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TSM106IDT

STMicroelectronics

TSM106IDT by STMicroelectronics

TSM106IDT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 5000 µV and a nominal voltage of 5 V. It features an impressive common mode reject ratio of 85 dB, making it ideal for industrial applications. With a compact SO package and low bias current of 0.2 µA, it's perfect for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,905 parts In-Stock

1+ parts

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5,905

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Bristol Electronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Digiode

USA . 1,610 parts In-Stock

1+ parts

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1,610

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Anansix

USA . 903 parts In-Stock

1+ parts

-

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903

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,773 parts In-Stock

1+ parts

$0.841

100+ parts

-

1k+ parts

$0.757

10k+ parts

-

1,773

$0.841

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$0.757

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MKK Technologies

India . 896 parts In-Stock

1+ parts

$1.581

100+ parts

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896

$1.581

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DigiPath Technology Company

USA . 896 parts In-Stock

1+ parts

$1.581

100+ parts

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896

$1.581

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Microchip USA

USA . 2,653 parts In-Stock

1+ parts

$6.804

100+ parts

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2,653

$6.804

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AZTECH Wire

Italy . 156 parts In-Stock

1+ parts

$19.580

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156

$19.580

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Corphita

USA . 4,350 parts In-Stock

1+ parts

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4,350

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Vigor

Singapore . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 1,779 parts In-Stock

1+ parts

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100+ parts

$1.005

1k+ parts

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1,779

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$1.005

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Overview

Elevate your designs with the TSM106IDT from STMicroelectronics, a trusted leader in innovation. This dual operational amplifier combines exceptional performance with industrial-grade reliability, making it perfect for diverse applications ranging from signal conditioning to audio processing. With ultra-low bias current and impressive common-mode rejection, you’ll enjoy enhanced precision and stability. Discover the power of quality engineering that delivers superior value and peace of mind for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic epoxy as the package body material ensures durability and reliability in various environmental conditions.

Maximum Input Offset Voltage: 5000 uV

This low maximum input offset voltage indicates high accuracy, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.2 uA

The low average bias current enhances performance in low-power applications and reduces overall power consumption.

Surface Mount: YES

Surface mount technology allows for easier integration into compact circuit designs, making it ideal for modern electronics.

No. of Functions: 2

Having two functions enables flexibility in application, potentially reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape is conducive to efficient PCB layout and optimized space utilization.

Nominal Common Mode Reject Ratio: 85 dB

A high common mode reject ratio reduces the impact of noise and improves signal integrity in audio and sensor applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V caters to a wide range of digital applications, offering ease of use.

Power Supplies (V): +-2/+-16/4/32

The versatile power supply range provides flexibility for diverse design requirements and application scenarios.

No. of Terminals: 8

With 8 terminals, this op-amp offers ample connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps reduce board space, making it suitable for compact designs.

Minimum Slew Rate: 0.2 V/us

The minimum slew rate ensures adequate response speeds for many applications, though higher performance may be required for high frequency signals.

Maximum Supply Voltage Limit: 36 V

The high maximum supply voltage limit allows the op-amp to be used in robust, high-voltage applications without risk of damage.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Maximum Bias Current (IIB) @25°C: 0.2 uA

This ensures consistent low power operation at standard conditions, enhancing its suitability for precision low-power designs.

Frequency Compensation: YES

Built-in frequency compensation aids in maintaining stability across a range of operating conditions.

Minimum Voltage Gain: 25000

The high minimum voltage gain allows for effective amplification of weak signals, making it suitable for sensor applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in harsh or cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish enhances solderability and provides corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning facilitates easier mounting and improved layout options on various PCBs.

Maximum Seated Height: 1.75 mm

A low seated height enables better integration into space-constrained designs.

Width: 3.9 mm

The compact width is ideal for high-density circuit designs, promoting efficiency in layout.

Length: 4.9 mm

The small length contributes to its suitability for tight packaging conditions in modern electronics.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, ensuring dependable performance in demanding conditions.

Maximum Negative Supply Voltage Limit: 0 V

The zero negative supply voltage limitation simplifies usage in applications that do not require negative voltage.

Nominal Unity Gain Bandwidth: 900 kHz

A high unity gain bandwidth allows for effective operation in both low-frequency and bandwidth-sensitive applications.

Technology: BIPOLAR

Bipolar technology offers a good combination of speed and power handling capabilities, broadening the range of applications.

Terminal Form: GULL WING

Gull-wing terminals provide enhanced PCB production capabilities and promote strong mechanical connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, it is versatile and suitable for a wide variety of applications, including signal processing.

Maximum Supply Current: 10 mA

The moderate maximum supply current allows for efficient operation while ensuring compatibility with battery-powered applications.

Nominal Negative Supply Voltage (Vsup): 0 V

With a nominal negative supply voltage of 0 V, it simplifies designs that do not utilize negative voltage rails.

Architecture: VOLTAGE-FEEDBACK

The voltage-feedback architecture is ideal for standard op-amp applications, offering ease of use and stability.

Packing Method: TAPE AND REEL

The tape and reel packing method facilitates automated assembly processes, improving manufacturing efficiency.

Nominal Slow Rate: 0.4 V/us

A nominal slow rate of 0.4 V/us ensures adequate performance for many applications requiring gradual signal changes.

Terminal Pitch: 1.27 mm

A standard terminal pitch allows compatibility with widely used PCB designs and facilitates easier mounting.

Technical Specifications

Operational Amplifiers (Op Amps) TSM106IDT attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±2/±16/4/32 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

900 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

5000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

0.2 V/us

Nominal Slew Rate:

0.4 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

200 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

36 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Maximum Supply Current:

10 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TSM106IDT Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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