts In-Stock

1+ parts

$12.646

100+ parts

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235

$12.646

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Microchip USA

USA . 8,377 parts In-Stock

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8,377

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QUARKTWIN TECHNOLOGY LTD

USA . 5,232 parts In-Stock

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5,232

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Parana Technologies

USA . 1,917 parts In-Stock

1+ parts

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100+ parts

$8.041

1k+ parts

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1,917

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$8.041

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Kepictronics

USA . 1,043 parts In-Stock

1+ parts

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1,043

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Overview

Unlock precision and reliability with the TSX393IPT from STMicroelectronics, a leader in high-performance semiconductor solutions. This compact comparator is designed for automotive applications, ensuring robust performance even in extreme conditions. With ultra-low bias current and impressive response times, it streamlines your designs, enhances efficiency, and reduces power consumption. Experience unparalleled quality and innovation that drives your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 6000 uV

A low input offset voltage allows for more precise comparisons of input signals, enhancing accuracy in applications.

Maximum Average Bias Current (IIB): 0.0012 uA

This low bias current contributes to minimized power consumption, making it ideal for battery-operated devices.

Surface Mount: YES

The surface mount design facilitates compact circuit layouts and simplifies automated assembly processes.

Number of Functions: 2

Having two functions increases versatility, allowing it to handle multiple tasks within a single component.

Package Shape: RECTANGULAR

The rectangular shape is conducive to flexible design options in various PCB layouts.

Nominal Supply Voltage / Vsup (V): 3

Designed for 3V operation, it is particularly suitable for low-power applications commonly found in modern electronics.

Number of Terminals: 8

With 8 terminals, it provides sufficient connectivity options for complex circuits while maintaining a compact size.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile allow for space-efficient designs, making it great for compact devices.

Maximum Supply Voltage Limit: 18 V

The ability to handle up to 18V expands its usability across a range of applications without risk of damage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, it is suited for automotive and industrial applications where temperature stability is crucial.

Output Type: OPEN-DRAIN

Open-drain output configuration allows for easy interfacing with different logic levels and multiple devices on a single line.

Nominal Response Time: 2500 ns

A quick response time ensures efficient signal processing, making it ideal for applications requiring fast decisions.

Minimum Operating Temperature: -40 °C

The capability to operate in low temperatures makes it suitable for automotive and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning aids in compact design and effective placement on printed circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height is advantageous for space-constrained applications, enabling slimmer device designs.

Width: 3 mm

At just 3mm in width, it enables the design of compact and lightweight electronic solutions.

Length: 4.4 mm

The length of 4.4 mm is optimal for a variety of applications without compromising functionality.

Temperature Grade: AUTOMOTIVE

The automotive-grade classification signifies reliability and performance in harsh environments, crucial for automotive electronics.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high efficiency, which is vital for portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate ease of soldering and assembly, improving manufacturability.

Amplifier Type: COMPARATOR

As a comparator, it effectively interprets analog signals, making it essential for signal processing tasks.

Packing Method: TR

The taped and reeled packing method simplifies handling and placement during automated assembly processes.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch is ideal for high-density applications, allowing for more components within a smaller area.

Technical Specifications

Comparators TSX393IPT attributes and parameters. Explore more Comparators devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Technology:

CMOS

Total Functions:

2

Sub-Category:

Comparators

Output Type:

Open-Drain

Performance Specifications

Maximum Input Offset Voltage:

6 mV

Peak Bias Current:

1.2 nA

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Nominal Response Time:

2.5 µs

Physical Characteristics

Length:

0.173 in (4.4 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

TSX393IPT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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