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STS7PF30L

STMicroelectronics

STS7PF30L by STMicroelectronics

STS7PF30L by STMicroelectronics is a P-CHANNEL FET with 30V DS breakdown voltage and 28A max pulsed drain current. Ideal for switching applications, it features a built-in diode, 0.028 ohm max RDS(on), and operates in enhancement mode.

Median Price

$0.557

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

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$0.557

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650

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Chip Stock

USA . 13,565 parts In-Stock

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Vyrian

USA . 8,371 parts In-Stock

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8,371

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Digiode

USA . 4,220 parts In-Stock

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Freddi Giovanni

Italy . 3,700 parts In-Stock

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3,700

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Anansix

USA . 1,986 parts In-Stock

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ComSIT Distribution GmbH

Germany . 60 parts In-Stock

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60

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Semi Source

USA . 11 parts In-Stock

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Distributors (Availability)

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Argo Parts USA

USA . 1,106 parts In-Stock

1+ parts

$0.557

100+ parts

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$0.540

1,106

$0.557

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$0.540

Continental Prestige Electronics

USA . 571 parts In-Stock

1+ parts

$0.557

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$0.546

571

$0.557

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$0.546

Corohmni

South Africa . 764 parts In-Stock

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$0.557

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764

$0.557

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IDEA Electronic Components Group

UK . 2,074 parts In-Stock

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$1.029

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$0.926

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2,074

$1.029

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$0.926

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Aztec Data Supply Inc.

USA . 274 parts In-Stock

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$1.750

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274

$1.750

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MKK Technologies

India . 1,051 parts In-Stock

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$1.934

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1,051

$1.934

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DigiPath Technology Company

USA . 1,051 parts In-Stock

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$1.934

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$1.934

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AZTECH Wire

Italy . 192 parts In-Stock

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$10.804

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Semicontronic

India . 182 parts In-Stock

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$37.050

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$36.124

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$35.938

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182

$37.050

$36.124

$35.938

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Ampacity Inc.

Singapore . 756 parts In-Stock

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$41.050

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756

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Lixinc

USA . 15,038 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,510 parts In-Stock

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Perfect Parts

USA . 8,341 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,493 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,400 parts In-Stock

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Authorized Procurement Solutions

USA . 2,300 parts In-Stock

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Assy Fe

Spain . 2,197 parts In-Stock

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Parana Technologies

USA . 692 parts In-Stock

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$1.230

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$1.230

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Netroflash

USA . 500 parts In-Stock

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$0.546

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$0.529

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$0.518

500

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$0.546

$0.529

$0.518

Corphita

USA . 353 parts In-Stock

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353

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Overview

Enhance your power management solutions with the STS7PF30L by STMicroelectronics. Crafted with precision and reliability, this P-Channel Power FET offers superior performance in switching applications. With a maximum pulsed drain current of 28A and a minimum DS breakdown voltage of 30V, this transistor provides efficient power distribution. Whether you're designing consumer electronics or industrial equipment, the STS7PF30L's single configuration with built-in diode ensures seamless functionality. Trust STMicroelectronics for cutting-edge technology that delivers exceptional value and performance to meet all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower resistance and higher efficiency compared to N-channel FETs, making them a good choice for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps prevent reverse current flow, protecting the circuit and improving overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides efficient and reliable performance in controlling power flow.

Surface Mount: YES

Being surface mountable makes the installation of this FET easier and more convenient, especially in compact electronic devices.

Maximum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, ensuring safety and reliability in demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low power consumption, and high efficiency, making this FET suitable for various electronic applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this FET to be used in applications where heat dissipation is a concern, without sacrificing performance.

Technical Specifications

Power Field Effect Transistors (FET) STS7PF30L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

28 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STS7PF30L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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