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STP16DP05B1R

STMicroelectronics

STP16DP05B1R by STMicroelectronics

STP16DP05B1R from STMicroelectronics is a robust LED display driver designed for automotive applications. It operates within a supply voltage range of 3-5.5V, supports serial data input, and can drive up to 16 segments at temperatures from -40 °C to 125 °C. Its compact design features 24 terminals in an in-line package, ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,382 parts In-Stock

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Anansix

USA . 2,099 parts In-Stock

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2,099

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Digiode

USA . 1,511 parts In-Stock

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1,511

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Distributors (Availability)

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Microchip USA

USA . 249 parts In-Stock

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$2.692

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249

$2.692

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AZTECH Wire

Italy . 365 parts In-Stock

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$8.270

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365

$8.270

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IDEA Electronic Components Group

UK . 789 parts In-Stock

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$12.274

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$11.046

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789

$12.274

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$11.046

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MKK Technologies

India . 116 parts In-Stock

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$23.080

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116

$23.080

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DigiPath Technology Company

USA . 116 parts In-Stock

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$23.080

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116

$23.080

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Kepictronics

USA . 53,992 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Corphita

USA . 4,482 parts In-Stock

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4,482

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Parana Technologies

USA . 1,757 parts In-Stock

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$14.675

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1,757

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$14.675

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Overview

Elevate your display solutions with the STP16DP05B1R from STMicroelectronics, a trusted leader in innovation. This powerful graphics display driver excels in automotive applications, delivering reliability and superior performance even in extreme conditions. With easy serial data input and robust design, it ensures seamless integration into various systems. Enhance your project with a product designed for quality, efficiency, and long-lasting value—because your displays deserve nothing less!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures excellent protection against environmental factors, enhancing the longevity of the display driver.

Display Mode: SEGMENT

Segment display mode is ideal for clear readability, making it suitable for various applications where visibility is crucial.

Data Input Mode: SERIAL

The serial data input mode facilitates simple integration with microcontrollers, allowing for easy communication and control.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for diverse power supply configurations while ensuring safe operation.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, making it easier to design compact electronic devices.

Power Supplies (V): 3.3/5

Supports dual power supply options (3.3V and 5V), allowing compatibility with a wide range of systems and applications.

No. of Terminals: 24

With 24 terminals, this driver supports a comprehensive range of control signals, making it versatile for complex designs.

Package Style (Meter): IN-LINE

The in-line package style simplifies mounting on PCBs and provides efficient space utilization.

Minimum Supply Voltage: 3 V

A low minimum supply voltage of 3 V allows this driver to operate in low-power applications, contributing to energy efficiency.

Maximum Operating Temperature: 125 °C

High maximum operating temperature rating ensures reliable performance in demanding automotive applications.

Minimum Operating Temperature: -40 °C

Suitable for harsh conditions, the minimum operating temperature of -40 °C guarantees reliability even in extreme environments.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and improves reliability of electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, improving integration possibilities.

Maximum Seated Height: 4.32 mm

A compact maximum seated height supports space-constrained designs, ideal for compact devices.

Width: 7.62 mm

Slim width ensures compatibility with various PCB layouts, promoting design efficiency.

Length: 31.75 mm

The optimal length provides sufficient space for robust terminal connections without occupying excessive board area.

Temperature Grade: AUTOMOTIVE

Designed for the automotive industry, this grade assures adherence to stringent reliability standards for automotive applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and robust electrical connections, enhancing durability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V supports modern low-voltage systems, contributing to overall device safety.

No. of Segments: 16

16 segments allow for versatile display configurations, enabling detailed visual output and customized applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy handling and placement on PCBs, simplifying the design process.

Minimum fmax: 30 MHz

A minimum frequency of 30 MHz ensures fast data processing capabilities, making it apt for high-speed applications.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this IC is specifically designed for driving LED segments, ensuring optimal performance and functionality.

Technical Specifications

Graphics Display Drivers STP16DP05B1R attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e3

Length:

31.75 mm

Moisture Sensitivity Level (MSL):

1

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.32 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Minimum fmax:

30 MHz

Trade Compliance

STP16DP05B1R Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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