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STP16NF25

STMicroelectronics

STP16NF25 by STMicroelectronics

STP16NF25 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 13 A and a breakdown voltage of 250 V. It operates in enhancement mode with a power dissipation of up to 90 W. This versatile transistor is suitable for various electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,062 parts In-Stock

1+ parts

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2,062

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Digiode

USA . 1,616 parts In-Stock

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1,616

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Anansix

USA . 667 parts In-Stock

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667

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,375 parts In-Stock

1+ parts

$0.593

100+ parts

-

1k+ parts

$0.534

10k+ parts

-

1,375

$0.593

-

$0.534

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MKK Technologies

India . 1,330 parts In-Stock

1+ parts

$1.116

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-

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1,330

$1.116

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DigiPath Technology Company

USA . 1,330 parts In-Stock

1+ parts

$1.116

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1,330

$1.116

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AZTECH Wire

Italy . 1,076 parts In-Stock

1+ parts

$14.260

100+ parts

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1,076

$14.260

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A-Z Elektronik GmbH

Germany . 5,211 parts In-Stock

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5,211

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Alle Elektronik GmbH

Germany . 4,103 parts In-Stock

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4,103

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Corphita

USA . 1,715 parts In-Stock

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1,715

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Parana Technologies

USA . 86 parts In-Stock

1+ parts

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$0.710

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86

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$0.710

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Overview

Unlock the potential of your designs with the STP16NF25 from STMicroelectronics, a leader in innovation and quality. This N-channel Power FET delivers exceptional performance for switching applications, ensuring reliability even under demanding conditions. With its robust construction and high breakdown voltage, it offers unmatched efficiency and durability. Experience seamless integration into diverse projects, from consumer electronics to industrial systems, elevating your solutions to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package ensures lightweight, durable protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance in terms of speed and efficiency, making this transistor ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides additional protection and simplifies circuit design, reducing the need for additional components, thereby saving space and cost.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed operations, making it suitable for power management and conversion.

Minimum DS Breakdown Voltage: 250 V

With a breakdown voltage of 250 V, it can operate safely in high-voltage environments, enhancing its versatility across different applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and handling in PCBs, facilitating better layout options.

Terminal Form: THROUGH-HOLE

Through-hole design ensures strong mechanical support and easy assembly in various circuits, making it user-friendly.

Operating Mode: ENHANCEMENT MODE

Enhanced mode provides improved control over current flow, allowing for better efficiency and performance in electronic circuits.

Maximum Pulsed Drain Current (IDM): 52 A

A high pulsed drain current capacity of 52 A means this FET can handle sudden spikes in current without damage, increasing reliability.

Avalanche Energy Rating (EAS): 100 mJ

An avalanche energy rating of 100 mJ indicates robustness against transient voltage spikes, enhancing safety in fluctuating electrical environments.

Maximum Drain Current (Abs) (ID): 13 A

A maximum drain current rating of 13 A allows this FET to handle substantial power levels, suitable for a range of applications.

No. of Terminals: 3

The 3-terminal design simplifies connections and promotes flexible circuit design while ensuring adequate functional connections.

Maximum Power Dissipation (Abs): 90 W

With the capability to dissipate up to 90 W, this FET can effectively manage heat in demanding applications, enhancing longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for stable mounting on heat sinks, improving thermal management and performance in power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high efficiency and low power loss, making this FET suitable for modern, energy-conscious designs.

Maximum Operating Temperature: 150 °C

With a high operating temperature limit of 150 °C, this FET is durable and suitable for high-temperature environments.

Transistor Element Material: SILICON

Silicon as the material ensures good thermal and electrical properties, providing reliability and effectiveness in power management.

Terminal Finish: TIN

A tin finish improves solderability and corrosion resistance, ensuring reliable connections and longer product life.

Maximum Drain Current (ID): 13 A

This specification is reiterated, showcasing the device's reliability in maintaining consistent performance under load.

Maximum Drain-Source On Resistance: 0.235 ohm

Low on-resistance of 0.235 ohms contributes to lower power losses during operation, enhancing overall energy efficiency.

Terminal Position: SINGLE

Single terminal position allows for straightforward integration in circuits, making it versatile for different layouts.

Case Connection: DRAIN

DRAIN case connection helps in efficient circuit configuration and current flow management, enhancing system performance.

Technical Specifications

Power Field Effect Transistors (FET) STP16NF25 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.235 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

52 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP16NF25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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