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STP14NF10

STMicroelectronics

STP14NF10 by STMicroelectronics

STP14NF10 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 15 A and a breakdown voltage of 100 V. It operates in enhancement mode with a low on-resistance of 0.13 Ω. Ideal for high-efficiency power management solutions.

Median Price

$0.579

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,995 parts In-Stock

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$0.579

100+ parts

$0.505

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-

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2,995

$0.579

$0.505

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Chip1Stop

Japan . 2,995 parts In-Stock

1+ parts

$0.752

100+ parts

$0.536

1k+ parts

$0.519

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2,995

$0.752

$0.536

$0.519

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Verical

USA . 2,995 parts In-Stock

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$0.505

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2,995

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$0.505

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Distributors (In-Stock)

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Digiode

USA . 606 parts In-Stock

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$0.550

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606

$0.550

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Pegasus Components GmbH

Germany . 15,000 parts In-Stock

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Vyrian

USA . 7,206 parts In-Stock

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North Shore Components

USA . 7,020 parts In-Stock

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Chip Stock

USA . 2,846 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,761 parts In-Stock

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Lakeland Logistics Inc

USA . 900 parts In-Stock

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900

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Bristol Electronics

USA . 900 parts In-Stock

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$0.685

1k+ parts

$0.475

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900

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$0.685

$0.475

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Dan-Mar Components

USA . 400 parts In-Stock

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400

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Schukat

Germany . 170 parts In-Stock

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170

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LIBRA Elektronik GmbH

Germany . 85 parts In-Stock

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85

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Anansix

USA . 84 parts In-Stock

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84

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LWI Electronics Inc

India . 82 parts In-Stock

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Microfarads

USA . 19 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 982 parts In-Stock

1+ parts

$0.391

100+ parts

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1k+ parts

$0.352

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982

$0.391

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$0.352

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Ampacity Inc.

Singapore . 2,598 parts In-Stock

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$0.429

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2,598

$0.429

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Corphita

USA . 1,887 parts In-Stock

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$0.521

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1,887

$0.521

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MKK Technologies

India . 491 parts In-Stock

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$0.735

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491

$0.735

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DigiPath Technology Company

USA . 491 parts In-Stock

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$0.735

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491

$0.735

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Component Stockers USA

USA . 10,277 parts In-Stock

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$0.800

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$0.430

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$0.430

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10,277

$0.800

$0.430

$0.430

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AZTECH Wire

Italy . 416 parts In-Stock

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$20.910

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416

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Perfect Parts

USA . 147,909 parts In-Stock

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147,909

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,355 parts In-Stock

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Parana Technologies

USA . 1,866 parts In-Stock

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$0.468

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Alle Elektronik GmbH

Germany . 1,759 parts In-Stock

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1,759

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Assy Fe

Spain . 1,724 parts In-Stock

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Eastek

USA . 950 parts In-Stock

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950

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GreenTree Electronics

Israel . 950 parts In-Stock

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Overview

Unlock the power of reliability with the STP14NF10 from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel power FET excels in switching applications, providing exceptional durability and performance for your designs. With built-in protection features and a maximum operating temperature of 175 °C, it ensures longevity even in demanding environments. Boost your projects with confidence, knowing you’re backed by STMicroelectronics’ commitment to quality and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material contributes to the lightweight and durable nature of the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer higher performance, including lower on-resistance and higher efficiency, thus making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against voltage spikes, enhancing the reliability of the circuit in which the transistor is used.

Transistor Application: SWITCHING

Designed for switching applications, this FET allows for efficient control in various electronic circuits and systems.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage ensures that the FET can withstand significant stress in high-voltage applications without failing.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier mounting and integration into circuit boards, enhancing design flexibility.

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure robust mechanical connections, which are advantageous for high-current applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in the off-state, improving energy efficiency for battery-operated applications.

Maximum Pulsed Drain Current (IDM): 60 A

A high pulsed drain current capability supports demanding applications, enabling the FET to handle transients without damage.

Avalanche Energy Rating (EAS): 70 mJ

An avalanche energy rating of 70 mJ allows for reliable performance under extreme conditions, providing extra safety margins.

Maximum Drain Current (Abs) (ID): 15 A

With a maximum continuous drain current of 15 A, this FET can adequately handle significant loads in commercial electronic devices.

No. of Terminals: 3

A design with 3 terminals simplifies the circuit layout and improves compatibility with standard electronic components.

Maximum Power Dissipation (Abs): 60 W

The ability to dissipate up to 60 W of power allows for use in high-power applications without risking thermal failure.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging provides excellent mechanical stability, making it suitable for rugged applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances the performance characteristics such as switching speed and power efficiency, making it ideal for modern applications.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures reliable performance in high-temperature environments, increasing versatility.

Transistor Element Material: SILICON

Silicon as the primary material ensures good electrical characteristics and reliability, making it a well-known choice among developers.

Terminal Finish: TIN

A tin terminal finish provides excellent solderability and oxidation resistance, contributing to long-term reliability in circuits.

Maximum Drain Current (ID): 15 A

Reiterating the strength in current handling, this FET's ability to handle 15 A aids in robustness across various applications.

Maximum Drain-Source On Resistance: 0.13 ohm

A low on-resistance of 0.13 ohm minimizes power loss during operation, enhancing efficiency and reducing heat generation.

Terminal Position: SINGLE

The single terminal position streamlines the design process, leading to easier integration in compact electronic devices.

Case Connection: DRAIN

The direct connection to the drain enables efficient heat transfer and voltage management in power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP14NF10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

70 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.13 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP14NF10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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