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STP100NF04

STMicroelectronics

STP100NF04 by STMicroelectronics

STP100NF04 from STMicroelectronics is an N-channel FET ideal for switching applications, featuring a max drain current of 120 A and a breakdown voltage of 40 V. It operates in enhancement mode with low on-resistance of 0.0046 Ω. This robust transistor supports high power dissipation up to 300 W.

Median Price

$3.300

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 34,700 parts In-Stock

1+ parts

$1.315

100+ parts

$1.079

1k+ parts

-

10k+ parts

-

34,700

$1.315

$1.079

-

-

Chip1Stop

Japan . 1,606 parts In-Stock

1+ parts

$3.300

100+ parts

$1.380

1k+ parts

$1.230

10k+ parts

-

1,606

$3.300

$1.380

$1.230

-

DigiKey

USA . 454 parts In-Stock

1+ parts

$3.310

100+ parts

$1.496

1k+ parts

$1.125

10k+ parts

$1.045

454

$3.310

$1.496

$1.125

$1.045

Verical

USA . 34,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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34,700

-

-

-

-

Avnet

USA . 1,700 parts In-Stock

1+ parts

-

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-

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1,700

-

-

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EBV Elektronik

Germany . 150 parts In-Stock

1+ parts

-

100+ parts

-

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150

-

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,716 parts In-Stock

1+ parts

$1.934

100+ parts

-

1k+ parts

-

10k+ parts

-

4,716

$1.934

-

-

-

TME

Poland . 103 parts In-Stock

1+ parts

$3.010

100+ parts

-

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-

10k+ parts

-

103

$3.010

-

-

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Vyrian

USA . 7,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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7,497

-

-

-

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ComSIT Distribution GmbH

Germany . 634 parts In-Stock

1+ parts

-

100+ parts

-

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634

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Chip Stock

USA . 374 parts In-Stock

1+ parts

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374

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Anansix

USA . 166 parts In-Stock

1+ parts

-

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166

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Sunrise Surplus Inc.

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

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100

-

-

-

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Micros sp.j. W. Kędra i J. Lic

Poland . 50 parts In-Stock

1+ parts

-

100+ parts

$2.071

1k+ parts

$2.018

10k+ parts

$2.018

50

-

$2.071

$2.018

$2.018

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,333 parts In-Stock

1+ parts

$0.394

100+ parts

-

1k+ parts

$0.354

10k+ parts

-

1,333

$0.394

-

$0.354

-

MKK Technologies

India . 1,722 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

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1,722

$0.740

-

-

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DigiPath Technology Company

USA . 1,722 parts In-Stock

1+ parts

$0.740

100+ parts

-

1k+ parts

-

10k+ parts

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1,722

$0.740

-

-

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Corphita

USA . 4,932 parts In-Stock

1+ parts

$1.832

100+ parts

-

1k+ parts

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10k+ parts

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4,932

$1.832

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-

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Continental Prestige Electronics

USA . 1,481 parts In-Stock

1+ parts

$2.080

100+ parts

$1.480

1k+ parts

$1.330

10k+ parts

-

1,481

$2.080

$1.480

$1.330

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Microchip USA

USA . 2,322 parts In-Stock

1+ parts

$22.555

100+ parts

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2,322

$22.555

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Perfect Parts

USA . 23,407 parts In-Stock

1+ parts

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23,407

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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Parana Technologies

USA . 2,140 parts In-Stock

1+ parts

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100+ parts

$0.471

1k+ parts

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10k+ parts

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2,140

-

$0.471

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Authorized Procurement Solutions

USA . 1,600 parts In-Stock

1+ parts

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1,600

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Eastek

USA . 900 parts In-Stock

1+ parts

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900

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GreenTree Electronics

Israel . 900 parts In-Stock

1+ parts

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900

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Overview

Elevate your projects with the STP100NF04 from STMicroelectronics, a trusted leader in semiconductor innovation. This high-performance N-channel power FET is designed for efficient switching applications, delivering reliability and exceptional energy management. With its robust build and advanced technology, you can expect seamless operation in demanding environments. Experience enhanced performance and superior value that transforms your designs into powerful solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and cost-effectiveness, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and faster switching speeds, making them ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances protection against inductive load transients.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for rapid on/off control, ideal for power management.

Minimum DS Breakdown Voltage: 40 V

A minimum DS breakdown voltage of 40 V ensures reliable performance in various high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient heat dissipation and minimizes space on the PCB.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical stability and provides excellent soldering reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for versatile control and better performance in a wide range of applications.

Maximum Pulsed Drain Current (IDM): 480 A

The high pulsed drain current rating enables handling of large transient loads, beneficial for demanding applications.

Avalanche Energy Rating (EAS): 1200 mJ

A high avalanche energy rating adds robustness and reliability, protecting against overvoltage events.

Maximum Drain Current (Abs) (ID): 120 A

With a maximum drainage current of 120 A, this FET can efficiently handle substantial loads, making it very versatile.

No. of Terminals: 3

The 3-terminal design provides a simple integration into circuits while maintaining performance.

Maximum Power Dissipation (Abs): 300 W

A high power dissipation of 300 W allows for greater thermal management, supporting demanding operational conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances heat dissipation and mounting stability, suitable for heavy-duty applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, appealing for efficient designs.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C ensures reliable performance in hot environments, suitable for industrial applications.

Transistor Element Material: SILICON

Silicon as the element material ensures good thermal conductivity and reliability in a variety of conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish offers excellent solderability and corrosion resistance, enhancing longevity.

Maximum Drain Current (ID): 120 A

The capability of handling 120 A continuous drain current makes this FET ideal for high-efficiency power applications.

Maximum Drain-Source On Resistance: 0.0046 ohm

A low on-resistance offers efficient conduction and minimizes power loss, enhancing overall system performance.

Terminal Position: SINGLE

Single terminal position simplifies integration into circuits, making it easier to design compact electronic solutions.

Technical Specifications

Power Field Effect Transistors (FET) STP100NF04 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1200 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP100NF04 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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