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TDA7564BH

STMicroelectronics

TDA7564BH by STMicroelectronics

TDA7564BH by STMicroelectronics is a Class AB audio amplifier with 50 W output power and 4 channels. It operates b/w 8-18 V supply, featuring low harmonic distortion at 10%. Ideal for automotive audio applications, it ensures high-quality sound performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,204 parts In-Stock

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6,204

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Digiode

USA . 2,400 parts In-Stock

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2,400

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Anansix

USA . 764 parts In-Stock

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764

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 577 parts In-Stock

1+ parts

$3.484

100+ parts

-

1k+ parts

$3.136

10k+ parts

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577

$3.484

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$3.136

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MKK Technologies

India . 1,557 parts In-Stock

1+ parts

$6.552

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1,557

$6.552

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$6.552

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1,557

$6.552

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Microchip USA

USA . 259 parts In-Stock

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$7.516

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259

$7.516

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AZTECH Wire

Italy . 439 parts In-Stock

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$15.910

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439

$15.910

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Parana Technologies

USA . 1,307 parts In-Stock

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$4.166

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1,307

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$4.166

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Corphita

USA . 394 parts In-Stock

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394

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Overview

Elevate your audio experience with the TDA7564BH from STMicroelectronics—a trusted leader in innovation. This Class AB amplifier delivers rich, high-quality sound with exceptional clarity and minimal distortion, making it perfect for automotive audio systems, home theaters, or portable devices. Enjoy robust performance with its versatile 4-channel output, ensuring every note resonates beautifully. Experience the difference that quality engineering brings to your audio journey!

Feature Benefit Bullets

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space, making it ideal for compact audio amplifier designs.

IC Type: CLASS AB AUDIO AMPLIFIER

Class AB amplifiers are known for their high efficiency and low distortion, providing excellent audio quality.

Harmonic Distortion: 10 %

A low harmonic distortion level ensures clearer sound reproduction, enhancing the overall listening experience.

Power Supplies (V): 14.4

An operating voltage of 14.4V is suitable for many automotive and portable applications, ensuring versatility.

No. of Terminals: 25

The 25 terminals allow for versatile connectivity options and integration in complex audio systems.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy installation and stability in various audio setups.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and corrosion resistance, maintaining performance over time.

Terminal Position: ZIG-ZAG

The zig-zag terminal configuration allows for efficient space-saving layout on printed circuit boards.

Nominal Output Power: 50 W

A nominal output power of 50W delivers strong audio performance, suitable for driving speakers effectively in various environments.

Minimum Supply Voltage (Vsup): 8 V

The ability to operate at a minimum supply voltage of 8V provides flexibility for various power source applications.

No. of Channels: 4

Four channels enable multi-speaker setups, enhancing sound dynamics and immersive listening experiences.

Technology: BCDMOS

BCD technology contributes to enhanced power efficiency and improved thermal performance in audio applications.

Nominal Bandwidth: 0.022 kHz

The nominal bandwidth of 0.022 kHz ensures compatibility with a wide range of audio frequencies.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for reliable connections and is easy to work with in prototyping and manufacturing.

Maximum Supply Current: 300 mA

A maximum supply current of 300 mA is enough for dynamic audio signals, allowing for rich and powerful sound.

Terminal Pitch: 1 mm

The 1 mm terminal pitch enables dense layouts, making it suitable for compact electronic designs.

Gain: 26 dB

A gain of 26 dB provides sufficient amplification for various audio sources, ensuring clear and loud output.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, ensuring reliable performance in conditions with slight humidity.

Maximum Supply Voltage (Vsup): 18 V

The maximum supply voltage of 18V allows for maximum output power while ensuring versatility across various applications.

Technical Specifications

Audio & Video Amplifiers TDA7564BH attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

26 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-XZFM-T25

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

25

Nominal Output Power:

50 W

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP25H,.14,.7,40

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

300 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDA7564BH General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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