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TL7702ACD1013TRA

STMicroelectronics

TL7702ACD1013TRA by STMicroelectronics

TL7702ACD1013TRA by STMicroelectronics is a Power Management IC with 8 terminals, operating voltage range of 3.6-18V, and threshold voltage of +2.53V. It is used in power supply support circuits for commercial applications due to its small outline package and bipolar technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,244 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 4,474 parts In-Stock

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4,474

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Anansix

USA . 1,956 parts In-Stock

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1,956

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Semi Source

USA . 1,345 parts In-Stock

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1,345

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Digiode

USA . 355 parts In-Stock

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355

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Nova Conductors

Japan . 85 parts In-Stock

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85

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Ampacity Inc.

Singapore . 168 parts In-Stock

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$0.500

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168

$0.500

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Semicontronic

India . 1,103 parts In-Stock

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$4.500

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$4.388

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$4.365

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1,103

$4.500

$4.388

$4.365

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Corohmni

South Africa . 22 parts In-Stock

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$4.986

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22

$4.986

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IDEA Electronic Components Group

UK . 1,606 parts In-Stock

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$8.593

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-

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$7.734

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1,606

$8.593

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$7.734

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MKK Technologies

India . 1,826 parts In-Stock

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$16.158

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1,826

$16.158

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DigiPath Technology Company

USA . 1,826 parts In-Stock

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$16.158

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$16.158

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Aztec Data Supply Inc.

USA . 2,479 parts In-Stock

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$18.400

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$18.400

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AZTECH Wire

Italy . 331 parts In-Stock

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$19.476

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$19.476

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Microchip USA

USA . 403 parts In-Stock

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$26.110

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$26.110

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$26.110

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$26.110

403

$26.110

$26.110

$26.110

$26.110

QUARKTWIN TECHNOLOGY LTD

USA . 29,251 parts In-Stock

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Lixinc

USA . 14,711 parts In-Stock

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Assy Fe

Spain . 4,474 parts In-Stock

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Argo Parts USA

USA . 3,547 parts In-Stock

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Kepictronics

USA . 3,301 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,427 parts In-Stock

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Parana Technologies

USA . 638 parts In-Stock

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$10.274

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$10.274

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Metaverse IC Inc.

Canada . 327 parts In-Stock

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Corphita

USA . 213 parts In-Stock

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Bastille Electronics

Australia . 28 parts In-Stock

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Overview

Unleash the power of your devices with the TL7702ACD1013TRA by STMicroelectronics, a high-quality Power Management IC designed to optimize performance and efficiency. Manufactured by industry leader STMicroelectronics, this product offers unparalleled reliability and durability. Ideal for a wide range of applications, this IC ensures stable power supplies and seamless operation. Experience the value and benefits of superior quality with the TL7702ACD1013TRA and elevate your electronics to new heights. Trust STMicroelectronics for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and lightweight design, making it suitable for portable devices.

Surface Mount: YES

Surface mount capability simplifies PCB assembly and saves space, increasing overall efficiency.

Nominal Supply Voltage (Vsup): 5 V

Standard supply voltage of 5V ensures compatibility with common power sources.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and flexibility in circuit designs.

Maximum Operating Temperature: 70 °C

High maximum operating temperature of 70°C ensures stable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures functionality in cold environments.

Nominal Threshold Voltage (V): +2.53V

Accurate nominal threshold voltage allows for precise power supply regulation.

Technology: BIPOLAR

Bipolar technology provides reliable voltage control and performance for power management applications.

Technical Specifications

Power Management ICs TL7702ACD1013TRA attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.6/18

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3.6 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.53V

Width (mm):

3.9 mm

Trade Compliance

TL7702ACD1013TRA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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