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STPMIC02TR

STMicroelectronics

STPMIC02TR by STMicroelectronics

STPMIC02TR from STMicroelectronics is a versatile power management IC with a nominal voltage of 5V, supporting up to 4 channels. It operates b/w -10 °C and 85 °C, featuring a compact design (3.5mm x 4.5mm) and adjustable threshold at +1.6V. Ideal for efficient power supply applications in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,614 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,614

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-

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Digiode

USA . 3,521 parts In-Stock

1+ parts

-

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1k+ parts

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3,521

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Anansix

USA . 2,338 parts In-Stock

1+ parts

-

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2,338

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 892 parts In-Stock

1+ parts

$19.392

100+ parts

-

1k+ parts

$17.453

10k+ parts

-

892

$19.392

-

$17.453

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MKK Technologies

India . 695 parts In-Stock

1+ parts

$36.465

100+ parts

-

1k+ parts

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10k+ parts

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695

$36.465

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DigiPath Technology Company

USA . 695 parts In-Stock

1+ parts

$36.465

100+ parts

-

1k+ parts

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10k+ parts

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695

$36.465

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Component Stockers USA

USA . 684 parts In-Stock

1+ parts

$99.990

100+ parts

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684

$99.990

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Corphita

USA . 2,399 parts In-Stock

1+ parts

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2,399

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Parana Technologies

USA . 1,681 parts In-Stock

1+ parts

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100+ parts

$23.186

1k+ parts

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1,681

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$23.186

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Overview

Unlock the potential of your designs with the STPMIC02TR from STMicroelectronics, a leader in innovation and reliability. This versatile power management IC seamlessly integrates into your projects, offering exceptional performance in tight spaces with its ultra-thin profile. With a robust operating range and efficient power supply support, it’s perfect for applications from consumer electronics to industrial systems. Trust in STMicroelectronics for quality that powers your success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient use of space on printed circuit boards, making the product ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a streamlined footprint, facilitating easier placement and soldering on PCBs.

Nominal Supply Voltage (Vsup): 5 V

With a nominal supply voltage of 5V, this IC fits well with standard power supply systems, ensuring compatibility with various devices.

No. of Terminals: 24

Having 24 terminals allows for versatile connections, making this product suitable for multi-channel applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier with heat sink and very thin profile ensures effective thermal management while saving space in your design.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C indicates reliability in demanding environments, ideal for high-temperature applications.

Minimum Operating Temperature: -10 °C

The wide temperature range starting at -10 °C makes this IC suitable for outdoor or unregulated environments.

Terminal Position: QUAD

Quad terminal position design enhances connectivity options and simplifies layout for PCB designers.

Maximum Seated Height: 0.9 mm

With a maximum seated height of only 0.9 mm, this IC is suitable for ultra-thin applications, reducing overall device thickness.

Width: 3.5 mm

The compact width allows for more efficient PCB layouts and is ideal for space-constrained designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is crucial for stabilizing power supplies in various electronic applications.

Minimum Supply Voltage (Vsup): 4.3 V

A minimum supply voltage of 4.3V enhances the product's flexibility with systems that have slightly lower voltage supply requirements.

Length: 4.5 mm

A length of 4.5 mm contributes to a compact form factor, facilitating integration into small electronic devices.

Nominal Threshold Voltage (V): +1.6V

The adjustable threshold voltage of +1.6V makes this IC a versatile choice for various applications that require different voltage levels.

Maximum Supply Current (Isup): 2.5 mA

The low maximum supply current of 2.5 mA helps in conserving energy, making it suitable for battery-operated devices.

No. of Channels: 4

Having 4 channels enables concurrent power management for multiple components, enhancing system efficiency.

Terminal Form: NO LEAD

The no-lead terminal form ensures a high level of performance with reduced parasitic inductance, beneficial in high-speed applications.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for compact design and efficient space utilization on PCBs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures the device can handle slight voltage spikes, providing robustness in operation.

Adjustable Threshold: YES

The adjustable threshold feature allows customization for specific application needs, providing enhanced functionality in design.

Technical Specifications

Power Management ICs STPMIC02TR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XQCC-N24

Length:

4.5 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.6V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

STPMIC02TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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