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STP165N10F4

STMicroelectronics

STP165N10F4 by STMicroelectronics

STP165N10F4 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, a breakdown voltage of 100 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,477 parts In-Stock

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2,477

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Vyrian

USA . 2,129 parts In-Stock

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2,129

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Digiode

USA . 571 parts In-Stock

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571

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IDEA Electronic Components Group

UK . 38 parts In-Stock

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$1.234

100+ parts

-

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$1.110

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38

$1.234

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$1.110

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MKK Technologies

India . 206 parts In-Stock

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$2.320

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206

$2.320

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DigiPath Technology Company

USA . 206 parts In-Stock

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$2.320

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206

$2.320

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AZTECH Wire

Italy . 564 parts In-Stock

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$20.950

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564

$20.950

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RC Electronics

USA . 47,449 parts In-Stock

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47,449

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Kepictronics

USA . 10,000 parts In-Stock

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Corphita

USA . 4,744 parts In-Stock

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4,744

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Alle Elektronik GmbH

Germany . 4,121 parts In-Stock

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4,121

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Perfect Parts

USA . 2,145 parts In-Stock

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2,145

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Parana Technologies

USA . 22 parts In-Stock

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$1.475

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22

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$1.475

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Overview

Unlock unparalleled efficiency with the STP165N10F4 from STMicroelectronics, a leader in semiconductor innovation. This N-channel power FET is engineered for reliability and exceptional performance, making it ideal for high-demand applications like switching power supplies and motor drives. With its robust design and advanced technology, you gain enhanced durability and reduced energy loss, ensuring your projects thrive while maximizing value. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent thermal insulation and is suitable for various environmental conditions, making the FET reliable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are widely used for their efficiency in conducting current, which is suitable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode enhances protection against reverse voltage, making it a safer choice for applications prone to transients.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high frequencies and is ideal for power management systems.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET can handle high voltage applications, ensuring durability and reliability.

Package Shape: RECTANGULAR

The rectangular shape optimizes space efficiency in circuit design, simplifying layout and improving thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide solid mechanical and electrical connections, making the FET suitable for various mounting scenarios.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers improved efficiency and performance in switching applications, allowing for reduced power consumption.

Maximum Pulsed Drain Current (IDM): 480 A

A high pulsed drain current capacity of 480A enables the FET to handle intense momentary loads without failure, ideal for demanding applications.

Maximum Drain Current (Abs) (ID): 120 A

With a maximum drain current of 120A, this FET supports robust power transfer, suitable for high-performance applications.

No. of Terminals: 3

A three-terminal configuration simplifies the design while maintaining functionality, making it easier for integration into circuits.

Maximum Power Dissipation (Abs): 315 W

Ability to dissipate up to 315W of power indicates high thermal handling capability, contributing to overall reliability in power usage.

Package Style (Meter): FLANGE MOUNT

Flange mount style ensures secure attachment to heatsinks, enhancing thermal performance in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides low input power requirements and high-speed operation, desirable for modern electronic applications.

Maximum Operating Temperature: 175 °C

An operating temperature of up to 175 °C signifies the FET's capability to function in high-temperature environments, expanding its application range.

Transistor Element Material: SILICON

The use of silicon ensures good thermal stability and conductivity, a significant advantage in effective power management.

Maximum Drain Current (ID): 120 A

This reinforces the FET's capability to handle high current applications, crucial for efficient power electronics.

Maximum Drain-Source On Resistance: 0.0051 ohm

A low on-resistance of 0.0051 ohms minimizes power losses during operation, resulting in improved efficiency and thermal performance.

Terminal Position: SINGLE

Single terminal positioning allows for straightforward integration into circuits, facilitating easier layout and design considerations.

Technical Specifications

Power Field Effect Transistors (FET) STP165N10F4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0051 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP165N10F4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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