Loading...

STW19NM65N

STMicroelectronics

STW19NM65N by STMicroelectronics

STW19NM65N by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 15.5A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,478

-

-

-

-

Digiode

USA . 4,471 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,471

-

-

-

-

Anansix

USA . 2,660 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

-

-

-

-

R&J Components

USA . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

540

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 722 parts In-Stock

1+ parts

$1.495

100+ parts

-

1k+ parts

$1.346

10k+ parts

-

722

$1.495

-

$1.346

-

MKK Technologies

India . 216 parts In-Stock

1+ parts

$2.811

100+ parts

-

1k+ parts

-

10k+ parts

-

216

$2.811

-

-

-

DigiPath Technology Company

USA . 216 parts In-Stock

1+ parts

$2.811

100+ parts

-

1k+ parts

-

10k+ parts

-

216

$2.811

-

-

-

AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$22.070

100+ parts

-

1k+ parts

-

10k+ parts

-

878

$22.070

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 19,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,260

-

-

-

-

Corphita

USA . 4,584 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,584

-

-

-

-

Alle Elektronik GmbH

Germany . 3,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

-

-

-

-

Parana Technologies

USA . 1,639 parts In-Stock

1+ parts

-

100+ parts

$1.788

1k+ parts

-

10k+ parts

-

1,639

-

$1.788

-

-

Metaverse IC Inc.

Canada . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Perfect Parts

USA . 652 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

652

-

-

-

-

Overview

Elevate your projects with the STW19NM65N from STMicroelectronics, a premier choice in power FET technology. Renowned for exceptional quality and reliability, STMicroelectronics ensures this N-channel transistor delivers outstanding switching performance in demanding applications. With efficient energy management and robust thermal handling, it empowers designs ranging from industrial automation to renewable energy systems. Experience unmatched value and innovation that drives your success forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides good thermal stability and durability, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and lower on-resistance, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode aids in handling reverse currents, improving circuit reliability and reducing component count.

Transistor Application: SWITCHING

Optimized for switching applications, this FET delivers fast response times and improved efficiency.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this FET to operate safely in high-voltage environments, ensuring reliability.

Package Shape: RECTANGULAR

The rectangular shape enables easy placement on PCBs, contributing to efficient layout designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust physical connections, ideal for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for low power consumption during standby, contributing to energy efficiency.

Maximum Pulsed Drain Current (IDM): 62 A

The high pulsed current rating enables this FET to handle surges and transients, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating indicates robustness against energy spikes, enhancing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 15.5 A

A relatively high maximum drain current ensures that the transistor can support significant loads in various applications.

No. of Terminals: 3

Three terminals provide flexibility in circuit design, simplifying integration into various systems.

Maximum Power Dissipation (Abs): 150 W

High power dissipation capabilities enable effective heat management, allowing for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mounting allows for easy assembly and improved thermal management, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high switching speeds and low power loss, making this FET ideal for modern electronics.

Maximum Operating Temperature: 150 °C

A high operating temperature range ensures reliability and functionality in extreme environmental conditions.

Transistor Element Material: SILICON

Silicon as the base material enhances performance and availability, ensuring widespread compatibility.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability, ensuring reliable connections during assembly.

Maximum Drain Current (ID): 15.5 A

This reaffirms the FET's ability to handle significant loads effectively, ensuring it meets application requirements.

Maximum Drain-Source On Resistance: 0.27 ohm

The low on-resistance minimizes power loss during operation, increasing overall efficiency in power applications.

Terminal Position: SINGLE

A single terminal position simplifies design and integration, making it versatile for various electronic designs.

Technical Specifications

Power Field Effect Transistors (FET) STW19NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

15.5 A

Maximum Drain Current (ID):

15.5 A

Maximum Drain-Source On Resistance:

.27 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

62 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW19NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20