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STP15NM60ND

STMicroelectronics

STP15NM60ND by STMicroelectronics

STP15NM60ND from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 14A max drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 6,000 parts In-Stock

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6,000

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Digiode

USA . 4,942 parts In-Stock

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4,942

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Vyrian

USA . 4,099 parts In-Stock

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4,099

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Anansix

USA . 1,619 parts In-Stock

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1,619

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Sunrise Surplus Inc.

USA . 400 parts In-Stock

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400

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,394 parts In-Stock

1+ parts

$1.292

100+ parts

-

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$1.163

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1,394

$1.292

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$1.163

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MKK Technologies

India . 1,124 parts In-Stock

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$2.429

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1,124

$2.429

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DigiPath Technology Company

USA . 1,124 parts In-Stock

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$2.429

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1,124

$2.429

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AZTECH Wire

Italy . 788 parts In-Stock

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$13.870

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788

$13.870

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Kepictronics

USA . 57,500 parts In-Stock

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57,500

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Authorized Procurement Solutions

USA . 12,000 parts In-Stock

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Epart123

USA . 6,000 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,119 parts In-Stock

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Corphita

USA . 1,361 parts In-Stock

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1,361

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Parana Technologies

USA . 1,087 parts In-Stock

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$1.544

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$1.544

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Perfect Parts

USA . 216 parts In-Stock

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216

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Overview

Unlock exceptional performance with the STP15NM60ND from STMicroelectronics, a leader in innovative power solutions. This robust N-channel FET offers unparalleled switching efficiency and reliability, making it ideal for demanding applications like motor control and power supplies. Designed for versatility and ease of integration, it ensures optimal energy management while delivering long-lasting durability. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a good balance of durability and lightweight characteristics, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide better performance and higher efficiency in switching applications compared to P-channel alternatives.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and improves overall reliability by protecting against reverse-bias conditions.

Transistor Application: SWITCHING

Designed primarily for switching applications, which enhances efficiency in power management within circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures the device can handle high-voltage conditions, making it suitable for robust power applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs, facilitating better layout options.

Terminal Form: THROUGH-HOLE

Through-hole terminal design offers better mechanical stability and ease of handling during assembly and soldering.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides improved control and performance in most switching applications.

Maximum Pulsed Drain Current (IDM): 56 A

High pulsed drain current capacity allows the transistor to handle peak currents, which is essential in dynamic applications.

Avalanche Energy Rating (EAS): 300 mJ

A respectable avalanche energy rating enhances the robustness of the device, protecting it against transient conditions.

Maximum Drain Current (Abs) (ID): 14 A

A maximum continuous drain current of 14 A makes this FET suitable for a wide range of applications requiring significant power handling.

No. of Terminals: 3

Three terminals simplify the design while providing all necessary connections for efficient operation.

Maximum Power Dissipation (Abs): 125 W

High power dissipation capability allows the device to operate efficiently under heavy load without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides secure mounting options and excellent thermal management capabilities.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low gate drive requirements, enhancing overall circuit efficiency.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature rating allows the transistor to function effectively in demanding environments.

Transistor Element Material: SILICON

Silicon is a widely used material in transistors, known for its excellent electrical properties and stability.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-lasting performance.

Maximum Drain Current (ID): 14 A

Reiterating the maximum drain current ensures clarity on the device's capabilities in handling specific loads.

Maximum Drain-Source On Resistance: 0.299 ohm

Low on-resistance minimizes power losses during operation, enhancing the efficiency of power conversion stages.

Terminal Position: SINGLE

A single terminal position simplifies PCB layout and keeps the design straightforward.

Technical Specifications

Power Field Effect Transistors (FET) STP15NM60ND attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP15NM60ND Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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