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STTS75DS2E

STMicroelectronics

STTS75DS2E by STMicroelectronics

STTS75DS2E by STMicroelectronics is a compact temperature sensor with a 9-bit resolution and operates b/w -55 °C to 125°C. It features a 2-wire interface, making it ideal for digital output applications. With a supply voltage range of 2.7V to 5.5V, it's perfect for various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,283 parts In-Stock

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2,283

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Digiode

USA . 1,752 parts In-Stock

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1,752

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Anansix

USA . 1,667 parts In-Stock

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1,667

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$1.985

100+ parts

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$1.787

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1,549

$1.985

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$1.787

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MKK Technologies

India . 1,123 parts In-Stock

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$3.733

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$3.733

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DigiPath Technology Company

USA . 1,123 parts In-Stock

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$3.733

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1,123

$3.733

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Corphita

USA . 2,588 parts In-Stock

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2,588

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Parana Technologies

USA . 2,007 parts In-Stock

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$2.374

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2,007

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$2.374

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Overview

Elevate your projects with the STTS75DS2E temperature sensor from STMicroelectronics, a leader in innovative technology. This reliable and compact sensor delivers precision and durability, ensuring optimal performance even in extreme conditions. Its versatile applications across industrial, automotive, and consumer electronics make it an essential choice for engineers seeking quality and efficiency. Experience seamless integration and enhanced accuracy, boosting your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the sensor's protection against environmental factors, contributing to its longevity and reliability.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V makes the sensor compatible with a variety of power sources, providing flexibility for integration into different systems.

No. of Bits: 9

With 9 bits of resolution, this sensor ensures accurate temperature readings, making it suitable for applications requiring precise measurements.

Body Width: 2.8 inch

The compact width of 2.8 inches allows for easy integration into space-constrained applications without compromising performance.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, providing versatility and convenience for design engineers in various circuits.

Sensors or Transducers Type: TEMPERATURE SENSOR, SWITCH/DIGITAL OUTPUT, SERIAL

This multifunctional sensor type enables it to be used in a broad range of applications, enhancing its usability and adaptability.

No. of Terminals: 8

The 8 terminals facilitate easy connections, simplifying installation and integration in circuit designs.

Body Height: 1.1 mm

A slim body height of only 1.1 mm makes it an excellent choice for compact devices without sacrificing performance.

Package Shape or Style: SQUARE

The square package shape ensures efficient space utilization on PCBs and provides a steady platform for mounting.

Minimum Supply Voltage: 2.7 V

With a minimum supply voltage of just 2.7 V, this sensor can operate in low-power environments, making it ideal for battery-operated devices.

Maximum Operating Temperature: 125 °C

The ability to operate at up to 125 °C allows this sensor to be used in high-temperature applications, increasing its versatility.

Minimum Operating Temperature: -55 °C

Its capability to function at -55 °C ensures reliable performance in extremely cold environments, making it suitable for harsh conditions.

Maximum Operating Current: 0.1 mA

A low operating current of 0.1 mA promotes energy efficiency, ideal for low-power applications where battery life is critical.

Technology: CMOS

The use of CMOS technology leads to lower power consumption, ensuring that this sensor remains efficient over extended periods.

Maximum Accuracy °C: 3

A maximum accuracy of 3 °C allows adequate performance in temperature monitoring applications, ensuring reliable readings.

Body Length/Diameter: 2.8 mm

A dimension of 2.8 mm contributes to its compact design, making it a perfect fit for applications with limited space.

Termination Type: SOLDER

Solder termination ensures robust and reliable electrical connections, crucial for maintaining accurate sensor functionality.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface enables simpler wiring and reduces the number of connections required, streamlining overall design.

Mounting Feature: SURFACE MOUNT

Surface mount technology enables easy integration onto PCBs, allowing for efficient assembly and reduced manufacturing costs.

Technical Specifications

Temperature Sensors STTS75DS2E attributes and parameters. Explore more Temperature Sensors devices from STMicroelectronics

Specs

Maximum Accuracy (Cel):

3

Additional Features:

CMOS COMPATIBLE, THERMAL WATCHDOG

Body Width:

2.8 inch

Body Height:

1.1 mm

Body Length/Diameter:

2.8 mm

Mounting Feature:

No. of Bits:

9

No. of Terminals:

8

Maximum Operating Current:

.1 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Interface Type:

2-WIRE INTERFACE

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

TSSOP8,.19

Package Shape or Style:

Power Supplies (V):

3/5

Sub-Category:

Other Sensors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Technology:

CMOS

Termination Type:

SOLDER

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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