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STP16C596M

STMicroelectronics

STP16C596M by STMicroelectronics

STP16C596M from STMicroelectronics is a CMOS LED display driver designed for automotive applications. It operates with a supply voltage of 4.5-5.5V, supports serial data input, and drives up to 16 segments. Its compact SO package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,156 parts In-Stock

1+ parts

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4,156

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Digiode

USA . 1,768 parts In-Stock

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1,768

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Anansix

USA . 948 parts In-Stock

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948

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,145 parts In-Stock

1+ parts

$11.248

100+ parts

-

1k+ parts

$10.123

10k+ parts

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1,145

$11.248

-

$10.123

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Microchip USA

USA . 149 parts In-Stock

1+ parts

$17.748

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-

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149

$17.748

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$17.880

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623

$17.880

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MKK Technologies

India . 1,907 parts In-Stock

1+ parts

$21.151

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1,907

$21.151

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DigiPath Technology Company

USA . 1,907 parts In-Stock

1+ parts

$21.151

100+ parts

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1,907

$21.151

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Component Stockers USA

USA . 545 parts In-Stock

1+ parts

$99.990

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545

$99.990

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Corphita

USA . 2,788 parts In-Stock

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2,788

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Parana Technologies

USA . 2,236 parts In-Stock

1+ parts

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100+ parts

$13.449

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2,236

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$13.449

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Overview

Elevate your graphics display projects with the STP16C596M from STMicroelectronics—where innovation meets reliability. Designed to excel in diverse applications, this robust driver ensures stunning visuals while consuming minimal power, making it ideal for automotive and industrial displays. With a commitment to quality and performance, STMicroelectronics provides unmatched support, empowering you to create cutting-edge solutions that stand out in any environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this driver reliable for various applications.

Display Mode: SEGMENT

Segment display mode is ideal for clear visual representation of digits and symbols, perfect for applications requiring precise information display.

Data Input Mode: SERIAL

Serial data input allows for a simplified connection and integration with microcontrollers, enhancing ease of use and reducing complexity.

Surface Mount: YES

Surface mount technology ensures a compact design, saving space on PCBs and providing more options for product miniaturization.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this driver is safe to use in low-voltage applications, reducing the risk of damage.

Package Shape: RECTANGULAR

The rectangular package shape is conducive for efficient layout on PCBs, optimizing space utilization in device design.

Power Supplies (V): 5

Operating at a standard 5V supply makes it compatible with most electronic systems, ensuring versatility in application.

No. of Terminals: 24

With 24 terminals, this driver offers a rich interface for connectivity, allowing for multiple segment displays and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is designed for compact spaces, making it suitable for portable devices and automotive applications.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V provides flexibility in power sourcing, increasing its usability across various devices.

Maximum Operating Temperature: 125 °C

An operational temperature limit of 125 °C allows this driver to be used in high-temperature environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver ensures reliable functionality in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish provides excellent conductivity and corrosion resistance, enhancing longevity and performance.

Terminal Position: DUAL

Dual terminal positioning facilitates easier PCB layout and better soldering characteristics, improving manufacturing efficiency.

Maximum Seated Height: 2.65 mm

The low seated height allows for a streamlined design, making it suitable for applications where space is at a premium.

Width: 7.5 mm

A compact width of 7.5mm makes this driver well-suited for space-constrained designs, enhancing versatility.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds, this driver can withstand the soldering process without risk of damage, aiding in assembly.

Peak Reflow Temperature °C: 250

The ability to handle peak reflow temperatures of 250 °C ensures compatibility with modern soldering techniques, streamlining production.

Length: 15.4 mm

A length of 15.4mm contributes to its compact form factor, making it an ideal choice for devices where space is limited.

Temperature Grade: AUTOMOTIVE

As an automotive-grade component, this driver meets rigorous standards for reliability and performance in vehicles, ensuring safety and durability.

Technology: CMOS

CMOS technology provides low power consumption and high-speed operation, making this driver efficient for portable and battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and assembly, enhancing manufacturability and ease of repair.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V aligns with common electronic standards, making this driver versatile across various applications.

No. of Segments: 16

With support for 16 segments, this driver enables complex and informative displays, suitable for advanced user interfaces.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27mm allows for precise soldering and better connectivity on PCB layouts, ensuring robust performance.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz guarantees fast operation, enabling quick updates of display content for real-time applications.

Moisture Sensitivity Level (MSL): 3

An MSL level of 3 indicates moderate sensitivity, meaning appropriate handling and storage are needed, but it is still suitable for typical manufacturing environments.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this IC is specifically designed for optimal performance with LED segments, ensuring bright and clear displays.

Technical Specifications

Graphics Display Drivers STP16C596M attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16C596M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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