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TSG85121VP

STMicroelectronics

TSG85121VP by STMicroelectronics

TSG85121VP by STMicroelectronics is an active filter with CMOS technology, -40 to 85 °C operating temp, and 5 mA max supply current. It features a switched capacitor filter for lowpass response and is ideal for industrial applications requiring a nominal voltage of ±5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,487 parts In-Stock

1+ parts

-

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4,487

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Digiode

USA . 4,178 parts In-Stock

1+ parts

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-

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4,178

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Anansix

USA . 523 parts In-Stock

1+ parts

-

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523

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,934 parts In-Stock

1+ parts

$18.547

100+ parts

-

1k+ parts

$16.692

10k+ parts

-

1,934

$18.547

-

$16.692

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MKK Technologies

India . 1,849 parts In-Stock

1+ parts

$34.877

100+ parts

-

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1,849

$34.877

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DigiPath Technology Company

USA . 1,849 parts In-Stock

1+ parts

$34.877

100+ parts

-

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-

10k+ parts

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1,849

$34.877

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Corphita

USA . 4,524 parts In-Stock

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4,524

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Parana Technologies

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

$22.176

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10k+ parts

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1,653

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$22.176

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Overview

Unleash the power of precision with the TSG85121VP by STMicroelectronics. Crafted with the highest quality materials and cutting-edge CMOS technology, this active filter offers unparalleled performance in a compact rectangular package. Ideal for applications requiring lowpass response and elliptic transfer characteristics, this switched capacitor filter guarantees seamless integration and optimal functionality. Elevate your projects with the reliability and efficiency that only STMicroelectronics can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, ideal for various applications.

Maximum Supply Current (Isup): 5 mA

With a low maximum supply current of 5 mA, this product is energy-efficient and suitable for applications where power consumption needs to be minimized.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Nominal Negative Supply Voltage (Vsup): -5 V

The nominal negative supply voltage of -5V allows for proper functioning of the active filter within the specified voltage range.

Active Filter Type: SWITCHED CAPACITOR FILTER

The switched capacitor filter type offers high precision and stability in filtering applications, making this product suitable for critical filtering tasks.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product can withstand high-temperature environments without compromising performance.

Response Type: LOWPASS

The lowpass response type of this active filter allows for the passage of low-frequency signals while attenuating high-frequency signals, making it ideal for specific filtering requirements.

Transfer Characteristics: ELLIPTIC

The elliptic transfer characteristics of this active filter provide high selectivity and stopband attenuation, ensuring precise filtering in applications where signal shaping is critical.

Technical Specifications

Active Filters TSG85121VP attributes and parameters. Explore more Active Filters devices from STMicroelectronics

Electrical Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Current (Isup):

5 mA

Nominal Negative Supply Voltage:

-5 V

Power Supply:

±5 V

Performance Parameters

Semiconductor Technology:

CMOS

Response Type:

Filter Technology:

Transfer Characteristics:

Elliptical

Filter Order:

7th

Environmental Characteristics

Maximum Operating Temperature:

85 °C (185 °F)

Minimum Operating Temperature:

-40 °C (-40 °F)

Temperature Grade:

Connectivity

Total Functions:

1

Total Terminals:

8

Terminal Finish:

Tin/Lead

Terminal Form:

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Physical Characteristics

Package Style:

In-Line

Form Factor:

Rectangular

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Body Material:

Plastic/Epoxy

Surface Mounting:

No

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e0

Additional Features

Qualified:

No

Trade Compliance

TSG85121VP Active Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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