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STW150NF55

STMicroelectronics

STW150NF55 by STMicroelectronics

STW150NF55 by STMicroelectronics is a powerful N-channel FET designed for switching applications, featuring a max drain current of 120 A and a breakdown voltage of 55 V. It operates in enhancement mode with low on-resistance (0.006 Ω). Ideal for high-efficiency power management in various electronic devices.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 28 parts In-Stock

1+ parts

$3.850

100+ parts

$2.880

1k+ parts

$2.500

10k+ parts

-

28

$3.850

$2.880

$2.500

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Vyrian

USA . 4,719 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,719

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-

-

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Digiode

USA . 3,059 parts In-Stock

1+ parts

-

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-

1k+ parts

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3,059

-

-

-

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Anansix

USA . 1,237 parts In-Stock

1+ parts

-

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1,237

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Cyclops Electronics Ltd

UK . 40 parts In-Stock

1+ parts

-

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40

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$0.333

100+ parts

-

1k+ parts

$0.300

10k+ parts

-

215

$0.333

-

$0.300

-

MKK Technologies

India . 1,362 parts In-Stock

1+ parts

$0.626

100+ parts

-

1k+ parts

-

10k+ parts

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1,362

$0.626

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-

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DigiPath Technology Company

USA . 1,362 parts In-Stock

1+ parts

$0.626

100+ parts

-

1k+ parts

-

10k+ parts

-

1,362

$0.626

-

-

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AZTECH Wire

Italy . 809 parts In-Stock

1+ parts

$16.410

100+ parts

-

1k+ parts

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809

$16.410

-

-

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A-Z Elektronik GmbH

Germany . 6,359 parts In-Stock

1+ parts

-

100+ parts

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6,359

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Alle Elektronik GmbH

Germany . 4,928 parts In-Stock

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4,928

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 2,113 parts In-Stock

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2,113

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Parana Technologies

USA . 1,687 parts In-Stock

1+ parts

-

100+ parts

$0.398

1k+ parts

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1,687

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$0.398

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Assy Fe

Spain . 2 parts In-Stock

1+ parts

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2

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Overview

Unlock unparalleled efficiency and reliability with the STW150NF55 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel Power FET excels in switching applications, offering remarkable power handling and thermal performance, ensuring your designs remain robust under pressure. Choose STMicroelectronics for quality you can trust, as they empower a diverse range of industries—from automotive to renewable energy—delivering unmatched value and performance that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials provides durability and ensures protection against environmental factors, making this FET reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher efficiency and faster switching speeds, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET by providing additional surge protection in applications that require it.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET allows for efficient operation in power management and control circuits.

Minimum DS Breakdown Voltage: 55 V

With a breakdown voltage of 55V, this FET can handle significant voltage spikes, ensuring reliable operation in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier PCB layout and design, optimizing space and enhancing thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical stability, making this FET suitable for robust industrial applications.

Operating Mode: ENHANCEMENT MODE

In enhancement mode, this FET requires a positive gate voltage for conduction, leading to low power loss in standby states.

Maximum Pulsed Drain Current (IDM): 480 A

A pulsed drain current rating of 480 A allows for handling high transient loads, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 850 mJ

An avalanche energy rating of 850 mJ provides the capability to withstand energy spikes, increasing the reliability of the FET in dynamic environments.

Maximum Drain Current (Abs) (ID): 120 A

With a maximum drain current of 120 A, this FET is capable of delivering high current in various applications, from automotive to industrial.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and connection while ensuring efficient operation.

Maximum Power Dissipation (Abs): 300 W

A maximum power dissipation of 300 W allows for high-efficiency operation, reducing the likelihood of overheating and failure.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide excellent thermal performance and mechanical stability, ensuring reliable operation in a variety of setups.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology results in lower gate drive power and improved thermal stability compared to other technologies, enhancing overall efficiency.

Maximum Operating Temperature: 175 °C

An operating temperature of up to 175 °C allows this FET to function in high-temperature environments, making it suitable for automotive and industrial applications.

Transistor Element Material: SILICON

Silicon as the element material ensures good conductivity and is cost-effective, making this FET a practical choice for a wide range of applications.

Terminal Finish: TIN

Tin terminal finishes provide excellent solderability and corrosion resistance, ensuring long-term reliability in various applications.

Maximum Drain Current (ID): 120 A

Reiterating the high maximum drain current capability, this FET can efficiently handle demanding loads.

Maximum Drain-Source On Resistance: 0.006 ohm

A low on-resistance value minimizes power losses during operation, enhancing the overall efficiency of the system.

Terminal Position: SINGLE

Single terminal position allows for uncomplicated circuit designs and integration into diverse applications.

Case Connection: DRAIN

With a case connection for the drain, this FET is optimized for effective current handling, which is crucial for its intended applications.

Technical Specifications

Power Field Effect Transistors (FET) STW150NF55 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

850 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW150NF55 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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