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STM8T143AU62T

STMicroelectronics

STM8T143AU62T by STMicroelectronics

STM8T143AU62T by STMicroelectronics is a capacitive proximity sensor with a voltage output range of 0.07-4.9V and response time of 850000 us. It operates b/w -40 to 85 °C, suitable for surface mount applications in various industries like automotive and consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,833 parts In-Stock

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Digiode

USA . 2,514 parts In-Stock

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Anansix

USA . 2,327 parts In-Stock

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2,327

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$2.103

100+ parts

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$1.893

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$1.893

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MKK Technologies

India . 649 parts In-Stock

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$3.955

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649

$3.955

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DigiPath Technology Company

USA . 649 parts In-Stock

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$3.955

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649

$3.955

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Parana Technologies

USA . 2,069 parts In-Stock

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$2.515

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$2.515

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Corphita

USA . 487 parts In-Stock

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487

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Overview

Unleash the power of precision with the STM8T143AU62T by STMicroelectronics. Crafted by a trusted manufacturer, this proximity sensor offers unparalleled quality and reliability. Ideal for a wide range of applications, this sensor provides accurate detection without compromise. Experience seamless integration and reliable performance with the STM8T143AU62T. Unlock endless possibilities with this advanced technology at your fingertips. Elevate your projects to new heights with the STM8T143AU62T.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for greater flexibility in power sources and can support a wider range of applications.

Body Width: 2 inch

Compact size of the body allows for easy installation in various spaces without taking up too much room.

Sensors or Transducers Type: PROXIMITY SENSOR, CAPACITIVE

Capacitive proximity sensors offer high accuracy and reliability in detecting objects without physical contact.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows the sensor to be used in both hot and cold environments without any issues.

Output Range: 0.07-4.9V

Wide output range provides precise and detailed information about the proximity of objects being detected.

Response Time: 850000 us

Fast response time ensures quick and accurate detection of objects in the proximity, enhancing overall efficiency.

Termination Type: SOLDER

Solder termination makes for a secure and durable connection, ensuring reliable performance over time.

Output Interface Type: 1-WIRE INTERFACE

1-wire interface simplifies the connection process and allows for easy integration with other systems or devices.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes installation quick and easy, saving time and effort during setup.

Technical Specifications

Proximity Sensors STM8T143AU62T attributes and parameters. Explore more Proximity Sensors devices from STMicroelectronics

Specs

Body Width:

2 inch

Body Height:

.55 mm

Body Length/Diameter:

3 mm

Mounting Feature:

Maximum Operating Current:

.075 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

1-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Response Time:

850000 us

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Termination Type:

SOLDER

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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