Loading...

STW14NK60Z

STMicroelectronics

STW14NK60Z by STMicroelectronics

STW14NK60Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 54A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,271

-

-

-

-

Anansix

USA . 2,638 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,638

-

-

-

-

Digiode

USA . 1,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,244

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 97 parts In-Stock

1+ parts

$1.522

100+ parts

-

1k+ parts

$1.370

10k+ parts

-

97

$1.522

-

$1.370

-

MKK Technologies

India . 1,782 parts In-Stock

1+ parts

$2.861

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

$2.861

-

-

-

DigiPath Technology Company

USA . 1,782 parts In-Stock

1+ parts

$2.861

100+ parts

-

1k+ parts

-

10k+ parts

-

1,782

$2.861

-

-

-

AZTECH Wire

Italy . 522 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

10k+ parts

-

522

$8.550

-

-

-

Alle Elektronik GmbH

Germany . 4,655 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,655

-

-

-

-

Parana Technologies

USA . 2,306 parts In-Stock

1+ parts

-

100+ parts

$1.819

1k+ parts

-

10k+ parts

-

2,306

-

$1.819

-

-

Assy Fe

Spain . 330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

330

-

-

-

-

Corphita

USA . 139 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

139

-

-

-

-

Overview

Elevate your projects with the STW14NK60Z from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET delivers exceptional reliability and efficiency for your switching applications, ensuring robust performance even under demanding conditions. With its built-in diode and high breakdown voltage, it’s perfect for various industrial uses. Trust STMicroelectronics for quality and enjoy unparalleled benefits, driving your designs toward success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides a lightweight and durable construction, enhancing the device's reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration typically offers lower on-resistance and higher performance metrics, making it ideal for efficient power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the design and saves space on the circuit board while providing necessary protection against voltage spikes.

Transistor Application: SWITCHING

Optimized for switching applications, this FET delivers fast response times and energy efficiency, making it suitable for power supply circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle significant voltage spikes, ensuring enhanced durability and safety in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient space utilization on printed circuit boards, making it easier to integrate into various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, which are beneficial for applications requiring high reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the conductivity, providing exceptional performance in varied electrical conditions.

Maximum Pulsed Drain Current (IDM): 54 A

A high pulsed drain current capability makes this FET suitable for applications that require handling sudden bursts of current.

Avalanche Energy Rating (EAS): 300 mJ

This rating indicates the FET's ability to withstand energy from avalanche effects, enhancing its reliability in circuit protection scenarios.

Maximum Drain Current (Abs) (ID): 12 A

With a substantial maximum drain current, this FET supports high-load applications, ensuring efficient operation in demanding tasks.

No. of Terminals: 3

Having three terminals allows for versatile connections and simplified circuit designs, enhancing overall functionality.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability ensures that the FET can operate efficiently without overheating, promoting longevity and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides excellent thermal management and mechanical stability, making it ideal for high-performance applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology ensures high efficiency and fast switching capabilities, making it a preferable choice for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating means this FET can be used in aggressive environments without risk of failure.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material that provides excellent electrical performance and stability in various applications.

Terminal Finish: MATTE TIN

Matte tin finish ensures good solderability and corrosion resistance, enhancing the longevity of the product in various environmental conditions.

Maximum Drain Current (ID): 13.5 A

This high maximum drain current capacity enables the FET to support demanding loads without compromising performance.

Maximum Drain-Source On Resistance: 0.5 ohm

Low on-resistance minimizes power loss during operation, making this FET highly efficient for power conversion applications.

Terminal Position: SINGLE

Single terminal position simplifies layout and design processes, streamlining integration into various circuit configurations.

Technical Specifications

Power Field Effect Transistors (FET) STW14NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

54 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STW14NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20