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TS4601EIJT

STMicroelectronics

TS4601EIJT by STMicroelectronics

TS4601EIJT by STMicroelectronics is a compact audio amplifier designed for industrial applications, featuring a 2-channel output and operating voltage range of 2.9V to 5.5V. It supports temperatures from -40 °C to 85°C and comes in a fine pitch grid array package. Ideal for space-constrained designs, it ensures reliable performance with low power consumption at just 7mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,219

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-

-

-

Anansix

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,953

-

-

-

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Digiode

USA . 1,458 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,458

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,894 parts In-Stock

1+ parts

$1.701

100+ parts

-

1k+ parts

$1.531

10k+ parts

-

1,894

$1.701

-

$1.531

-

MKK Technologies

India . 2,052 parts In-Stock

1+ parts

$3.199

100+ parts

-

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-

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2,052

$3.199

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-

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DigiPath Technology Company

USA . 2,052 parts In-Stock

1+ parts

$3.199

100+ parts

-

1k+ parts

-

10k+ parts

-

2,052

$3.199

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-

-

Corphita

USA . 4,508 parts In-Stock

1+ parts

-

100+ parts

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4,508

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-

-

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Parana Technologies

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

$2.034

1k+ parts

-

10k+ parts

-

1,964

-

$2.034

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Overview

Elevate your audio experience with the TS4601EIJT from STMicroelectronics, a trusted leader in innovative technology. This sleek, surface-mount audio amplifier not only delivers exceptional sound quality but is also designed for industrial-grade performance, ensuring reliability in diverse applications. With its compact design and efficiency, it seamlessly integrates into your projects, offering unmatched value and superior audio clarity that meets the demands of today's audio enthusiasts.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making this amplifier a reliable choice for various applications.

Surface Mount: YES

Being a surface mount device allows for easier integration into compact circuit designs, saving board space.

Package Shape: SQUARE

The square package shape facilitates uniform heat distribution and optimized layout in circuit boards.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it's specifically designed to enhance sound quality, making it ideal for audio applications.

Power Supplies (V): 3.3/5

Compatible with standard voltage levels, this amplifier can work effectively with a wide range of devices.

No. of Terminals: 16

The 16 terminals provide ample connectivity options for integration into complex circuits.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch allows for high-density mounting, suitable for compact electronic designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this amplifier can function reliably even in warm environments.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C makes it suitable for harsh outdoor conditions and industrial applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for efficient thermal management and PCB layout.

Width: 2.1 mm

A compact width of 2.1mm makes this amplifier ideal for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.9 V

A low minimum supply voltage ensures compatibility with lower-power electronics, enhancing versatility.

Length: 2.1 mm

Similar to its width, a 2.1mm length contributes to a compact form factor, perfect for miniaturized devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability and durability in demanding environments.

No. of Channels: 2

With two channels, it provides stereo audio output, an essential feature for premium audio quality.

Nominal Bandwidth: 0.02 kHz

A broad nominal bandwidth enables efficient amplification of low-frequency sounds, enhancing audio performance.

Terminal Form: BALL

Ball terminal form allows for a reliable connection in surface mount applications, reducing the risk of faults.

Maximum Supply Current: 7 mA

A maximum supply current of 7 mA ensures efficient power consumption while providing adequate performance.

Terminal Pitch: 0.5 mm

A 0.5mm terminal pitch allows for a tighter arrangement of terminals, enabling high-density PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

The capability of handling up to 5.5V provides flexibility in integration with other electronic components.

Technical Specifications

Audio & Video Amplifiers TS4601EIJT attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

JESD-30 Code:

S-PBGA-B16

Length:

2.1 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA16,4X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

7 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.1 mm

Trade Compliance

TS4601EIJT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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