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STP5NB60

STMicroelectronics

STP5NB60 by STMicroelectronics

STP5NB60 by STMicroelectronics is a N-CHANNEL FET with 600V DS breakdown voltage, 20A IDM, and 2 ohm RDS(on). It's used for switching applications in enhancement mode with a max power dissipation of 100W.

Median Price

$0.830

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,008 parts In-Stock

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7,008

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Digiode

USA . 3,263 parts In-Stock

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3,263

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ComSIT Distribution GmbH

Germany . 580 parts In-Stock

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580

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Halfin

Belgium . 400 parts In-Stock

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400

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Micros

Poland . 299 parts In-Stock

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$0.830

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$0.360

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$0.360

299

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$0.830

$0.360

$0.360

Partservice

France . 299 parts In-Stock

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-

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$0.820

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$0.357

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$0.357

299

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$0.820

$0.357

$0.357

Micros sp.j. W. Kędra i J. Lic

Poland . 299 parts In-Stock

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-

100+ parts

$0.879

1k+ parts

$0.382

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$0.382

299

-

$0.879

$0.382

$0.382

Anansix

USA . 132 parts In-Stock

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PC Components Company LLC

USA . 66 parts In-Stock

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Bristol Electronics

USA . 66 parts In-Stock

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MISTER SPROCKETS

USA . 9 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 819 parts In-Stock

1+ parts

$1.754

100+ parts

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$1.579

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819

$1.754

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$1.579

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MKK Technologies

India . 109 parts In-Stock

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$3.299

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109

$3.299

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DigiPath Technology Company

USA . 109 parts In-Stock

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$3.299

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109

$3.299

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AZTECH Wire

Italy . 963 parts In-Stock

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$18.530

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$18.530

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Corphita

USA . 4,048 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,875 parts In-Stock

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3,875

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Parana Technologies

USA . 401 parts In-Stock

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$2.098

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Assy Fe

Spain . 399 parts In-Stock

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Kepictronics

USA . 190 parts In-Stock

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Infinite Electronics LLP (Excess)

. 106 parts In-Stock

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Overview

Discover the STP5NB60 by STMicroelectronics, a high-quality Power Field Effect Transistor designed for various switching applications. With its N-CHANNEL configuration and built-in diode, this transistor offers enhanced performance and reliability. The 600V DS Breakdown Voltage ensures efficient power management while the 20A Maximum Pulsed Drain Current allows for robust operation. Trust in STMicroelectronics' expertise in semiconductor technology to deliver unmatched value and benefits to your projects. Experience the superior quality and versatility of the STP5NB60 for all your power switching needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds compared to P-channel transistors, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient circuit design, saving space and reducing the need for extra components.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast and efficient operation in control circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications with reliability and safety.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit boards or systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a strong and reliable connection, suitable for applications where stability is crucial.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control and efficiency in switching applications, making this FET a reliable choice for such functions.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current rating allows for handling of short-term power surges or spikes, ensuring reliable performance in demanding operating conditions.

Avalanche Energy Rating (EAS): 300 mJ

The high avalanche energy rating makes this FET suitable for applications where the device may experience high-energy pulses or spikes, providing protection against such events.

Maximum Drain Current (Abs) (ID): 5 A

The high maximum drain current rating allows for handling of continuous current flow, ensuring reliable performance in high-power applications.

No. of Terminals: 3

With three terminals, this FET provides versatility in circuit design and integration.

Maximum Power Dissipation (Abs): 100 W

The high power dissipation rating allows for efficient heat management and reliable operation in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures easy mounting and secure attachment to heat sinks or other components for thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high performance and reliability in FETs, making this product a suitable choice for demanding applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures without compromising performance, making it suitable for harsh environments.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, offering high performance and durability for long-lasting operation.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and ensures reliable electrical connections, making this FET suitable for long-term use.

Maximum Drain-Source On Resistance: 2 ohm

Low drain-source on resistance helps minimize power loss and heat generation in the FET, ensuring efficient operation in power management applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and integration, making this FET easy to use in various applications.

Technical Specifications

Power Field Effect Transistors (FET) STP5NB60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP5NB60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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