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STP25N10F7

STMicroelectronics

STP25N10F7 by STMicroelectronics

STP25N10F7 by STMicroelectronics is a N-CHANNEL FET with 100V DS breakdown voltage, 25A ID, and 0.035 ohm RDS(on). It's used for switching applications in enhancement mode with 100A IDM. Operating temp ranges from -55 to 175 °C.

Median Price

$1.410

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$0.384

100+ parts

$0.377

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-

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1

$0.384

$0.377

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Chip1Stop

Japan . 1,620 parts In-Stock

1+ parts

-

100+ parts

$1.410

1k+ parts

$1.050

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-

1,620

-

$1.410

$1.050

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Verical

USA . 1,620 parts In-Stock

1+ parts

-

100+ parts

$1.510

1k+ parts

$1.130

10k+ parts

-

1,620

-

$1.510

$1.130

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Avnet

USA . 200 parts In-Stock

1+ parts

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200

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Digiode

USA . 2,471 parts In-Stock

1+ parts

$0.365

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2,471

$0.365

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Vyrian

USA . 5,399 parts In-Stock

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5,399

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Anansix

USA . 2,010 parts In-Stock

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2,010

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Distributors (Availability)

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Corphita

USA . 890 parts In-Stock

1+ parts

$0.346

100+ parts

-

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890

$0.346

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IDEA Electronic Components Group

UK . 1,611 parts In-Stock

1+ parts

$1.111

100+ parts

-

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$1.000

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-

1,611

$1.111

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$1.000

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MKK Technologies

India . 1,164 parts In-Stock

1+ parts

$2.090

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1,164

$2.090

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DigiPath Technology Company

USA . 1,164 parts In-Stock

1+ parts

$2.090

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1,164

$2.090

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AZTECH Wire

Italy . 271 parts In-Stock

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$8.490

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271

$8.490

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Microchip USA

USA . 4,447 parts In-Stock

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$9.295

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4,447

$9.295

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RC Electronics

USA . 53,684 parts In-Stock

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53,684

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Epart123

USA . 15,000 parts In-Stock

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Perfect Parts

USA . 4,896 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,232 parts In-Stock

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3,232

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Kepictronics

USA . 2,560 parts In-Stock

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2,560

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Parana Technologies

USA . 1,275 parts In-Stock

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100+ parts

$1.329

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1,275

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$1.329

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Eastek

USA . 500 parts In-Stock

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500

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Unlock the power of innovation with the STP25N10F7 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Power Field Effect Transistors designed for switching applications. With a minimum DS Breakdown Voltage of 100V and a maximum Pulsed Drain Current of 100A, this N-CHANNEL transistor offers unparalleled performance and reliability. Whether you're working on industrial automation, motor control, or power supplies, the STP25N10F7 provides the efficiency and precision you need to bring your projects to life. Trust STMicroelectronics to deliver cutting-edge technology that empowers your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the transistor lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making this transistor a good choice for power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient power control and management.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 100 A

Capable of handling high pulsed drain currents, making it suitable for applications that require periodic high power outputs.

Maximum Power Dissipation (Abs): 50 W

With a high power dissipation capability of 50W, this transistor can effectively dissipate heat generated during operation, ensuring reliability.

Maximum Operating Temperature: 175 °C

Capable of operating at high temperatures, making it suitable for industrial and automotive applications where temperature extremes may be encountered.

Maximum Drain Current (ID): 25 A

With a maximum drain current of 25A, this transistor can handle high continuous currents, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.035 ohm

Low on-resistance results in lower power dissipation and higher efficiency, making this transistor an ideal choice for power applications.

Maximum Feedback Capacitance (Crss): 19 pF

Low feedback capacitance ensures stable operation and minimal switching losses, making this transistor efficient for high-frequency applications.

Technical Specifications

Power Field Effect Transistors (FET) STP25N10F7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

19 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP25N10F7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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