Loading...

STP5N95K3

STMicroelectronics

STP5N95K3 by STMicroelectronics

STP5N95K3 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 950V breakdown voltage, 16A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,732

-

-

-

-

Pegasus Components GmbH

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,800

-

-

-

-

Anansix

USA . 1,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,718

-

-

-

-

Digiode

USA . 475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

475

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

429

-

-

-

-

Bristol Electronics

USA . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

429

-

-

-

-

Dan-Mar Components

USA . 429 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

429

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 864 parts In-Stock

1+ parts

$1.328

100+ parts

-

1k+ parts

$1.195

10k+ parts

-

864

$1.328

-

$1.195

-

MKK Technologies

India . 1,043 parts In-Stock

1+ parts

$2.496

100+ parts

-

1k+ parts

-

10k+ parts

-

1,043

$2.496

-

-

-

DigiPath Technology Company

USA . 1,043 parts In-Stock

1+ parts

$2.496

100+ parts

-

1k+ parts

-

10k+ parts

-

1,043

$2.496

-

-

-

AZTECH Wire

Italy . 482 parts In-Stock

1+ parts

$11.080

100+ parts

-

1k+ parts

-

10k+ parts

-

482

$11.080

-

-

-

Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

Parana Technologies

USA . 1,458 parts In-Stock

1+ parts

-

100+ parts

$1.587

1k+ parts

-

10k+ parts

-

1,458

-

$1.587

-

-

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Perfect Parts

USA . 687 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

687

-

-

-

-

Corphita

USA . 129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

129

-

-

-

-

Overview

Unlock the power of efficiency with the STP5N95K3 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET combines exceptional quality with outstanding performance, ideal for switching applications in various industries. Experience the benefits of advanced technology that ensures reliability and longevity, making your projects not only more efficient but also more cost-effective. Elevate your designs with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material ensures durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer higher efficiency and lower on-resistance, making them ideal for applications requiring fast switching and high power.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides protection against reverse voltage conditions.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is proficient in handling high-frequency signals, improving overall circuit performance.

Minimum DS Breakdown Voltage: 950 V

A high breakdown voltage enhances reliability in applications involving high-voltage power management.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs, facilitating streamlined design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical support and ensure robust electrical connections in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for improved control of current flow, making it suitable for low-power to high-power applications.

Maximum Pulsed Drain Current (IDM): 16 A

A high pulsed drain current rating enables the device to handle short bursts of high current, beneficial for surge applications.

Avalanche Energy Rating (EAS): 100 mJ

The avalanche energy rating indicates robustness against destructive transients, enhancing circuit protection.

Maximum Drain Current (Abs) (ID): 4 A

A maximum drain current rating of 4 A is suitable for medium-power applications, promising reliable performance in typical use cases.

No. of Terminals: 3

The compact design with three terminals simplifies integration into various circuit configurations.

Maximum Power Dissipation (Abs): 90 W

With a maximum power dissipation of 90 W, the FET can efficiently manage heat, improving operational reliability.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure installation, making it suitable for both panel and chassis mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, making this FET suitable for analog and digital applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C makes this FET suitable for high-temperature environments, expanding application versatility.

Transistor Element Material: SILICON

Silicon as the element material ensures good electrical properties and thermal stability, stabilizing performance across a range of conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and prevents corrosion, leading to a longer lifespan in various environments.

Maximum Drain Current (ID): 4 A

Reiterating its versatility, the 4 A maximum drain current rating allows this FET to perform well in intermediate power applications.

Maximum Drain-Source On Resistance: 3.5 ohm

A low on-resistance of 3.5 ohms minimizes power loss during operation, enhancing overall energy efficiency.

Terminal Position: SINGLE

Having a single terminal position simplifies layout and routing on PCBs, making design processes more straightforward.

Technical Specifications

Power Field Effect Transistors (FET) STP5N95K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

950 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

16 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP5N95K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20