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STP16C596XTTR

STMicroelectronics

STP16C596XTTR by STMicroelectronics

STP16C596XTTR from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates at 4.5-5.5V, supports serial data input, and drives up to 16 segments with a max temp of 125 °C. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

$3.560

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 60 parts In-Stock

1+ parts

$3.560

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60

$3.560

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Vyrian

USA . 7,384 parts In-Stock

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7,384

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Digiode

USA . 4,016 parts In-Stock

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4,016

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Anansix

USA . 2,630 parts In-Stock

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2,630

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J2 Sourcing AB

Sweden . 1,700 parts In-Stock

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1,700

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ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

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500

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Semi Source

USA . 207 parts In-Stock

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207

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PC Components Company LLC

USA . 3 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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3

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 379 parts In-Stock

1+ parts

$5.664

100+ parts

-

1k+ parts

$5.097

10k+ parts

-

379

$5.664

-

$5.097

-

MKK Technologies

India . 327 parts In-Stock

1+ parts

$10.650

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327

$10.650

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DigiPath Technology Company

USA . 327 parts In-Stock

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$10.650

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327

$10.650

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AZTECH Wire

Italy . 316 parts In-Stock

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$22.190

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316

$22.190

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Component Stockers USA

USA . 430 parts In-Stock

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$99.990

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430

$99.990

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Kepictronics

USA . 7,856 parts In-Stock

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7,856

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Microchip USA

USA . 5,631 parts In-Stock

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5,631

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Corphita

USA . 4,753 parts In-Stock

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4,753

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A-Z Elektronik GmbH

Germany . 3,038 parts In-Stock

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3,038

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,202 parts In-Stock

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$6.772

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$6.772

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Perfect Parts

USA . 1,120 parts In-Stock

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1,120

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Cyclops Electronics Ltd (Excess)

UK . 500 parts In-Stock

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500

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Overview

Elevate your display solutions with the STP16C596XTTR from STMicroelectronics, a leader in innovation and reliability. This high-quality graphics display driver seamlessly transforms how you present information, offering exceptional performance even in extreme conditions. Ideal for automotive and consumer applications alike, its compact design and efficient serial data input make integration effortless while ensuring vivid, clear visual output. Trust in STMicroelectronics for cutting-edge technology that enhances your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures reliability and protection against environmental factors.

Display Mode: SEGMENT

The segment display mode provides clear visibility and is suitable for various applications, enhancing user experience.

Data Input Mode: SERIAL

Serial data input enables efficient communication with microcontrollers, simplifying integration and reducing wiring complexity.

Surface Mount: YES

Surface mount technology ensures compact design and easy automated assembly, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for flexible power options without risking device integrity.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on PCBs, promoting better layout designs.

Power Supplies (V): 5

Operating at a standard 5V power supply simplifies design and compatibility with most systems.

No. of Terminals: 24

With 24 terminals, this driver supports a rich interface for connectivity, accommodating complex displays.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style minimizes space while providing necessary thermal management, ideal for high-density designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage requirement of 4.5 V allows for broad compatibility with various power sources.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this driver is suitable for high-performance applications, including automotive.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C makes this driver ideal for use in extreme environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish enhances solderability and provides good conductivity, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning offers versatile mounting options, allowing for improved PCB design flexibility.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm fits well in tight spaces and is suitable for slim profile applications.

Width: 4.4 mm

The compact width of 4.4 mm makes this driver a great choice for applications where space is at a premium.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly, ensuring reliability in manufacturing processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature tolerance of 260 °C ensures it can withstand typical soldering processes.

Length: 7.8 mm

The length of 7.8 mm contributes to a compact footprint, ideal for compact device designs.

Temperature Grade: AUTOMOTIVE

Being rated for automotive use indicates high durability and reliability, making it suitable for critical applications.

Technology: CMOS

CMOS technology enables low power consumption and high efficiency, which is essential in portable devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier inspection and soldering, ensuring high reliability in connections.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with many common electronic systems.

No. of Segments: 16

Supporting up to 16 segments allows for displaying complex information clearly, enhancing user interaction.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compact design and ease of handling during assembly.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz supports fast data refreshing, which is critical for high-performance displays.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, allowing for handling and assembly without special precautions.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this product is essential for efficiently controlling LED matrices, ensuring vibrant displays.

Technical Specifications

Graphics Display Drivers STP16C596XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16C596XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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