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TS321AIYD

STMicroelectronics

TS321AIYD by STMicroelectronics

TS321AIYD by STMicroelectronics is a versatile op-amp with a max input offset voltage of 3000 µV, an average bias current of just 0.2 µA, and a common mode reject ratio of 85 dB. Ideal for automotive applications, it operates within -40 °C to 125 °C. Its compact design ensures efficient performance in various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,001 parts In-Stock

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4,001

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Digiode

USA . 3,253 parts In-Stock

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3,253

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Anansix

USA . 2,283 parts In-Stock

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2,283

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IDEA Electronic Components Group

UK . 41 parts In-Stock

1+ parts

$5.676

100+ parts

-

1k+ parts

$5.109

10k+ parts

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41

$5.676

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$5.109

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MKK Technologies

India . 1,470 parts In-Stock

1+ parts

$10.674

100+ parts

-

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1,470

$10.674

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DigiPath Technology Company

USA . 1,470 parts In-Stock

1+ parts

$10.674

100+ parts

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1,470

$10.674

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Corphita

USA . 264 parts In-Stock

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264

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Parana Technologies

USA . 91 parts In-Stock

1+ parts

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100+ parts

$6.787

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91

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$6.787

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Overview

Elevate your designs with the TS321AIYD operational amplifier from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance op-amp delivers exceptional precision and reliability across automotive and industrial applications. With its low bias current and robust temperature range, it ensures superior signal integrity while simplifying integration into your systems. Trust STMicroelectronics for quality and performance that drives your projects forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials provide good reliability and performance under various conditions.

Maximum Input Offset Voltage: 3000 uV

Low input offset voltage ensures accurate signal amplification, making it suitable for precision applications.

Maximum Average Bias Current (IIB): 0.2 uA

Low bias current minimizes errors in applications requiring high precision, contributing to better overall performance.

Surface Mount: YES

Enables compact designs and automated assembly processes, making it suitable for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space, ideal for high-density circuitry.

Nominal Common Mode Reject Ratio: 85 dB

High CMRR ensures effective rejection of common-mode signals, improving noise performance in various applications.

Nominal Supply Voltage / Vsup (V): 5

Standard operating voltage is easy to integrate into most electronic circuits, providing versatility.

Power Supplies (V): ±1.5/±15/3/30

Multiple supply options enhance compatibility with various systems and configurations.

No. of Terminals: 8

Standard number of terminals allows for easy integration into existing designs without complex modifications.

Package Style (Meter): SMALL OUTLINE

The compact package style saves board space and facilitates higher circuit density.

Maximum Supply Voltage Limit: 32 V

High supply voltage tolerance enables operation in demanding applications with greater flexibility.

Maximum Operating Temperature: 125 °C

High-temperature rating allows for operation in challenging environments, enhancing reliability in automotive and industrial applications.

Maximum Bias Current (IIB) @25 °C: 0.15 uA

Very low bias current at room temperature minimizes additional noise, leading to cleaner signal processing.

Frequency Compensation: YES

Built-in frequency compensation ensures stable operation across a wide range of frequencies.

Minimum Voltage Gain: 25000

High voltage gain enables weak signal amplification, making it ideal for sensing and signal conditioning applications.

Minimum Operating Temperature: -40 °C

Low-temperature rating makes the product suitable for operation in extreme environments, ideal for automotive use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality finish provides excellent corrosion resistance and reliability for long-term usage.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB layout and orientation during assembly.

Maximum Seated Height: 1.75 mm

Low height profile allows for use in tight spaces and helps maintain a thin form factor.

Width: 3.9 mm

Narrow width fits easily into compact designs and high-density circuit applications.

Maximum Time At Peak Reflow Temperature (s): 40

Generous time allowance for peak reflow contributes to reliable solder joint formation during assembly.

Peak Reflow Temperature (°C): 260

High peak temperature withstand ensures compatibility with various surface mount soldering processes.

Length: 4.9 mm

Compact length contributes to design flexibility, helping developers optimize layout in space-constrained designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability and longevity in demanding conditions.

Maximum Negative Supply Voltage Limit: 0 V

Offers positive voltage operations only, simplifying design considerations for many applications.

Nominal Negative Supply Voltage (Vsup): 0 V

Simplifies supply requirements for common applications that do not need negative voltages.

Nominal Unity Gain Bandwidth: 800 kHz

High unity gain bandwidth ensures fast signal response, suitable for high-speed applications.

Technology: BIPOLAR

Bipolar technology offers advantages in terms of noise performance and linearity, vital for high-quality signal amplification.

Terminal Form: GULL WING

Gull wing terminals provide optimal soldering performance and reliability in surface mount applications.

Amplifier Type: OPERATIONAL AMPLIFIER

Versatile operational amplifier type is applicable in a wide range of signal processing tasks.

Maximum Supply Current: 1 mA

Low power consumption makes it suitable for battery-powered and energy-sensitive applications.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture provides excellent linearity and stability, ideal for a variety of applications.

Packing Method: TUBE

Tube packaging facilitates easy handling and storage, ensuring integrity during transport.

Nominal Slow Rate: 0.4 V/μs

Moderate slow rate supports stable performance while maintaining signal integrity.

Terminal Pitch: 1.27 mm

Standard terminal pitch accommodates a wide range of PCB designs and manufacturing processes.

Technical Specifications

Operational Amplifiers (Op Amps) TS321AIYD attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from STMicroelectronics

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.5/±15/3/30 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

800 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

3000 uV

Minimum Voltage Gain:

25000

Nominal Slew Rate:

0.4 V/us

Peak Bias Current:

200 nA

Maximum Bias Current (IIB) @25 °C:

150 nA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

32 V

Maximum Negative Supply Voltage:

0 V

Minimum Negative Supply Voltage:

0 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

40 s

Maximum Supply Current:

1 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TS321AIYD Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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