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STM8S208C6T6TR

STMicroelectronics

STM8S208C6T6TR by STMicroelectronics

STM8S208C6T6TR microcontroller from STMicroelectronics features a 24 MHz CPU, 6144 bytes of RAM, and operates b/w -40 °C to 85 °C. With 35 external interrupts and low power modes, it's ideal for industrial applications requiring efficient processing. Its compact design ensures easy integration in various devices.

Median Price

$2.496

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IBS Electronics

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.496

10k+ parts

$2.468

12,000

-

-

$2.496

$2.468

Vyrian

USA . 4,024 parts In-Stock

1+ parts

-

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4,024

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-

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Digiode

USA . 3,892 parts In-Stock

1+ parts

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3,892

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-

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Anansix

USA . 1,162 parts In-Stock

1+ parts

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1,162

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,450 parts In-Stock

1+ parts

$1.750

100+ parts

-

1k+ parts

-

10k+ parts

-

3,450

$1.750

-

-

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AZTECH Wire

Italy . 1,043 parts In-Stock

1+ parts

$14.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1,043

$14.310

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Component Stockers USA

USA . 4,142 parts In-Stock

1+ parts

$30.070

100+ parts

-

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-

4,142

$30.070

-

-

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IDEA Electronic Components Group

UK . 2,345 parts In-Stock

1+ parts

$58.903

100+ parts

-

1k+ parts

$53.013

10k+ parts

-

2,345

$58.903

-

$53.013

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MKK Technologies

India . 1,872 parts In-Stock

1+ parts

$110.763

100+ parts

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1,872

$110.763

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DigiPath Technology Company

USA . 1,872 parts In-Stock

1+ parts

$110.763

100+ parts

-

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1,872

$110.763

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QUARKTWIN TECHNOLOGY LTD

USA . 18,663 parts In-Stock

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18,663

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Lixinc

USA . 15,723 parts In-Stock

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15,723

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Microchip USA

USA . 5,450 parts In-Stock

1+ parts

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5,450

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Corphita

USA . 1,993 parts In-Stock

1+ parts

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1,993

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Parana Technologies

USA . 1,939 parts In-Stock

1+ parts

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100+ parts

$70.428

1k+ parts

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1,939

-

$70.428

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Overview

Elevate your projects with the STM8S208C6T6TR microcontroller from STMicroelectronics, a trusted leader in innovation. This high-performance chip is designed for reliability and efficiency, perfect for automotive, industrial, and consumer applications. With low power consumption, extensive I/O capability, and robust temperature tolerance, it brings exceptional value to your designs. Unlock endless possibilities while benefiting from ST's commitment to quality and cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material offers excellent environmental resistance, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient use of PCB space, making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows for operational flexibility in various power settings.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for simple data processing tasks, making it ideal for low-complexity applications.

Package Shape: SQUARE

The square package shape allows for efficient thermal and electrical performance within confined spaces.

Bit Size: 8

8-bit architecture enables straightforward data handling, making it a good fit for basic embedded applications.

No. of Terminals: 48

With 48 terminals, it offers ample connectivity options for various peripherals and components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design enhances compatibility with compact circuit designs.

Minimum Supply Voltage: 2.95 V

The low minimum supply voltage enables the product to operate in battery-powered applications efficiently.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is robust enough for industrial applications.

CPU Family: STM8

The STM8 family is known for reliability and performance in microcontroller applications, ensuring steady operation.

No. of External Interrupts: 35

A high number of external interrupts allows for responsive and interactive applications.

Minimum Operating Temperature: -40 °C

An extended temperature range makes this microcontroller suitable for harsh environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish enhances solderability and provides excellent corrosion resistance.

ADC Channels: YES

Integrated ADC channels enhance the product’s versatility, allowing for analog signal processing.

Terminal Position: QUAD

Quad terminal positions enhance stability and connectivity options on the PCB.

ROM Words: 32768

With a ROM capacity of 32,768 words, it supports substantial program storage for various applications.

Maximum Seated Height: 1.6 mm

The compact seated height facilitates integration in space-constrained designs.

RAM Words: 6144

The substantial RAM capacity supports complex data processing tasks and multitasking capabilities.

Width: 7 mm

A compact width allows for easy integration into smaller devices and designs.

Maximum Clock Frequency: 24 MHz

A maximum clock frequency of 24 MHz ensures swift data processing and responsiveness.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time at peak reflow temperature of 40 seconds ensures reliability during assembly.

Peak Reflow Temperature (°C): 260

Compatible with modern soldering techniques, ensuring effective assembly in high-density PCBs.

Length: 7 mm

The compact length contributes to the ability to fit into smaller electronic projects.

Temperature Grade: INDUSTRIAL

An industrial temperature grade guarantees reliability and performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER

Designed specifically for embedded control applications, making it versatile in a variety of uses.

No. of Timers: 4

Multiple timer functionalities provide enhanced control for event scheduling and timing applications.

RAM Bytes: 6144

With 6144 bytes of RAM, it adequately supports temporary data storage for application processing.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering qualities and are suitable for automatic assembly.

Maximum Supply Current: 18 mA

Low maximum supply current makes it energy-efficient, crucial for battery-operated devices.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns well with common logic levels in many electronic circuits.

PWM Channels: YES

Integrated PWM channels allow for precise control in applications like motor drive and signals.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications, enhancing product versatility.

Terminal Pitch: 0.5 mm

The small terminal pitch is advantageous for high-density PCB layouts, fitting in limited space.

Format: FIXED POINT

Fixed point data format simplifies arithmetic operations and enhances computation efficiency.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, it is suitable for standard reflow processes, ensuring easy handling and assembly.

Speed: 24 rpm

Designed to operate at 24 rpm, making it suitable for real-time measurements and control tasks.

Low Power Mode: YES

Low power mode extends battery life in portable devices, making it energy-efficient for prolonged use.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides straightforward programming capabilities, ideal for simpler applications.

No. of I/O Lines: 38

38 I/O lines offer extensive interfacing options for a variety of peripherals and sensors.

Technical Specifications

Microcontrollers STM8S208C6T6TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Additional Features:

WHEN TEMPERATURE IS GREATER THAN 105 DEGREE CELCIUS, MICROCONTROLLER SPEED WILL BE REDUCED TO 16 MHZ

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

6144

RAM Words:

6144

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S208C6T6TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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