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STP30NM60N

STMicroelectronics

STP30NM60N by STMicroelectronics

STP30NM60N from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 100A max pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,947 parts In-Stock

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Digiode

USA . 1,061 parts In-Stock

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Anansix

USA . 482 parts In-Stock

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482

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ComSIT Distribution GmbH

Germany . 85 parts In-Stock

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IDEA Electronic Components Group

UK . 415 parts In-Stock

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$1.329

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$1.196

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415

$1.329

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$1.196

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MKK Technologies

India . 1,243 parts In-Stock

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$2.500

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$2.500

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DigiPath Technology Company

USA . 1,243 parts In-Stock

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$2.500

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$2.500

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AZTECH Wire

Italy . 636 parts In-Stock

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$8.260

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636

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,358 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,942 parts In-Stock

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Corphita

USA . 4,203 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,039 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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Perfect Parts

USA . 507 parts In-Stock

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Parana Technologies

USA . 102 parts In-Stock

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$1.590

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$1.590

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Overview

Elevate your power management solutions with the STP30NM60N from STMicroelectronics, a leading innovator in semiconductor technology. This N-channel MOSFET delivers exceptional reliability and efficiency for demanding applications like renewable energy systems, motor controls, and industrial automation. With robust performance, including a 600V breakdown voltage and built-in diode, this FET ensures seamless operation while maximizing energy savings. Trust in STMicroelectronics to power your next project with quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides excellent durability and resistance to environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower on-resistance and higher efficiency than P-channel types, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against back EMF, making this FET suitable for inductive load applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently toggle states, enabling faster circuit operation.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage allows the FET to safely operate in high-voltage applications without the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape provides ease of placement on PCBs, optimizing space and layout efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals enhance the mechanical stability of the component, making it suitable for environments with high vibration.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate voltages and reduced power consumption, which is critical for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 100 A

The high pulsed drain current capability makes this FET ideal for applications requiring brief bursts of high current.

Avalanche Energy Rating (EAS): 900 mJ

This rating indicates excellent capability to handle energy transients, enhancing reliability in the face of voltage spikes.

Maximum Drain Current (Abs) (ID): 25 A

With a maximum drain current of 25 A, this FET can handle substantial loads, catering to a wide range of power applications.

No. of Terminals: 3

A 3-terminal design simplifies layout and connections in circuits, facilitating easier integration.

Maximum Power Dissipation (Abs): 190 W

High power dissipation capability ensures that the FET can operate without overheating, leading to enhanced performance and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides secure mounting options, enhancing thermal management and minimizing the risk of mechanical failure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high input impedance and low power consumption, making this FET perfect for a variety of low-power applications.

Maximum Operating Temperature: 150 °C

A high operating temperature tolerance ensures reliability in harsh environments, making this FET suitable for industrial applications.

Transistor Element Material: SILICON

Silicon-based elements lend inherent stability and reliability, ensuring consistent performance across various applications.

Maximum Drain Current (ID): 25 A

Reiterating its suitability for substantial load applications, this maximum drain current rating supports efficient power management.

Maximum Drain-Source On Resistance: 0.13 ohm

Low on-resistance minimizes power losses during operation, enhancing overall efficiency in applications.

Terminal Position: SINGLE

Single terminal positioning simplifies wiring and installation, making it user-friendly for designers and engineers.

Technical Specifications

Power Field Effect Transistors (FET) STP30NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP30NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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