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STPS3045CFP

STMicroelectronics

STPS3045CFP by STMicroelectronics

STPS3045CFP by STMicroelectronics is a Schottky rectifier diode with a max forward voltage of 0.57 V and supports up to 15 A output current. It features a common cathode configuration in a flange mount package, ideal for power applications. With a peak reverse voltage of 45 V, it ensures reliable performance in demanding environments.

Median Price

$4.164

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 420 parts In-Stock

1+ parts

$4.164

100+ parts

$4.372

1k+ parts

$4.123

10k+ parts

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420

$4.164

$4.372

$4.123

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Vyrian

USA . 5,808 parts In-Stock

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5,808

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Digiode

USA . 326 parts In-Stock

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326

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Anansix

USA . 315 parts In-Stock

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315

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 100 parts In-Stock

1+ parts

$0.081

100+ parts

-

1k+ parts

$0.073

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100

$0.081

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$0.073

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MKK Technologies

India . 1,131 parts In-Stock

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$0.152

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$0.152

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DigiPath Technology Company

USA . 1,131 parts In-Stock

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$0.152

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$0.152

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AZTECH Wire

Italy . 120 parts In-Stock

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$9.180

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120

$9.180

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RC Electronics

USA . 6,480 parts In-Stock

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6,480

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Kepictronics

USA . 5,229 parts In-Stock

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Corphita

USA . 3,200 parts In-Stock

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Parana Technologies

USA . 595 parts In-Stock

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$0.097

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595

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$0.097

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Overview

Unlock the power of efficiency with the STPS3045CFP Schottky Rectifier from STMicroelectronics. Renowned for their uncompromising quality, STMicroelectronics delivers a solution that excels in high-performance applications, ensuring reliability and durability. With its compact design and superior thermal management, this diode is ideal for powering devices in consumer electronics, renewable energy systems, and automotive sectors. Trust in STMicroelectronics to elevate your projects with unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for long-term applications.

Config: COMMON CATHODE, 2 ELEMENTS

This configuration simplifies circuit design for applications requiring multiple diodes, enhancing design versatility.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, enabling a compact design.

No. of Terminals: 3

With three terminals, the diode provides flexibility in circuit connections and easier integration into various designs.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers secure mounting options, improving stability and reliability in applications.

Application: POWER

Designed for power applications, this diode can handle high currents, making it ideal for energy-efficient systems.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent corrosion resistance, ensuring long-lasting performance in various environments.

Terminal Position: SINGLE

A single terminal position can simplify installation and reduce potential errors during assembly.

Case Connection: ISOLATED

Isolated case connections help to prevent accidental short circuits, enhancing safety in electrical systems.

Diode Type: RECTIFIER DIODE

As a rectifier diode, it efficiently converts AC to DC, essential for power supply circuits.

Maximum Forward Voltage (VF): 0.57 V

A low forward voltage drop means less energy loss during operation, improving overall efficiency in power applications.

Maximum Output Current: 15 A

With a maximum output current of 15 A, this diode is capable of managing high loads without overheating.

Technology: SCHOTTKY

Schottky technology provides faster switching speeds and lower forward voltage drops, making it ideal for high-frequency applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance mechanical strength and provide reliable electrical connections, particularly in high-stress environments.

No. of Elements: 2

Having two elements allows for dual functionality, which can be advantageous in various applications requiring multiple diode functions.

Maximum Repetitive Peak Reverse Voltage: 45 V

A high reverse voltage tolerance makes this diode suitable for use in high-voltage applications.

Maximum Non Repetitive Peak Forward Current: 220 A

This diode's ability to handle peak forward currents up to 220 A ensures reliability during brief surges in electrical demand.

Diode Element Material: SILICON

Silicon is a stable and widely used material in semiconductors, ensuring consistent performance and reliability.

Technical Specifications

Diodes & Rectifiers STPS3045CFP attributes and parameters. Explore more Diodes & Rectifiers devices from STMicroelectronics

Specs

Additional Features:

FREE WHEELING DIODE

Application:

POWER

Case Connection:

ISOLATED

Config:

COMMON CATHODE, 2 ELEMENTS

Diode Element Material:

SILICON

Diode Type:

Maximum Forward Voltage (VF):

.57 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Non Repetitive Peak Forward Current:

220 A

No. of Elements:

2

No. of Phases:

1

No. of Terminals:

3

Maximum Output Current:

15 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Repetitive Peak Reverse Voltage:

45 V

Sub-Category:

Rectifier Diodes

Surface Mount:

NO

Technology:

SCHOTTKY

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Position:

Trade Compliance

STPS3045CFP Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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