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TSV6290ICT

STMicroelectronics

TSV6290ICT by STMicroelectronics

TSV6290ICT by STMicroelectronics is a micropower operational amplifier ideal for automotive applications. It features a max input offset voltage of 6000 µV, a common mode reject ratio of 74 dB, and operates within a supply range of 1.8-5 V. Its compact design ensures efficient performance in space-constrained environments.

Median Price

$1.990

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TEDSS.com

USA . 2,790 parts In-Stock

1+ parts

$1.990

100+ parts

$1.120

1k+ parts

-

10k+ parts

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2,790

$1.990

$1.120

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Vyrian

USA . 8,488 parts In-Stock

1+ parts

-

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8,488

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Digiode

USA . 4,862 parts In-Stock

1+ parts

-

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4,862

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Anansix

USA . 2,094 parts In-Stock

1+ parts

-

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2,094

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 1,683 parts In-Stock

1+ parts

$0.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$0.470

-

-

-

IDEA Electronic Components Group

UK . 964 parts In-Stock

1+ parts

$3.585

100+ parts

-

1k+ parts

$3.227

10k+ parts

-

964

$3.585

-

$3.227

-

MKK Technologies

India . 2,142 parts In-Stock

1+ parts

$6.742

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$6.742

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-

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DigiPath Technology Company

USA . 2,142 parts In-Stock

1+ parts

$6.742

100+ parts

-

1k+ parts

-

10k+ parts

-

2,142

$6.742

-

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AZTECH Wire

Italy . 941 parts In-Stock

1+ parts

$8.770

100+ parts

-

1k+ parts

-

10k+ parts

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941

$8.770

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QUARKTWIN TECHNOLOGY LTD

USA . 27,055 parts In-Stock

1+ parts

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27,055

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Perfect Parts

USA . 6,695 parts In-Stock

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6,695

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Microchip USA

USA . 6,209 parts In-Stock

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6,209

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Kepictronics

USA . 6,000 parts In-Stock

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6,000

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RC Electronics

USA . 6,000 parts In-Stock

1+ parts

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6,000

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Metaverse IC Inc.

Canada . 6,000 parts In-Stock

1+ parts

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6,000

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Corphita

USA . 2,013 parts In-Stock

1+ parts

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2,013

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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1,800

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Parana Technologies

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

$4.287

1k+ parts

-

10k+ parts

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1,757

-

$4.287

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Overview

Discover the TSV6290ICT from STMicroelectronics, a top-tier operational amplifier that combines exceptional quality and reliability for your most demanding applications. With its ultra-low bias current and impressive common mode rejection, this micropower op-amp excels in automotive and industrial designs. Benefit from its compact surface-mount package and superior performance, ensuring efficient power usage without compromising on precision—making it the ideal choice for innovative engineers seeking to elevate their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and reliability, making it suitable for various applications.

Maximum Input Offset Voltage: 6000 uV

The low maximum input offset voltage enhances accuracy in signal amplification, ensuring high-performance operation.

Maximum Average Bias Current (IIB): 0.0001 uA

Minimal bias current helps to reduce distortion and improves performance in precision applications.

Surface Mount: YES

Surface mount capability facilitates compact design and efficient assembly in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs.

Nominal Common Mode Reject Ratio: 74 dB

A high common mode reject ratio ensures the op-amp effectively ignores unwanted noise signals, improving signal integrity.

Nominal Supply Voltage / Vsup (V): 1.8

Low supply voltage operation makes it suitable for battery-powered and energy-efficient applications.

Power Supplies (V): 1.8/5

Versatile power supply options allow adaptability to different circuit designs and user needs.

No. of Terminals: 6

A compact terminal count simplifies implementation in tight spaces on PCB layouts.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a smaller footprint and efficient use of space.

Maximum Supply Voltage Limit: 6 V

Provides flexibility in design while ensuring safe operation under different voltage conditions.

Maximum Operating Temperature: 125 °C

High-temperature tolerance makes it suitable for automotive and other demanding environments.

Maximum Bias Current (IIB) @ 25C: 0.00001 uA

Extremely low bias current enhances precision in sensitive applications, reducing error margins.

Frequency Compensation: YES

Built-in frequency compensation allows efficient operation across a variety of frequencies.

Minimum Voltage Gain: 4470

High voltage gain enables effective amplification in low-level signal applications.

Minimum Operating Temperature: -40 °C

Low-temperature operation capability ensures reliability in extreme environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance for enhanced reliability in connections.

Terminal Position: DUAL

Dual terminal position design simplifies routing and integration into various circuits.

Maximum Seated Height: 1.1 mm

Compact height facilitates use in low-profile applications without compromising performance.

Width: 1.25 mm

Narrow width is suitable for applications where space is premium.

Micropower: YES

Micropower operation allows for extremely low power consumption, ideal for battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

The specified reflow time is compatible with standard soldering processes, ensuring reliable manufacturing.

Peak Reflow Temperature °C: 260

Ability to withstand high temperatures during soldering ensures compatibility with modern assembly techniques.

Length: 2 mm

Compact length fits well into space-constrained designs, contributing to smaller overall device size.

Temperature Grade: AUTOMOTIVE

Automotive-grade components ensure reliability and performance under rigorous automotive conditions.

Low-Bias: YES

Low-bias characteristics enhance precision, making it suitable for high-accuracy applications.

Nominal Unity Gain Bandwidth: 1100 kHz

High bandwidth allows for versatile applications, making it suitable for fast signal processing.

Technology: CMOS

CMOS technology allows for low power consumption and high integration, ideal for modern electronic applications.

Terminal Form: GULL WING

Gull wing terminals provide a reliable and easy-to-solder connection, enhancing assembly efficiency.

Amplifier Type: OPERATIONAL AMPLIFIER

Versatile operational amplifier design supports a wide range of applications, from signal conditioning to filtering.

Maximum Supply Current: 0.038 mA

Low supply current ensures minimal energy consumption, beneficial in battery-operated devices.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture is ideal for applications requiring high input impedance and high performance.

Packing Method: TAPE AND REEL

Tape and reel packing allows for efficient handling and automated assembly processes.

Nominal Slow Rate: 0.33 V/us

Moderate slow rates enable controlled signal handling, making it suitable for various timing applications.

Terminal Pitch: 0.65 mm

Optimal terminal pitch facilitates easy component placement and soldering on PCB layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TSV6290ICT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

1.8/5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.1 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

4470

Nominal Slew Rate:

0.33 V/us

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage:

6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

38 μA

Physical Characteristics

Length:

0.079 in (2 mm)

Width:

0.049 in (1.25 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

6

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Matte Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

TSV6290ICT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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