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STM8T143AU61T

STMicroelectronics

STM8T143AU61T by STMicroelectronics

STM8T143AU61T by STMicroelectronics is a capacitive proximity sensor with 2 inch width and 0.55 mm height. It operates b/w -40 to 85 °C, with output range of 0.07-4.9V via 1-Wire interface. Ideal for surface mount applications requiring voltage output sensing in the range of 2.3-5.5 V supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Anansix

USA . 2,655 parts In-Stock

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Vyrian

USA . 1,225 parts In-Stock

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Digiode

USA . 1,088 parts In-Stock

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IDEA Electronic Components Group

UK . 2,188 parts In-Stock

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$2.980

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$2.682

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MKK Technologies

India . 1,134 parts In-Stock

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$5.603

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DigiPath Technology Company

USA . 1,134 parts In-Stock

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$5.603

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Corphita

USA . 1,231 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 929 parts In-Stock

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$3.563

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929

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Metaverse IC Inc.

Canada . 577 parts In-Stock

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Kepictronics

USA . 492 parts In-Stock

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Overview

Enhance your proximity sensing capabilities with the STM8T143AU61T by STMicroelectronics. This high-quality capacitive proximity sensor offers unmatched precision and reliability, making it ideal for a wide range of applications. From automotive to industrial automation, this sensor provides accurate detection while operating at a low power consumption, ensuring optimal performance and efficiency. Trust in STMicroelectronics' reputation for excellence and invest in the STM8T143AU61T for top-notch quality and value.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this proximity sensor can be used in a wide range of applications without the risk of voltage overload.

Body Width: 2 inch

The compact 2-inch body width allows for easy installation in various locations, making this sensor versatile for different setups.

Sensors or Transducers Type: PROXIMITY SENSOR,CAPACITIVE

Capacitive proximity sensors are known for their accuracy and reliability in detecting objects, ensuring precise measurements.

Body Height: 0.55 mm

The low body height of 0.55 mm enables this sensor to be discreetly placed without taking up much space.

Package Shape or Style: RECTANGULAR

The rectangular shape of the package allows for easy integration into a variety of systems and equipment.

Minimum Supply Voltage: 2.3 V

With a low minimum supply voltage requirement, this sensor can operate efficiently even in lower power environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that this sensor can withstand harsh environmental conditions.

Output Range: 0.07-4.9V

The wide output range of 0.07-4.9V provides flexibility in signal output for precise data collection and analysis.

Output Type: VOLTAGE OUTPUT

With a voltage output, this sensor provides a straightforward signal that can be easily interpreted and used in various applications.

Response Time: 850000 us

The quick response time of 850,000 microseconds ensures that this sensor can detect changes in proximity rapidly for real-time monitoring.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40 °C, this sensor can function reliably even in cold environments.

Maximum Operating Current: 0.075 mA

The low maximum operating current of 0.075 mA helps in reducing power consumption and making the sensor more energy-efficient.

Body Length/Diameter: 3 mm

The small body length/diameter of 3 mm makes this sensor easy to handle and install in tight spaces.

Termination Type: SOLDER

The solder termination type ensures a secure connection, making installation of this sensor robust and reliable.

Output Interface Type: 1-WIRE INTERFACE

The 1-wire interface simplifies the connectivity of this sensor with other devices, enabling seamless data transfer and communication.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for convenient installation on a flat surface, making this sensor easy to integrate into existing systems.

Technical Specifications

Proximity Sensors STM8T143AU61T attributes and parameters. Explore more Proximity Sensors devices from STMicroelectronics

Specs

Body Width:

2 inch

Body Height:

.55 mm

Body Length/Diameter:

3 mm

Mounting Feature:

Maximum Operating Current:

.075 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Interface Type:

1-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Response Time:

850000 us

Sensors or Transducers Type:

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.3 V

Termination Type:

SOLDER

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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