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STP24N65M2

STMicroelectronics

STP24N65M2 by STMicroelectronics

STP24N65M2 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 16A max drain current, and operates at temperatures up to 150 °C. Ideal for high-efficiency power management solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,339 parts In-Stock

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5,339

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Digiode

USA . 2,338 parts In-Stock

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2,338

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Anansix

USA . 2,313 parts In-Stock

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2,313

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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ComSIT Distribution GmbH

Germany . 750 parts In-Stock

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750

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 114 parts In-Stock

1+ parts

$1.218

100+ parts

-

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$1.096

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114

$1.218

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$1.096

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MKK Technologies

India . 1,326 parts In-Stock

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$2.291

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1,326

$2.291

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DigiPath Technology Company

USA . 1,326 parts In-Stock

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$2.291

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1,326

$2.291

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AZTECH Wire

Italy . 908 parts In-Stock

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$11.240

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908

$11.240

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Alle Elektronik GmbH

Germany . 3,679 parts In-Stock

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3,679

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Corphita

USA . 2,710 parts In-Stock

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2,710

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Perfect Parts

USA . 1,400 parts In-Stock

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Parana Technologies

USA . 1,245 parts In-Stock

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$1.456

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$1.456

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock exceptional performance with the STP24N65M2 from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET guarantees high reliability and efficiency in demanding applications like motor drives and renewable energy systems. With its robust design and built-in diode, it ensures seamless operation even under extreme conditions. Trust in STMicroelectronics' commitment to quality for superior performance that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good thermal stability and durability, making the product suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their higher electron mobility, allowing for faster switching speeds, making this product efficient for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances safety and functionality, enabling the device to handle reverse voltage and protect against voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET is ideal for power control, enhancing the efficiency of power management systems.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage makes this product suitable for applications requiring high voltage operation, ensuring reliability in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various circuits and PCB layouts, maximizing space efficiency.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and are ideal for high-power applications, ensuring good solder joints.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower on-resistance and improved efficiency, making it suitable for high-performance applications.

Maximum Pulsed Drain Current (IDM): 64 A

The capability to handle high pulsed drain currents makes this FET suitable for applications with high transient load requirements.

Avalanche Energy Rating (EAS): 650 mJ

A high avalanche energy rating ensures that the device can withstand energy surges without failure, providing additional reliability.

Maximum Drain Current (Abs) (ID): 16 A

With a maximum drain current of 16 A, this FET is robust enough for many power applications while maintaining thermal efficiency.

No. of Terminals: 3

The three-terminal design simplifies integration and reduces circuit complexity, which is beneficial for streamlined designs.

Maximum Power Dissipation (Abs): 150 W

A maximum power dissipation rating of 150 W allows this FET to operate efficiently under high-load conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mounting provides secure installation and enhances thermal management, making it suitable for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers low power consumption and high input impedance, making this FET more efficient for various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for use in high-heat environments, adding versatility to the range of possible applications.

Transistor Element Material: SILICON

Silicon as the material offers excellent thermal performance and reliability, ensuring longevity and consistent operation.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature expands application possibilities in extreme environments, ensuring reliability in harsh conditions.

Maximum Drain Current (ID): 16 A

Ensures reliable performance under load with consistent current handling, making it a solid choice for power switching applications.

Maximum Drain-Source On Resistance: 0.23 ohm

A low on-resistance value minimizes power loss during operation, thereby improving efficiency and reducing thermal stress on the device.

Terminal Position: SINGLE

A single terminal position simplifies connections and layout design, enhancing the ease of integration into electronic circuits.

Case Connection: DRAIN

Having the drain as the case connection improves thermal performance and facilitates better heat dissipation, critical for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP24N65M2 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

650 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

16 A

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.23 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

64 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP24N65M2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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