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STT7P2UH7

STMicroelectronics

STT7P2UH7 by STMicroelectronics

STT7P2UH7 by STMicroelectronics is a P-CHANNEL FET with 20V DS Breakdown Voltage and 28A IDM. It is used for SWITCHING applications in ENHANCEMENT MODE, featuring 0.085 ohm Drain-Source On Resistance. The transistor has GULL WING terminals, operates at -55 °C, and comes in a SMALL OUTLINE package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 5,472 parts In-Stock

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Anansix

USA . 627 parts In-Stock

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Digiode

USA . 488 parts In-Stock

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LWI Electronics Inc

India . 19 parts In-Stock

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IDEA Electronic Components Group

UK . 525 parts In-Stock

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$0.292

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$0.262

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525

$0.292

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$0.262

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MKK Technologies

India . 1,391 parts In-Stock

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$0.548

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DigiPath Technology Company

USA . 1,391 parts In-Stock

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$0.548

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$0.548

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AZTECH Wire

Italy . 1,174 parts In-Stock

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$8.140

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Perfect Parts

USA . 13,440 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,797 parts In-Stock

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Corphita

USA . 4,781 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,199 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 1,649 parts In-Stock

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$0.349

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iodParts Technologies Inc.

India . 900 parts In-Stock

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Overview

Elevate your power management solutions with the STT7P2UH7 from STMicroelectronics. As pioneers in semiconductor technology, STMicroelectronics delivers top-quality Power FETs for a wide range of applications. The STT7P2UH7 P-Channel Power FET is designed for efficient switching operations, offering a built-in diode and high reliability. With a maximum pulsed drain current of 28A and a low on-resistance of 0.085 ohms, this FET provides exceptional performance and value for your projects. Upgrade your systems with the STT7P2UH7 and experience superior power management capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, ensuring a long lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower on-resistance and higher current capability compared to N-channel FETs, making it a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the switching process, making this transistor suitable for applications where fast switching speeds are required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor is optimized for controlling power flows with minimal loss.

Surface Mount: YES

Surface mount capability allows for easy and space-efficient PCB assembly, ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 20 V

The high breakdown voltage ensures reliable operation in various voltage conditions, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy placement and mounting on PCBs, saving space and simplifying the assembly process.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, improving the reliability of the transistor in electronic circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and easy control of the gate signal, making them suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 28 A

The high pulsed drain current rating allows for handling of heavy current surges, making it suitable for power applications.

No. of Terminals: 6

The 6 terminals provide the necessary connections for the transistor's operation, offering versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices and applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high efficiency and fast switching speeds, making it a suitable choice for various power applications.

Transistor Element Material: SILICON

Silicon is a reliable and durable material for transistor elements, ensuring stable performance over time.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55 °C, this transistor can withstand harsh environmental conditions.

Maximum Drain Current (ID): 7 A

The high maximum drain current rating allows for handling of high power loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.085 ohm

The low on-resistance minimizes power loss and heat dissipation, improving efficiency in power switching applications.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit design and allows for easy connection to external components.

Technical Specifications

Power Field Effect Transistors (FET) STT7P2UH7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

28 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STT7P2UH7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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