Loading...

STP30NM60ND

STMicroelectronics

STP30NM60ND by STMicroelectronics

STP30NM60ND by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 100A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,192

-

-

-

-

Digiode

USA . 685 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

685

-

-

-

-

Anansix

USA . 505 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

505

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 429 parts In-Stock

1+ parts

$0.341

100+ parts

-

1k+ parts

$0.307

10k+ parts

-

429

$0.341

-

$0.307

-

MKK Technologies

India . 661 parts In-Stock

1+ parts

$0.642

100+ parts

-

1k+ parts

-

10k+ parts

-

661

$0.642

-

-

-

DigiPath Technology Company

USA . 661 parts In-Stock

1+ parts

$0.642

100+ parts

-

1k+ parts

-

10k+ parts

-

661

$0.642

-

-

-

AZTECH Wire

Italy . 268 parts In-Stock

1+ parts

$22.060

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$22.060

-

-

-

Alle Elektronik GmbH

Germany . 4,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

-

-

-

-

Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

-

100+ parts

$0.408

1k+ parts

-

10k+ parts

-

1,612

-

$0.408

-

-

Corphita

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

-

-

-

-

Overview

Elevate your power management solutions with the STP30NM60ND from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET is designed for superior switching performance, ensuring efficiency and reliability in diverse applications like power supplies, motor drives, and automotive systems. With its robust construction and built-in diode, you gain unmatched durability and ease of integration, making it an ideal choice for engineers seeking quality and value in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material contributes to the product's durability and lightweight design, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance, which allows for efficient switching and reduced power loss during operation.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the FET's functionality by providing reverse protection, improving reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET effectively manages high-speed operations, excellent for power management tasks.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage maximizes circuit reliability and expands usage in higher voltage applications, ensuring robust performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy layout and integration into circuits, optimizing space in PCB designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and ease of soldering, making assembly straightforward and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control of the FET's switching characteristics, offering improved performance in various applications.

Maximum Pulsed Drain Current (IDM): 100 A

The capability to handle high pulsed drain currents enables flexibility in power applications, allowing for short-term high load conditions.

Avalanche Energy Rating (EAS): 900 mJ

A robust avalanche energy rating indicates resilience to energy spikes, making this FET reliable in transient conditions.

Maximum Drain Current (Abs) (ID): 25 A

The ability to support a maximum drain current of 25 A makes this FET suitable for a wide range of power applications.

No. of Terminals: 3

Having 3 terminals simplifies the integration into circuits while maintaining the necessary functionality for effective operation.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability allows the FET to operate effectively without overheating, improving lifespan and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides a secure mounting option, ensuring stability and ease of thermal management in applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high input impedance and low power consumption, enhancing efficiency in electronic devices.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows reliable performance even in extreme environments, making it versatile for various conditions.

Transistor Element Material: SILICON

Silicon as the primary material contributes to effective performance and thermal stability, ensuring dependable operation in different scenarios.

Maximum Drain Current (ID): 25 A

Having a maximum drain current rating of 25 A allows for flexibility in a variety of applications, from low to moderate power levels.

Maximum Drain-Source On Resistance: 0.385 ohm

A low on-resistance minimizes power loss during operation, enhancing efficiency and performance in power applications.

Terminal Position: SINGLE

The single terminal position simplifies the circuit design, making it easier to implement within existing layouts.

Technical Specifications

Power Field Effect Transistors (FET) STP30NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.385 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP30NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20