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TDA7563PDTR

STMicroelectronics

TDA7563PDTR by STMicroelectronics

TDA7563PDTR by STMicroelectronics is a compact 4-channel audio amplifier with a nominal output power of 46 W and low harmonic distortion at 10%. It operates b/w 8-18 V, making it ideal for automotive audio systems. Its small outline package ensures efficient heat dissipation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,889 parts In-Stock

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2,889

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Digiode

USA . 1,045 parts In-Stock

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1,045

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Anansix

USA . 981 parts In-Stock

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981

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 990 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

$1.629

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990

$1.810

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$1.629

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MKK Technologies

India . 496 parts In-Stock

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$3.403

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496

$3.403

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DigiPath Technology Company

USA . 496 parts In-Stock

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$3.403

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496

$3.403

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AZTECH Wire

Italy . 59 parts In-Stock

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$21.540

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59

$21.540

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Microchip USA

USA . 237 parts In-Stock

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$32.030

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237

$32.030

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QUARKTWIN TECHNOLOGY LTD

USA . 8,124 parts In-Stock

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Parana Technologies

USA . 2,055 parts In-Stock

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$2.164

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2,055

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$2.164

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Corphita

USA . 2,030 parts In-Stock

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2,030

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Overview

Elevate your audio experience with the TDA7563PDTR from STMicroelectronics, a leader in innovative technology. This powerful 4-channel audio amplifier delivers exceptional sound quality, making it perfect for automotive and home audio applications. With its compact design and advanced BCDMOS technology, you’ll enjoy robust performance without compromising space. Trust in STMicroelectronics to provide reliability and superior sound that transforms any listening environment!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the amplifier highly reliable.

Surface Mount: YES

Surface mount technology enhances compactness, allowing for easier integration into various designs and saving PCB space.

Package Shape: RECTANGULAR

The rectangular package shape helps in efficient space utilization on the circuit board, facilitating better layout options.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier IC, this product is specifically designed to enhance sound quality in audio applications, making it ideal for audio equipment.

Harmonic Distortion: 10 %

With moderate harmonic distortion levels, this amplifier provides clear sound reproduction, which is essential for high-quality audio experience.

No. of Terminals: 36

A higher number of terminals allows for greater functionality and connectivity options, making this amplifier versatile in various setups.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style facilitates effective heat dissipation and compact mounting, crucial for maintaining performance and longevity.

Terminal Position: DUAL

Dual terminal positions provide flexible connection options, making installation and integration easier in different audio configurations.

Nominal Output Power: 46 W

A nominal output power of 46 W ensures sufficient performance for driving speakers effectively, suitable for both home and professional audio systems.

Maximum Seated Height: 3.43 mm

With a low profile of 3.43 mm, this amplifier can fit into space-constrained designs without sacrificing performance.

Width: 11 mm

A compact width of 11 mm enhances the product's adaptability in varied applications, from portable devices to larger setups.

Minimum Supply Voltage (Vsup): 8 V

Operates efficiently at a minimum supply voltage of 8 V, making it suitable for battery-operated devices and reducing power consumption.

Length: 15.9 mm

Compact length of 15.9 mm complements the overall design, allowing for efficient use of space in electronic projects.

No. of Channels: 4

Four channels provide flexibility for multi-channel audio systems, enhancing the audio experience in various applications.

Technology: BCDMOS

Utilizing BCDMOS technology enhances efficiency and performance, leading to better thermal characteristics and lower power losses.

Nominal Bandwidth: 0.022 kHz

The nominal bandwidth provides sufficient frequency response for audio applications, ensuring sound fidelity across various audio signals.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes, improving reliability in connections and making assembly more efficient.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density circuit designs, perfect for modern compact electronics.

Gain: 30 dB

A gain of 30 dB facilitates sufficient amplification of audio signals, ensuring clarity and loudness without distortion.

Maximum Supply Voltage (Vsup): 18 V

Supports a maximum supply voltage of 18 V, providing flexibility in power supply options while ensuring optimal performance.

Technical Specifications

Audio & Video Amplifiers TDA7563PDTR attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Nominal Output Power:

46 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.43 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Technology:

BCDMOS

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDA7563PDTR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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