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STW15NM60ND

STMicroelectronics

STW15NM60ND by STMicroelectronics

STW15NM60ND from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 600V breakdown voltage and 14A max drain current. It offers a low on-resistance of 0.299Ω and operates at up to 150 °C. Its robust design ensures reliability in demanding environments.

Median Price

$6.360

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 372 parts In-Stock

1+ parts

$6.360

100+ parts

$3.673

1k+ parts

$3.138

10k+ parts

-

372

$6.360

$3.673

$3.138

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,167 parts In-Stock

1+ parts

$7.106

100+ parts

-

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1,167

$7.106

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Cyclops Electronics Ltd

UK . 4,800 parts In-Stock

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4,800

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Vyrian

USA . 3,951 parts In-Stock

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3,951

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Anansix

USA . 2,379 parts In-Stock

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2,379

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R&J Components

USA . 570 parts In-Stock

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570

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ComSIT Distribution GmbH

Germany . 540 parts In-Stock

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540

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,375 parts In-Stock

1+ parts

$0.849

100+ parts

-

1k+ parts

$0.764

10k+ parts

-

2,375

$0.849

-

$0.764

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MKK Technologies

India . 1,966 parts In-Stock

1+ parts

$1.597

100+ parts

-

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1,966

$1.597

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DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$1.597

100+ parts

-

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1,966

$1.597

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Corphita

USA . 1,556 parts In-Stock

1+ parts

$6.732

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1,556

$6.732

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Kepictronics

USA . 20,340 parts In-Stock

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20,340

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Epart123

USA . 4,800 parts In-Stock

1+ parts

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$2.250

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4,800

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$2.250

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GreenTree Electronics

Israel . 4,800 parts In-Stock

1+ parts

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4,800

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Microchip USA

USA . 2,940 parts In-Stock

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2,940

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Perfect Parts

USA . 2,918 parts In-Stock

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2,918

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A-Z Elektronik GmbH

Germany . 1,662 parts In-Stock

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1,662

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Alle Elektronik GmbH

Germany . 1,409 parts In-Stock

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1,409

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Parana Technologies

USA . 1,045 parts In-Stock

1+ parts

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100+ parts

$1.015

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1,045

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$1.015

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Overview

Experience unrivaled performance with the STW15NM60ND from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful N-channel FET is designed for efficient switching applications, delivering reliability and durability that your projects demand. With its robust 600V breakdown voltage and built-in diode, it excels in diverse industrial settings, ensuring seamless operation while maximizing energy efficiency. Trust STMicroelectronics for quality that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental stress, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode adds protection against reverse currents, enhancing the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast operation and low power loss.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage capability allows this FET to be utilized in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and easier mounting in various layouts.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer robust mechanical connections, ensuring reliable performance in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enhances the performance by allowing the FET to operate with lower gate-source voltages.

Maximum Pulsed Drain Current (IDM): 56 A

This high pulsed drain current capability enables the FET to handle significant transient loads effectively.

Avalanche Energy Rating (EAS): 300 mJ

A suitable avalanche energy rating provides better reliability against transient voltages during operation.

Maximum Drain Current (Abs) (ID): 14 A

The maximum drain current rating allows for substantial load handling, making it ideal for high-performance applications.

No. of Terminals: 3

A three-terminal configuration typically offers versatile connection options and simplifies circuit design.

Maximum Power Dissipation (Abs): 125 W

The ability to dissipate 125 W of power means this FET can efficiently handle heat in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide additional thermal dissipation and stable mounting options for various setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high switching speeds and low gate power consumption, enhancing overall circuit efficiency.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable functionality in extreme conditions and demanding environments.

Transistor Element Material: SILICON

Silicon is a standard choice for transistors due to its excellent electrical properties and wide availability.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish enhances solderability and ensures reliable electrical connections.

Maximum Drain Current (ID): 14 A

The repeat listing emphasizes the FET’s capability to handle substantial continuous current, reflecting its robustness.

Maximum Drain-Source On Resistance: 0.299 ohm

Low on-resistance results in improved efficiency and reduced heat generation when the FET is operating.

Terminal Position: SINGLE

Single terminal position simplifies integration into circuits and aids in compact design.

Technical Specifications

Power Field Effect Transistors (FET) STW15NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW15NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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