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STP15NM60N

STMicroelectronics

STP15NM60N by STMicroelectronics

STP15NM60N from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 14A max drain current, and 125W power dissipation. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,647 parts In-Stock

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5,647

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Digiode

USA . 3,419 parts In-Stock

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3,419

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Anansix

USA . 116 parts In-Stock

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116

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Inventory MP

USA . 20 parts In-Stock

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20

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Bristol Electronics

USA . 20 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,779 parts In-Stock

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$1.495

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$1.346

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1,779

$1.495

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$1.346

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MKK Technologies

India . 1,669 parts In-Stock

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$2.811

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1,669

$2.811

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DigiPath Technology Company

USA . 1,669 parts In-Stock

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$2.811

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1,669

$2.811

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Component Stockers USA

USA . 1,573 parts In-Stock

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$14.600

100+ parts

$13.870

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$13.430

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1,573

$14.600

$13.870

$13.430

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AZTECH Wire

Italy . 1,129 parts In-Stock

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$18.320

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$18.320

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QUARKTWIN TECHNOLOGY LTD

USA . 24,292 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,645 parts In-Stock

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Corphita

USA . 4,995 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,556 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 627 parts In-Stock

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$1.788

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Perfect Parts

USA . 373 parts In-Stock

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Overview

Unlock unparalleled performance with the STP15NM60N from STMicroelectronics, a leader in innovation and quality. This N-channel power FET excels in switching applications, delivering reliability and efficiency that enhance your designs. Its robust 600V breakdown voltage and built-in diode ensure optimal operation, making it perfect for demanding environments. Trust STMicroelectronics for cutting-edge technology and elevate your projects with the powerful capabilities of the STP15NM60N!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance against environmental factors, making the FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration is favored for its higher efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design, providing additional protection and functionality.

Transistor Application: SWITCHING

Designed specifically for switching, this FET can efficiently control electrical currents in various electronic circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures reliability and stability in high-voltage applications.

Package Shape: RECTANGULAR

Rectangular packaging allows for easier integration into PCB designs, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides robust mechanical support and a strong electrical connection, ideal for high-current applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables low power consumption and better control of current flow, making the FET efficient in its operation.

Maximum Pulsed Drain Current (IDM): 56 A

A high pulsed current rating allows this FET to handle surges and spikes in electrical demand, suitable for dynamic applications.

Avalanche Energy Rating (EAS): 300 mJ

High avalanche energy rating provides assurance against voltage transients, enhancing reliability in rugged environments.

Maximum Drain Current (Abs) (ID): 14 A

A maximum drain current of 14 A ensures the FET can handle substantial loads without risk of overheating or failure.

No. of Terminals: 3

Three terminals offer simplicity in design and ease of integration into existing circuits.

Maximum Power Dissipation (Abs): 125 W

A high power dissipation capability allows for effective heat management, enhancing performance and longevity.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides stable and secure installation, reducing the risk of mechanical issues during operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology excels in switching speed and efficiency, making this FET an excellent choice for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating enables reliable performance in demanding environments without compromising functionality.

Transistor Element Material: SILICON

Silicon offers excellent electrical properties and availability, making it a standard choice for power transistors.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and corrosion resistance, enhancing the overall reliability of the connections.

Maximum Drain Current (ID): 14 A

With a maximum drain current of 14 A, this FET can efficiently operate under moderate loads, making it versatile for various use cases.

Maximum Drain-Source On Resistance: 0.299 ohm

A low on-resistance enables efficient current flow, minimizing power losses and heat generation during operation.

Terminal Position: SINGLE

The single terminal position simplifies integration and provides flexibility in circuit design layout.

Technical Specifications

Power Field Effect Transistors (FET) STP15NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.299 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

56 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP15NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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