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STW16NM50N

STMicroelectronics

STW16NM50N by STMicroelectronics

STW16NM50N by STMicroelectronics is an N-channel FET ideal for switching applications. It features a 500V breakdown voltage, 15A max drain current, and operates at up to 150 °C. Its robust design ensures reliability in high-power circuits.

Median Price

$8.736

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 600 parts In-Stock

1+ parts

$8.736

100+ parts

$3.785

1k+ parts

$3.582

10k+ parts

-

600

$8.736

$3.785

$3.582

-

Vyrian

USA . 2,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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2,015

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Digiode

USA . 1,740 parts In-Stock

1+ parts

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-

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1,740

-

-

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Lakeland Logistics Inc

USA . 600 parts In-Stock

1+ parts

-

100+ parts

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600

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Anansix

USA . 132 parts In-Stock

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132

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 313 parts In-Stock

1+ parts

$0.752

100+ parts

-

1k+ parts

$0.676

10k+ parts

-

313

$0.752

-

$0.676

-

MKK Technologies

India . 567 parts In-Stock

1+ parts

$1.413

100+ parts

-

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-

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567

$1.413

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DigiPath Technology Company

USA . 567 parts In-Stock

1+ parts

$1.413

100+ parts

-

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567

$1.413

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AZTECH Wire

Italy . 216 parts In-Stock

1+ parts

$21.120

100+ parts

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216

$21.120

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Component Stockers USA

USA . 345 parts In-Stock

1+ parts

$99.990

100+ parts

-

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345

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 17,051 parts In-Stock

1+ parts

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17,051

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,949 parts In-Stock

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2,949

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Parana Technologies

USA . 2,225 parts In-Stock

1+ parts

-

100+ parts

$0.899

1k+ parts

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2,225

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$0.899

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Alle Elektronik GmbH

Germany . 1,272 parts In-Stock

1+ parts

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1,272

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Overview

Unlock the potential of your projects with the STW16NM50N from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET delivers reliable performance for demanding switching applications, ensuring efficiency and durability. With its high breakdown voltage and integrated diode, it enhances system safety while reducing power loss. Trust in STMicroelectronics' proven quality to elevate your designs and maximize value—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental conditions, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide lower on-resistance and higher efficiency, making them ideal for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's functionality and provides additional protection, which is beneficial in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET enables efficient control of power flow in circuits.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage of 500 V ensures reliable operation in high-voltage applications, preventing premature failure.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of space on PCB layouts, allowing for more compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and reliability in high-stress environments, making installation easier.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and higher efficiency, ideal for modern electronic designs.

Maximum Pulsed Drain Current (IDM): 60 A

The ability to handle up to 60 A pulsed drain current ensures the FET can manage high power loads effectively.

Avalanche Energy Rating (EAS): 470 mJ

A high avalanche energy rating indicates strong reliability and durability against voltage spikes in transient conditions.

Maximum Drain Current (Abs) (ID): 15 A

This maximum drain current ensures that the FET can handle substantial loads in practical applications.

No. of Terminals: 3

The 3-terminal design simplifies circuit integration and reduces layout complexity.

Maximum Power Dissipation (Abs): 125 W

A maximum power dissipation of 125 W indicates the FET can operate efficiently without overheating in demanding situations.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure mounting and good heat dissipation, enhancing thermal management in the application.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high efficiency and fast switching speeds, which are critical in modern power electronics.

Maximum Operating Temperature: 150 °C

A high operating temperature rating indicates robustness in severe thermal environments, extending the product's lifespan.

Transistor Element Material: SILICON

Silicon is a standard choice for FETs due to its excellent electrical properties and availability, ensuring reliability.

Terminal Finish: MATTE TIN/TIN SILVER COPPER

Quality terminal finishes enhance solderability and corrosion resistance, ensuring longevity and reliable electrical connections.

Maximum Drain Current (ID): 15 A

This maximum drain current specification demonstrates the device's capacity to manage power effectively in circuits.

Maximum Drain-Source On Resistance: 0.26 ohm

A low on-resistance enhances efficiency by minimizing power loss and heat generation during operation.

Terminal Position: SINGLE

Single terminal positioning simplifies design and integration into circuit boards, making it user-friendly for engineers.

Technical Specifications

Power Field Effect Transistors (FET) STW16NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

470 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3/e1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN/TIN SILVER COPPER

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW16NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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