Loading...

STP16NK60Z

STMicroelectronics

STP16NK60Z by STMicroelectronics

STP16NK60Z from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain-source voltage of 620V, supports up to 14A continuous current, and dissipates up to 190W. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,083

-

-

-

-

Anansix

USA . 545 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

545

-

-

-

-

Digiode

USA . 92 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

92

-

-

-

-

Vectronix, Inc

USA . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,250 parts In-Stock

1+ parts

$1.201

100+ parts

-

1k+ parts

$1.081

10k+ parts

-

1,250

$1.201

-

$1.081

-

MKK Technologies

India . 868 parts In-Stock

1+ parts

$2.258

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$2.258

-

-

-

DigiPath Technology Company

USA . 868 parts In-Stock

1+ parts

$2.258

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$2.258

-

-

-

AZTECH Wire

Italy . 1,090 parts In-Stock

1+ parts

$20.180

100+ parts

-

1k+ parts

-

10k+ parts

-

1,090

$20.180

-

-

-

A-Z Elektronik GmbH

Germany . 7,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,410

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Perfect Parts

USA . 3,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,540

-

-

-

-

Corphita

USA . 1,797 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,797

-

-

-

-

Alle Elektronik GmbH

Germany . 1,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,582

-

-

-

-

Kepictronics

USA . 482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

482

-

-

-

-

Parana Technologies

USA . 128 parts In-Stock

1+ parts

-

100+ parts

$1.436

1k+ parts

-

10k+ parts

-

128

-

$1.436

-

-

Overview

Unlock unparalleled performance with the STP16NK60Z from STMicroelectronics, a trusted leader in semiconductor innovation. This robust N-channel power FET is designed for seamless switching applications, delivering exceptional reliability and efficiency. With its superior build quality and advanced features, it excels in high-voltage environments, making it ideal for industrial control, automotive systems, and renewable energy solutions. Elevate your projects with ST's commitment to excellence and enjoy unmatched durability and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and cost-effective housing for the device, ensuring durability and ease of integration into various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically offer lower on-resistance and higher efficiency, making them ideal for power applications requiring fast switching and high power density.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode offers protection against back EMF and enhances the reliability of the switching operation, simplifying circuit design.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently handle switching tasks in power supply and motor control circuits.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this FET can operate safely in high voltage applications, providing stability and reliability.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB and supports better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides excellent mechanical strength and is suitable for high-power applications that require stable connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low power consumption in off-state, making it suitable for energy-efficient designs.

Maximum Pulsed Drain Current (IDM): 56 A

A maximum pulsed drain current rating of 56 A enables the FET to handle transient loads efficiently, making it ideal for dynamic applications.

Avalanche Energy Rating (EAS): 360 mJ

The high avalanche energy rating allows for robust performance under fault conditions, providing an additional layer of reliability.

Maximum Drain Current (Abs) (ID): 14 A

With a maximum drain current rating of 14 A, this FET can handle substantial load currents, which is essential for many power applications.

No. of Terminals: 3

The three-terminal configuration simplifies the layout and decreases complexity in circuit design.

Maximum Power Dissipation (Abs): 190 W

The ability to dissipate up to 190 W makes this FET suitable for high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides additional mechanical support and stability, particularly in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance and fast switching capabilities, resulting in lower power losses.

Maximum Operating Temperature: 150 °C

The high operating temperature provides flexibility in thermal management and allows for uses in harsher environments.

Transistor Element Material: SILICON

Silicon-based transistors provide reliable performance and are widely used due to their proven reliability and availability.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Drain Current (ID): 14 A

The maximum drain current rating of 14 A enables the FET to handle substantial loads efficiently, catering to various power applications.

Maximum Drain-Source On Resistance: 0.42 ohm

A low on-resistance of 0.42 ohms minimizes conduction losses, resulting in improved efficiency and thermal performance.

Terminal Position: SINGLE

The single terminal position simplifies the layout and aids in more straightforward component placement on the PCB.

Technical Specifications

Power Field Effect Transistors (FET) STP16NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

360 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.42 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP16NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20