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STP5NK40Z

STMicroelectronics

STP5NK40Z by STMicroelectronics

STP5NK40Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 400V breakdown voltage, 12A max pulsed drain current, and operates at up to 150 °C. Ideal for efficient power management in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,900 parts In-Stock

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5,900

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Digiode

USA . 3,204 parts In-Stock

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3,204

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Anansix

USA . 2,386 parts In-Stock

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2,386

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Zilex Electronics Inc.

Canada . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,216 parts In-Stock

1+ parts

$1.390

100+ parts

-

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$1.251

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1,216

$1.390

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$1.251

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MKK Technologies

India . 2,164 parts In-Stock

1+ parts

$2.614

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2,164

$2.614

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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$2.614

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2,164

$2.614

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AZTECH Wire

Italy . 769 parts In-Stock

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$17.130

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769

$17.130

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Alle Elektronik GmbH

Germany . 3,270 parts In-Stock

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3,270

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Parana Technologies

USA . 1,102 parts In-Stock

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$1.662

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1,102

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$1.662

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Corphita

USA . 202 parts In-Stock

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202

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 34 parts In-Stock

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34

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Overview

Unlock the power of innovation with the STP5NK40Z from STMicroelectronics, a leader in the semiconductor industry renowned for quality and reliability. This N-channel Power FET is designed for efficient switching applications, delivering enhanced performance that meets the demands of modern electronics. With its robust design and high breakdown voltage, this transistor ensures longevity and stability in various applications, providing unmatched value and efficiency for your projects. Experience superior quality and performance that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package enhances durability and reduces susceptibility to environmental damage.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for higher efficiency and lower on-resistance, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration into circuits, enhancing protection and simplifying design.

Transistor Application: SWITCHING

Optimized for switching applications, this FET provides fast response times and efficient control over power management.

Minimum DS Breakdown Voltage: 400 V

A high breakdown voltage means this component can handle higher voltages safely, making it suitable for robust applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space usage on circuit boards, providing easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer superior mechanical strength, making the component more reliable under varying conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide better performance in low-voltage applications, enabling energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 12 A

The ability to handle 12 A in pulsed conditions makes this FET suitable for applications requiring high short-term current.

Avalanche Energy Rating (EAS): 130 mJ

An avalanche energy rating of 130 mJ indicates robustness against transient failures, increasing reliability in unpredictable conditions.

Maximum Drain Current (Abs) (ID): 3 A

A maximum continuous drain current of 3 A allows for versatility in various applications without overheating.

No. of Terminals: 3

With three terminals, this FET is easy to integrate into standard circuits, simplifying design and assembly.

Maximum Power Dissipation (Abs): 45 W

A power dissipation rating of 45 W allows this FET to manage significant power loads, enhancing its efficiency in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides secure and stable mounting options, contributing to the overall reliability of the assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures low gate drive power and high-speed switching, making it suitable for modern electronics.

Maximum Operating Temperature: 150 °C

A high operating temperature of 150 °C ensures reliable performance even in harsh environments, extending the component’s lifespan.

Transistor Element Material: SILICON

Silicon offers good thermal conductivity and efficiency, ensuring that the FET performs optimally within specified limits.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides better corrosion resistance, ensuring long-lasting connections.

Maximum Drain Current (ID): 3 A

This figure reinforces the versatility of the FET for applications that require moderate current handling without thermal issues.

Maximum Drain-Source On Resistance: 1.8 ohm

A low on-resistance of 1.8 ohms reduces power losses during operation, improving overall circuit efficiency.

Terminal Position: SINGLE

A single terminal position simplifies layout and integration into circuits, aiding in the design process.

Technical Specifications

Power Field Effect Transistors (FET) STP5NK40Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

130 mJ

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

1.8 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP5NK40Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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