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STP180N55F3

STMicroelectronics

STP180N55F3 by STMicroelectronics

STP180N55F3 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, breakdown voltage of 55 V, and power dissipation up to 330 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Vyrian

USA . 2,950 parts In-Stock

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Anansix

USA . 2,811 parts In-Stock

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Digiode

USA . 2,358 parts In-Stock

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Microfarads

USA . 128 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 55 parts In-Stock

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Bristol Electronics

USA . 55 parts In-Stock

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Dan-Mar Components

USA . 55 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 282 parts In-Stock

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$0.323

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$0.291

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MKK Technologies

India . 284 parts In-Stock

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$0.607

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DigiPath Technology Company

USA . 284 parts In-Stock

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Component Stockers USA

USA . 2,440 parts In-Stock

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$0.660

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$0.950

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$0.930

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AZTECH Wire

Italy . 723 parts In-Stock

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$10.090

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Alle Elektronik GmbH

Germany . 4,223 parts In-Stock

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Corphita

USA . 2,707 parts In-Stock

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Parana Technologies

USA . 1,595 parts In-Stock

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Perfect Parts

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Kepictronics

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Overview

Unlock the potential of your designs with the STP180N55F3 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel power FET excels in switching applications, delivering robust reliability and efficiency for demanding tasks. With its advanced technology and built-in diode, it ensures seamless operation in diverse environments. Elevate your projects with unmatched quality and performance—choose STMicroelectronics for excellence you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and better performance in many switching applications, making this product efficient.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against reverse polarity and improves reliability in various circuit designs.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control larger currents, suitable for power management tasks.

Minimum DS Breakdown Voltage: 55 V

A breakdown voltage of 55 V provides a solid safety margin for applications requiring reliable operation under high voltage conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement on PCBs, optimizing space and simplifying assembly processes.

Terminal Form: THROUGH-HOLE

Through-hole terminal form ensures strong mechanical support and stable connections, making it ideal for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables better control over the current flow in the device, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 480 A

With a maximum pulsed drain current of 480 A, this FET is capable of handling high transient currents, suitable for demanding applications.

Avalanche Energy Rating (EAS): 1000 mJ

An avalanche energy rating of 1000 mJ signifies robust protection against voltage spikes, increasing reliability in power circuits.

Maximum Drain Current (Abs) (ID): 120 A

The maximum drain current of 120 A allows for the handling of substantial loads, making this FET ideal for high-power applications.

No. of Terminals: 3

Having three terminals simplifies the circuit design, providing easy integration into various electronic systems.

Maximum Power Dissipation (Abs): 330 W

A high power dissipation capability of 330 W allows for efficient heat management, establishing reliability in high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides excellent thermal conductivity and mechanical stability, ensuring the FET remains secure during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers superior switching speeds and efficiency, enhancing overall circuit performance and power management.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures reliable performance even in high-temperature environments, expanding application versatility.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties, ensuring performance and reliability in diverse applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish enhances solderability and corrosion resistance, ensuring long-lasting electrical connections.

Maximum Drain-Source On Resistance: 0.0038 ohm

A low on-resistance of 0.0038 ohm minimizes power loss and improves efficiency during operation, ideal for power applications.

Terminal Position: SINGLE

Single terminal positioning simplifies the PCB layout and installation, making integration straightforward in various designs.

Technical Specifications

Power Field Effect Transistors (FET) STP180N55F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1000 mJ

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP180N55F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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