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STP16CL596XTTR

STMicroelectronics

STP16CL596XTTR by STMicroelectronics

STP16CL596XTTR from STMicroelectronics is a compact LED display driver designed for automotive applications. It operates at a nominal voltage of 3.3V, supports serial data input, and withstands temperatures from -40 °C to 125 °C. With 16 segments and a small outline package, it ensures efficient performance in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,239 parts In-Stock

1+ parts

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5,239

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Anansix

USA . 1,276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,276

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Digiode

USA . 976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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976

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 459 parts In-Stock

1+ parts

$6.513

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$6.513

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-

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IDEA Electronic Components Group

UK . 1,763 parts In-Stock

1+ parts

$9.896

100+ parts

-

1k+ parts

$8.907

10k+ parts

-

1,763

$9.896

-

$8.907

-

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$10.080

100+ parts

-

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857

$10.080

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Ampacity Inc.

Singapore . 728 parts In-Stock

1+ parts

$13.500

100+ parts

-

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728

$13.500

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MKK Technologies

India . 1,895 parts In-Stock

1+ parts

$18.610

100+ parts

-

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10k+ parts

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1,895

$18.610

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DigiPath Technology Company

USA . 1,895 parts In-Stock

1+ parts

$18.610

100+ parts

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1k+ parts

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10k+ parts

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1,895

$18.610

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Corphita

USA . 2,716 parts In-Stock

1+ parts

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2,716

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Parana Technologies

USA . 151 parts In-Stock

1+ parts

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100+ parts

$11.833

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151

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$11.833

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Overview

Elevate your display projects with the STP16CL596XTTR from STMicroelectronics, a leader in innovative technology. Designed for reliability and high performance, this graphics display driver excels in applications ranging from automotive to consumer electronics. Enjoy seamless integration with its compact package and robust temperature range, ensuring optimal functionality even in challenging environments. Trust STMicroelectronics for quality that empowers your designs and enhances user experiences.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and thermal resistance, making the product suitable for varied applications.

Data Input Mode: SERIAL

Serial data input mode simplifies communication with microcontrollers, allowing for straightforward integration into existing systems.

Surface Mount: YES

Being surface mount compatible allows for compact design and easy assembly on PCBs, crucial for space-constrained applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a broad range of digital circuits, providing flexibility in design.

Package Shape: RECTANGULAR

Rectangular packaging maximizes space efficiency and aids in optimal layout on circuit boards.

Power Supplies (V): 3.3

Operating at 3.3V aligns with commonly used logic levels in modern electronics, ensuring compatibility across devices.

No. of Terminals: 24

A higher number of terminals increases connection points, enabling more functionalities or features integrated into the driver.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style contributes to low-profile designs, essential for slim electronic devices without compromising performance.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V allows operation in power-sensitive applications, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

A high operating temperature range makes this driver suitable for automotive and industrial applications where temperature variations are common.

Minimum Operating Temperature: -40 °C

This feature ensures reliable performance in extreme environments, critical for outdoor and automotive use.

Terminal Position: DUAL

Dual terminal positioning aids in versatile orientation and improved soldering processes for assembly.

Maximum Seated Height: 1.2 mm

A low seated height supports compact designs, allowing for more intricate arrangements of components on PCBs.

Width: 4.4 mm

A narrow width aids in saving space on PCBs, making it easier to design compact applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures the product can withstand standard soldering processes without damage, enhancing manufacturability.

Peak Reflow Temperature °C: 260

A high peak reflow temperature allows for compatibility with lead-free solder processes, aligning with environmental regulations.

Length: 7.8 mm

A compact length supports space-efficient design in portable electronics and other applications.

Temperature Grade: AUTOMOTIVE

Recognized for automotive applications, this driver meets stringent quality and reliability criteria for critical systems.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering processes, improving manufacturing efficiency and reliability.

Nominal Supply Voltage: 3.3 V

Working at a nominal supply voltage of 3.3V ensures minimal energy consumption while maintaining performance, vital for battery-operated devices.

No. of Segments: 16

Supporting 16 segments enables the display of complex information with a variety of patterns, enhancing user interface capabilities.

Terminal Pitch: 0.65 mm

A fine terminal pitch allows for densely packed designs, which is essential in modern circuitry layouts.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz ensures fast response times and supports high-speed data rates, critical for interactive applications.

Interface IC Type: LED DISPLAY DRIVER

Specialized as an LED display driver, this IC optimally drives LED arrays, making it perfect for various illumination and display applications.

Technical Specifications

Graphics Display Drivers STP16CL596XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3/e4

Length:

7.8 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CL596XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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