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STMPS2262TTR

STMicroelectronics

STMPS2262TTR by STMicroelectronics

STMPS2262TTR by STMicroelectronics is a dual-channel power management IC designed for industrial applications. It operates within a supply voltage range of 2.7V to 5.5V and withstands temperatures from -40 °C to 85 °C. Its compact 3mm x 3mm package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,147 parts In-Stock

1+ parts

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8,147

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Digiode

USA . 746 parts In-Stock

1+ parts

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746

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Anansix

USA . 709 parts In-Stock

1+ parts

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709

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$1.150

100+ parts

-

1k+ parts

$1.035

10k+ parts

-

708

$1.150

-

$1.035

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Ampacity Inc.

Singapore . 1,506 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,506

$1.500

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MKK Technologies

India . 2,246 parts In-Stock

1+ parts

$2.162

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2,246

$2.162

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DigiPath Technology Company

USA . 2,246 parts In-Stock

1+ parts

$2.162

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2,246

$2.162

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Microchip USA

USA . 6,191 parts In-Stock

1+ parts

$8.959

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6,191

$8.959

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AZTECH Wire

Italy . 385 parts In-Stock

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$9.680

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385

$9.680

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Component Stockers USA

USA . 2,528 parts In-Stock

1+ parts

$25.270

100+ parts

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2,528

$25.270

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Authorized Procurement Solutions

USA . 6,580 parts In-Stock

1+ parts

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6,580

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Corphita

USA . 1,579 parts In-Stock

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1,579

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Parana Technologies

USA . 182 parts In-Stock

1+ parts

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100+ parts

$1.375

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182

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$1.375

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Overview

Experience unparalleled reliability and performance with the STMPS2262TTR from STMicroelectronics, a leader in advanced power management solutions. This compact and efficient IC is designed to thrive in the toughest environments, ensuring your devices operate seamlessly across various industrial applications. With its robust thermal characteristics and dual-channel support, it delivers exceptional value by optimizing power supply efficiency while reducing footprint. Elevate your projects with trusted quality and innovation from STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the reliability of the IC, providing protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs, making it easier to integrate the IC into modern electronics while saving PCB space.

Package Shape: SQUARE

The square package shape facilitates efficient heat dissipation and more straightforward PCB layout compared to other shapes.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many applications, ensuring compatibility with common power supply voltages.

No. of Terminals: 8

Eight terminals provide ample connectivity options, allowing for flexible circuit designs and integration into various systems.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design are ideal for space-constrained applications, while the heat sink/slugs aid in thermal management.

Maximum Operating Temperature: 85 °C

An operating temperature of 85 °C makes this IC suitable for industrial applications, ensuring performance in challenging environments.

Minimum Operating Temperature: -40 °C

With a wide operating temperature range, this IC remains reliable in extreme cold conditions, making it suitable for various applications.

Terminal Position: DUAL

Dual terminal positioning can improve the layout flexibility on the PCB and allows for easier routing of signals.

Maximum Seated Height: 1.1 mm

A low seated height contributes to a compact design, helping to minimize overall product size in applications with height constraints.

Width: 3 mm

The narrow width aids in dense PCB layouts, facilitating integration into small form-factor devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is versatile for various applications, enhancing power management capabilities.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7 V ensures compatibility with a wide range of battery-operated devices.

Length: 3 mm

The compact length allows for flexible placement on PCBs, aiding efficient design and optimization of space.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature applications, this IC is built to withstand harsh environments, ensuring durability and longevity.

No. of Channels: 2

Two channels enhance the functionality of the IC for applications requiring multiple outputs or power management functions.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide excellent mechanical strength when mounted on a PCB.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density configurations, enabling the design of compact electronic systems.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, the IC can accommodate slight voltage variations, enhancing its operational stability.

Technical Specifications

Power Management ICs STMPS2262TTR attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

STMPS2262TTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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