Loading...

STP14NK60Z

STMicroelectronics

STP14NK60Z by STMicroelectronics

STP14NK60Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 54A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,732

-

-

-

-

Digiode

USA . 758 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

758

-

-

-

-

Anansix

USA . 129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

129

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 801 parts In-Stock

1+ parts

$0.604

100+ parts

-

1k+ parts

$0.544

10k+ parts

-

801

$0.604

-

$0.544

-

MKK Technologies

India . 2,286 parts In-Stock

1+ parts

$1.137

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$1.137

-

-

-

DigiPath Technology Company

USA . 2,286 parts In-Stock

1+ parts

$1.137

100+ parts

-

1k+ parts

-

10k+ parts

-

2,286

$1.137

-

-

-

AZTECH Wire

Italy . 1,099 parts In-Stock

1+ parts

$11.130

100+ parts

-

1k+ parts

-

10k+ parts

-

1,099

$11.130

-

-

-

Kepictronics

USA . 5,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,500

-

-

-

-

Alle Elektronik GmbH

Germany . 4,081 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,081

-

-

-

-

Corphita

USA . 1,221 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,221

-

-

-

-

Parana Technologies

USA . 190 parts In-Stock

1+ parts

-

100+ parts

$0.723

1k+ parts

-

10k+ parts

-

190

-

$0.723

-

-

Overview

Elevate your projects with the STP14NK60Z from STMicroelectronics, a powerhouse in power FET technology. Renowned for unmatched reliability, STMicroelectronics ensures top-tier quality and performance. This versatile N-channel transistor excels in switching applications, delivering exceptional efficiency and robust operation even in demanding environments. Experience streamlined designs and enhanced durability—unlocking superior value for your innovations!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material is lightweight and provides good durability, making the product suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and better performance in switching applications, making this product efficient for use in power electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design by eliminating the need for external components, enhancing reliability and reducing space.

Transistor Application: SWITCHING

Designed specifically for switching applications, this device supports efficient on/off control, ideal for power management in various systems.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures robust performance in high-voltage applications, making it reliable for use in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient mounting and integration into circuit boards, optimizing space usage.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring durability and stability in high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs allow for greater control over the transistor behavior, enabling high-efficiency operation in various applications.

Maximum Pulsed Drain Current (IDM): 54 A

The ability to handle a maximum pulsed drain current of 54 A enhances its suitability for high-power applications, ensuring it can manage energy peaks effectively.

Avalanche Energy Rating (EAS): 300 mJ

With an avalanche energy rating of 300 mJ, this FET can safely absorb energy transients, providing protection and enhancing reliability in circuits.

Maximum Drain Current (Abs) (ID): 12 A

A maximum drain current of 12 A indicates robust current handling capabilities, suitable for a variety of electronic applications.

No. of Terminals: 3

The 3-terminal layout allows for straightforward integration into electronic designs, facilitating connection and integration.

Maximum Power Dissipation (Abs): 160 W

A maximum power dissipation of 160 W indicates that this FET can handle significant energy without overheating, ensuring reliable operation under heavy loads.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides additional mounting stability, making it suitable for applications where mechanical stress may be a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology results in lower gate drive requirements and higher efficiency, making this product ideal for low-power applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET is suitable for high-temperature applications, ensuring reliability in demanding environments.

Transistor Element Material: SILICON

Silicon as a semiconductor material ensures good electrical properties and efficiency, providing reliable performance across a range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-lasting connections in electronic circuits.

Maximum Drain Current (ID): 13.5 A

The capability of handling a maximum drain current of 13.5 A makes this FET versatile for a variety of power-level applications.

Maximum Drain-Source On Resistance: 0.5 ohm

A low on-resistance of 0.5 ohm minimizes power losses during operation, improving overall efficiency for applications requiring high performance.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and integration, making it user-friendly for various applications.

Technical Specifications

Power Field Effect Transistors (FET) STP14NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

13.5 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

54 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP14NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20