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STPMIC02

STMicroelectronics

STPMIC02 by STMicroelectronics

STPMIC02 from STMicroelectronics is a versatile power management IC with a nominal voltage of 5V and supports up to 4 channels. It operates b/w -10 °C to 85 °C, featuring a compact design (3.5mm x 4.5mm) for efficient thermal management. Ideal for applications requiring adjustable thresholds and low supply current (2.5mA).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,900 parts In-Stock

1+ parts

-

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4,900

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Anansix

USA . 525 parts In-Stock

1+ parts

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525

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Vyrian

USA . 214 parts In-Stock

1+ parts

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214

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,180 parts In-Stock

1+ parts

$18.953

100+ parts

-

1k+ parts

$17.058

10k+ parts

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2,180

$18.953

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$17.058

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MKK Technologies

India . 322 parts In-Stock

1+ parts

$35.640

100+ parts

-

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322

$35.640

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DigiPath Technology Company

USA . 322 parts In-Stock

1+ parts

$35.640

100+ parts

-

1k+ parts

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10k+ parts

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322

$35.640

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Corphita

USA . 4,764 parts In-Stock

1+ parts

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4,764

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Parana Technologies

USA . 363 parts In-Stock

1+ parts

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100+ parts

$22.661

1k+ parts

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363

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$22.661

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Overview

Unlock unparalleled power management with the STPMIC02 from STMicroelectronics, a leader in innovation and reliability. This advanced IC is designed for seamless integration in your projects, delivering efficiency and stability across multiple applications. Its sleek design ensures minimal footprint without compromising performance, making it perfect for compact devices. Elevate your product's capabilities with a trusted partner that prioritizes quality, and experience the benefits of superior energy management today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for compact design and easy integration into modern PCB layouts, making the product suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB while providing efficient heat dissipation.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V makes this IC compatible with a wide range of electronic devices and systems.

No. of Terminals: 24

Having 24 terminals ensures that multiple functionalities can be integrated, enhancing circuit design flexibility.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This style provides efficient thermal management and a low profile, suitable for modern compact devices.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature ensures reliable performance in harsh environments.

Minimum Operating Temperature: -10 °C

The ability to operate at low temperatures makes this IC suitable for outdoor and refrigeration applications.

Terminal Position: QUAD

Quad terminal positioning enhances connectivity and facilitates the integration of higher pin counts in a compact format.

Maximum Seated Height: 0.9 mm

A low seated height allows for a slimmer overall profile, making it ideal for applications that require thin designs.

Width: 3.5 mm

A narrow width enables higher density layouts on PCBs, making efficient use of available space.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC can effectively regulate and stabilize power for various electronic applications.

Minimum Supply Voltage (Vsup): 4.3 V

The minimum supply voltage allows for reliable operation even under lower voltage conditions, enhancing versatility.

Length: 4.5 mm

A compact length contributes to space savings on PCBs, supporting smaller device designs.

Nominal Threshold Voltage (V): +1.6V

This threshold voltage allows for precise regulation, making it a good option for sensitive power management applications.

Maximum Supply Current (Isup): 2.5 mA

A low maximum supply current minimizes the power consumption, making it suitable for battery-operated devices.

No. of Channels: 4

Having four channels enables multiple outputs, allowing for complex power management needs in a single IC.

Terminal Form: NO LEAD

No lead terminals reduce the overall footprint and improve manufacturing flexibility with surface-mount technology.

Terminal Pitch: 0.5 mm

A smaller terminal pitch allows for higher density circuit designs, making it apt for complex electronic systems.

Maximum Supply Voltage (Vsup): 5.5 V

This range in maximum supply voltage allows for greater flexibility in power supply options.

Adjustable Threshold: YES

The adjustable threshold feature provides customization options for specific circuit requirements, enhancing design flexibility.

Technical Specifications

Power Management ICs STPMIC02 attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-XQCC-N24

Length:

4.5 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.9 mm

Maximum Supply Current (Isup):

2.5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

+1.6V

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.5 mm

Trade Compliance

STPMIC02 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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