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STM8S903K3U6TR

STMicroelectronics

STM8S903K3U6TR by STMicroelectronics

STM8S903K3U6TR from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in -40 °C to 85°C. It features 32 terminals, 2048 ROM words, and supports I2C, SPI, and UART for versatile applications in industrial settings. Ideal for low-power designs with integrated ADC and PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,611 parts In-Stock

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2,611

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Digiode

USA . 2,570 parts In-Stock

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2,570

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Anansix

USA . 1,590 parts In-Stock

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1,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 4,500 parts In-Stock

1+ parts

$1.850

100+ parts

-

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4,500

$1.850

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Microchip USA

USA . 3,964 parts In-Stock

1+ parts

$6.926

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3,964

$6.926

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AZTECH Wire

Italy . 1,038 parts In-Stock

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$11.020

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1,038

$11.020

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Component Stockers USA

USA . 6,956 parts In-Stock

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$14.240

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6,956

$14.240

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IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$22.920

100+ parts

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$20.628

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2,113

$22.920

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$20.628

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MKK Technologies

India . 1,388 parts In-Stock

1+ parts

$43.099

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1,388

$43.099

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DigiPath Technology Company

USA . 1,388 parts In-Stock

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$43.099

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1,388

$43.099

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Parana Technologies

USA . 983 parts In-Stock

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$27.404

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983

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$27.404

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Corphita

USA . 869 parts In-Stock

1+ parts

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869

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iodParts Technologies Inc.

India . 100 parts In-Stock

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100

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Overview

Unlock the potential of your projects with the STM8S903K3U6TR microcontroller from STMicroelectronics. Renowned for its exceptional quality and reliability, this versatile 8-bit powerhouse seamlessly integrates into a variety of applications, from industrial automation to consumer electronics. Experience enhanced performance, low power consumption, and robust connectivity options that elevate your designs while ensuring longevity and efficiency. Elevate your innovations today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for efficient use of PCB space and enables automated assembly processes.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this microcontroller can operate safely with standard power supplies, ensuring reliability in various applications.

Package Shape: SQUARE

The square package shape allows for easier design and layout on printed circuit boards.

Bit Size: 8

An 8-bit architecture provides adequate processing power for many embedded applications, ensuring cost-effectiveness and simplicity.

Power Supplies (V): 3.3/5

The ability to operate at both 3.3 V and 5 V makes it versatile for a wide range of applications, allowing compatibility with various electronic components.

No. of Terminals: 32

With 32 terminals, this microcontroller offers sufficient input/output options for complex interfacing needs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective heat dissipation and a compact design, suitable for space-constrained applications.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage allows for low-power applications, extending battery life in portable devices.

Maximum Operating Temperature: 85 °C

Its capability to operate at high temperatures makes it suitable for industrial applications where environmental conditions can be harsh.

Minimum Operating Temperature: -40 °C

Operating in extreme low temperatures ensures reliability in cold environments, suitable for outdoor and automotive applications.

ADC Channels: YES

The presence of ADC channels allows for direct interfacing of analog signals, expanding its functionality in sensor applications.

Terminal Position: QUAD

Quad terminal position enhances connection reliability and ease of soldering, benefiting assembly processes.

ROM Words: 2048

With 2048 ROM words, sufficient program memory is available for complex applications, providing greater functionality.

Maximum Seated Height: 0.6 mm

A low seated height aids in high-density PCB designs, allowing for more components in a smaller footprint.

Width: 5 mm

The 5 mm width contributes to its compactness, making it suitable for space-limited applications.

Data EEPROM Size: 640

Having 640 bytes of data EEPROM is useful for storing configuration and calibration data, enhancing flexibility.

Peripherals: BOD, POR, TIMER(6)

The inclusion of built-in peripherals like Brown-Out Detection, Power-On Reset, and multiple timers provides essential functionality for robust application design.

Maximum Clock Frequency: 16 MHz

With a maximum clock frequency of 16 MHz, it offers adequate processing speed for most microcontroller tasks.

Length: 5 mm

The compact length of 5 mm further enhances its suitability for tight circuit designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliability and performance in demanding environments.

Peripheral IC Type: MICROCONTROLLER

This dedicated microcontroller peripheral type provides optimized performance for embedded applications, ensuring efficiency.

RAM Bytes: 1024

1024 bytes of RAM allows for proper data handling and processing for various applications, enabling smoother operations.

Technology: CMOS

CMOS technology provides low power consumption, making it suitable for battery-operated devices.

Terminal Form: NO LEAD

No lead terminal form enhances environmental safety and simplifies soldering methods.

Analog To Digital Converters: 7-Ch 10-Bit

The presence of 7-channel 10-bit ADCs allows for high-resolution analog signal conversion, enhancing data accuracy.

Maximum Supply Current: 4.75 mA

A low maximum supply current aids in conserving power, which is crucial for portable and battery-powered applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal voltage of 3.3 V improves compatibility with modern digital logic levels, ensuring seamless integration.

PWM Channels: YES

The availability of PWM channels allows for efficient control of motors and other peripherals, expanding the application range.

Connectivity: I2C, IRDA, LIN, SPI, UART

A wide range of connectivity options provides flexibility for integration into various systems and simplifies communication with other devices.

ROM Programmability: FLASH

Flash programmability allows for easy re-programming of the microcontroller, accommodating updates and changes in application requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm facilitates high-density connections, enabling space-efficient designs.

Speed: 16 rpm

Supporting a speed of 16 rpm makes it suitable for applications requiring moderate speed control, such as robotics.

On Chip Program ROM Width: 32

The 32-bit program ROM width allows for efficient code execution and handling of larger instruction sets.

No. of I/O Lines: 28

With 28 I/O lines, it offers ample connection points for sensors, actuators, and other peripherals, enhancing versatility.

Technical Specifications

Microcontrollers STM8S903K3U6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of I/O Lines:

28

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(6)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8S903K3U6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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