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STM8S903K3T3C

STMicroelectronics

STM8S903K3T3C by STMicroelectronics

STM8S903K3T3C from STMicroelectronics is an 8-bit microcontroller with a max supply voltage of 5.5V and operates in extreme temperatures (-40 °C to 125°C). It features 32 terminals, 2048 ROM words, and supports I2C/SPI/UART connectivity. Ideal for automotive applications, it includes ADC channels and PWM capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,809 parts In-Stock

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Digiode

USA . 2,071 parts In-Stock

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Anansix

USA . 1,213 parts In-Stock

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1,213

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Distributors (Availability)

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Vigor

Singapore . 1,217 parts In-Stock

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$1.010

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$1.010

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Microchip USA

USA . 3,235 parts In-Stock

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$9.002

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3,235

$9.002

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AZTECH Wire

Italy . 729 parts In-Stock

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$16.190

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729

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IDEA Electronic Components Group

UK . 675 parts In-Stock

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$51.962

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$46.765

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675

$51.962

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$46.765

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MKK Technologies

India . 1,750 parts In-Stock

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$97.710

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$97.710

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DigiPath Technology Company

USA . 1,750 parts In-Stock

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$97.710

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$97.710

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Corphita

USA . 3,597 parts In-Stock

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Kepictronics

USA . 3,500 parts In-Stock

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Parana Technologies

USA . 2,329 parts In-Stock

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$62.128

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$62.128

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Overview

Unlock the potential of your projects with the STM8S903K3T3C microcontroller from STMicroelectronics, a leader in cutting-edge semiconductor technology. Designed for versatility, this reliable 8-bit MCU excels in automotive and industrial applications while offering exceptional power efficiency. With a compact design and robust performance, it empowers engineers to innovate with ease, ensuring high-quality outputs and seamless connectivity. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V gives flexibility in various power supply configurations.

Package Shape: SQUARE

The square package shape promotes efficient layout and thermal management on PCBs.

Bit Size: 8

An 8-bit architecture balances performance and power consumption for basic applications.

Power Supplies: 3.3/5 V

Supports dual voltage supplies, making it versatile for different system requirements.

No. of Terminals: 32

A total of 32 terminals allows for extensive connectivity options and peripheral interfacing.

Package Style (Meter): FLATPACK, LOW PROFILE

Flatpack, low profile design reduces height and footprint, enabling slimmer product designs.

Minimum Supply Voltage: 2.95 V

The low minimum voltage enhances compatibility with battery-operated devices.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in automotive and harsh environment applications.

CPU Family: STM8

Based on the STM8 family, known for robust performance and widespread support.

Minimum Operating Temperature: -40 °C

Wide temperature range makes it suitable for industrial and automotive environments.

Terminal Finish: MATTE TIN

Matte tin finish protects against oxidation and ensures excellent solderability.

ADC Channels: YES

Integrated ADC channels provide enhanced analog-to-digital conversion capabilities, ideal for sensor applications.

Terminal Position: QUAD

Quad terminal positioning facilitates easier PCB layout and manufacturing.

ROM Words: 2048

2048 ROM words provide ample storage for program code in various applications.

Maximum Seated Height: 1.6 mm

Low seated height enables compact design and integration into space-constrained environments.

Width: 7 mm

7 mm width supports design compatibility with numerous PCBs and enhances layout flexibility.

Data EEPROM Size: 640

640 bytes of EEPROM for data storage allows for flexibility in data handling.

Peripherals: BOD, POR, TIMER(6)

Integrated peripherals such as brown-out detection and timers make it versatile for timed tasks and safety.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency offers a good balance between performance and power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

Gives confidence during manufacturing processes such as solder reflow, ensuring good solder joint integrity.

Peak Reflow Temperature (°C): 235

High reflow temperature tolerance allows for compatibility with standard soldering processes.

Length: 7 mm

Compact length makes it feasible for low-profile and space-constrained applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability in critical automotive environments.

Peripheral IC Type: MICROCONTROLLER

Microcontroller IC type equates to versatility in control applications across different fields.

RAM Bytes: 1024

1024 bytes of RAM allows for efficient processing and data handling during operations.

Technology: CMOS

CMOS technology offers low power consumption, making it suitable for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminal form facilitates simple and reliable surface mount assembly.

Analog To Digital Converters: 7-Ch 10-Bit

7-channel, 10-bit ADCs provide versatility for multi-sensor applications in real-time measurements.

Maximum Supply Current: 4.75 mA

Low supply current enhances battery life in portable applications, reducing overall power consumption.

Nominal Supply Voltage: 3.3 V

3.3 V nominal voltage is commonly used, ensuring compatibility with many modern circuits.

PWM Channels: YES

PWM capabilities enhance control over analog components, useful for motor control and signal modulation.

Connectivity: I2C, IRDA, LIN, SPI, UART

Supports a range of connectivity interfaces, providing flexibility for various application needs.

ROM Programmability: FLASH

Flash programming allows for easy updates and reprogramming, ensuring longevity and adaptability.

Terminal Pitch: 0.8 mm

0.8 mm terminal pitch facilitates high-density packaging while maintaining ease of assembly.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand certain moisture levels during assembly without risk.

Speed: 16 rpm

Speed rating supports precision control applications, contributing to accurate performance.

On Chip Program ROM Width: 32

32-bit ROM width enables complex programming needs and accommodates larger code bases.

No. of I/O Lines: 28

28 I/O lines offer extensive interfacing capabilities for connecting various devices and peripherals.

Technical Specifications

Microcontrollers STM8S903K3T3C attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

4.75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

640

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(6)

Analog To Digital Convertors:

7-Ch 10-Bit

Trade Compliance

STM8S903K3T3C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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