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TS4657IQT

STMicroelectronics

TS4657IQT by STMicroelectronics

TS4657IQT by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a 2-channel output and operating temp range of -40 °C to 85°C. It supports supply voltages from 3V to 5.5V and has a very thin profile of just 1mm height. Ideal for surface mount designs, it ensures efficient performance in audio and video systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,819 parts In-Stock

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7,819

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Digiode

USA . 1,817 parts In-Stock

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1,817

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Anansix

USA . 1,754 parts In-Stock

1+ parts

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1,754

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Zilex Electronics Inc.

Canada . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 81 parts In-Stock

1+ parts

$1.836

100+ parts

-

1k+ parts

$1.653

10k+ parts

-

81

$1.836

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$1.653

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MKK Technologies

India . 252 parts In-Stock

1+ parts

$3.453

100+ parts

-

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252

$3.453

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DigiPath Technology Company

USA . 252 parts In-Stock

1+ parts

$3.453

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252

$3.453

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Microchip USA

USA . 451 parts In-Stock

1+ parts

$3.473

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451

$3.473

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Ampacity Inc.

Singapore . 1,648 parts In-Stock

1+ parts

$14.800

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1,648

$14.800

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AZTECH Wire

Italy . 1,043 parts In-Stock

1+ parts

$15.660

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1,043

$15.660

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Perfect Parts

USA . 25,164 parts In-Stock

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25,164

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Corphita

USA . 3,434 parts In-Stock

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3,434

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Parana Technologies

USA . 2,072 parts In-Stock

1+ parts

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$2.196

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2,072

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$2.196

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Overview

Elevate your audio experience with the TS4657IQT from STMicroelectronics, a leader in innovation and quality. This sleek, compact audio amplifier provides superior sound clarity while boasting unmatched reliability across industrial applications. With its advanced design, it effortlessly supports various projects, ensuring optimal performance even in extreme environments. Choose the TS4657IQT for exceptional value and benefits that enhance your audio solutions!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into various devices, saving space and enabling more efficient PCB layouts.

Package Shape: SQUARE

The square package shape facilitates better thermal performance and easier placement on PCBs.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed for high-quality audio applications, providing superior sound performance.

No. of Terminals: 20

The availability of 20 terminals allows for versatile configuration options and connectivity in complex audio designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enhances heat dissipation and enables integration into slim devices without compromising power efficiency.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this amplifier is suitable for industrial environments and demanding applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, making it ideal for outdoor and rugged applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and enhances the reliability of electrical connections.

Terminal Position: QUAD

Quad terminal position design allows for efficient routing of signals and optimized PCB design.

Maximum Seated Height: 1 mm

Its low profile of 1 mm is perfect for space-constrained applications, ensuring compatibility with slim form factors.

Width: 4 mm

A compact width of 4 mm enables higher density circuit designs without limiting performance.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage means it can be powered by a variety of battery technologies, making it versatile for portable applications.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds, this product is compatible with standard soldering processes, simplifying assembly.

Peak Reflow Temperature °C: 260

The ability to withstand peak reflow temperatures of 260 °C ensures durability and integrity during manufacturing.

Length: 4 mm

A length of 4 mm contributes to the overall compactness, making it easy to fit into tight spaces within electronic designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it offers enhanced reliability and stability under challenging conditions.

No. of Channels: 2

With two channels, it allows for stereo audio amplification, delivering a rich sound experience.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz ensures good low-frequency response, essential for high-quality audio applications.

Terminal Form: NO LEAD

The no-lead design reduces the overall footprint and enhances the environmental footprint of the product.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables tighter layout spacing, allowing for more compact designs without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

Classified as MSL 3, this product offers a reasonable shelf life and ease of handling in moist environments.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V allows it to be comfortably powered by standard electronic components, making it versatile for many applications.

Technical Specifications

Audio & Video Amplifiers TS4657IQT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Trade Compliance

TS4657IQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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