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STM8S105S6T3C

STMicroelectronics

STM8S105S6T3C by STMicroelectronics

STM8S105S6T3C microcontroller from STMicroelectronics features a 16 MHz clock, operates b/w 2.95V and 5.5V, and includes 9 ADC channels. Its automotive-grade design ensures reliability in harsh environments. Ideal for embedded applications requiring efficient processing and connectivity options like I2C and UART.

Median Price

$3.242

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 880 parts In-Stock

1+ parts

$3.184

100+ parts

-

1k+ parts

$1.804

10k+ parts

$1.615

880

$3.184

-

$1.804

$1.615

DigiKey

USA . 959 parts In-Stock

1+ parts

$3.300

100+ parts

$2.273

1k+ parts

$1.854

10k+ parts

$1.729

959

$3.300

$2.273

$1.854

$1.729

Verical

USA . 6,258 parts In-Stock

1+ parts

-

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6,258

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Distributors (In-Stock)

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Digiode

USA . 1,851 parts In-Stock

1+ parts

$3.025

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1,851

$3.025

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Vyrian

USA . 4,413 parts In-Stock

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4,413

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Anansix

USA . 2,886 parts In-Stock

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2,886

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Halfin

Belgium . 1,506 parts In-Stock

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1,506

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 886 parts In-Stock

1+ parts

$2.866

100+ parts

-

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886

$2.866

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Vigor

Singapore . 8,000 parts In-Stock

1+ parts

$3.020

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8,000

$3.020

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AZTECH Wire

Italy . 1,182 parts In-Stock

1+ parts

$11.220

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1,182

$11.220

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Microchip USA

USA . 1,658 parts In-Stock

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$24.440

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1,658

$24.440

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IDEA Electronic Components Group

UK . 1,140 parts In-Stock

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$73.214

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$65.892

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1,140

$73.214

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$65.892

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MKK Technologies

India . 1,855 parts In-Stock

1+ parts

$137.673

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1,855

$137.673

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DigiPath Technology Company

USA . 1,855 parts In-Stock

1+ parts

$137.673

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1,855

$137.673

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Perfect Parts

USA . 30,050 parts In-Stock

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30,050

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iodParts Technologies Inc.

India . 19,200 parts In-Stock

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19,200

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Glotronic Ltd.

UK . 704 parts In-Stock

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704

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Parana Technologies

USA . 472 parts In-Stock

1+ parts

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$87.538

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472

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$87.538

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Overview

Unlock your project's potential with the STM8S105S6T3C microcontroller from STMicroelectronics, a trusted leader in innovation. Designed for versatility and reliability, this high-performance MCU excels in automotive applications and beyond, delivering exceptional efficiency at both low and high temperatures. With its robust features and expansive connectivity options, you can count on seamless integration and enhanced performance, maximizing value for your next design. Transform your ideas into reality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into printed circuit boards, providing flexibility in product design.

Maximum Supply Voltage: 5.5 V

The ability to operate at a maximum supply voltage of 5.5 V provides versatility for many power supply applications.

Package Shape: SQUARE

The square package shape simplifies layout and design, optimizing the use of space on PCBs.

Bit Size: 8

An 8-bit size allows for simpler data processing and lower power consumption, suitable for basic applications.

Power Supplies: 3.3/5 V

Dual power supply options enhance compatibility with various electronic components and systems.

No. of Terminals: 44

A higher terminal count enables more input/output connections, which is beneficial for complex applications.

Package Style: FLATPACK, LOW PROFILE

The low-profile design helps in applications where height constraints are crucial, allowing for more compact electronics.

Minimum Supply Voltage: 2.95 V

Low minimum voltage allows for use in battery-powered applications, extending the operational life of devices.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensures reliable performance in harsh environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range enhances device reliability in extreme conditions, essential for automotive and industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and prevents corrosion, enhancing longevity and performance.

ADC Channels: YES

Integrated ADC channels allow for direct interfacing with analog sensors, expanding the range of possible applications.

Terminal Position: QUAD

Quad terminal positioning allows for better board layout options and improved electrical performance.

ROM Words: 8192

A substantial ROM size provides ample space for storing application programs, enhancing functionality.

Maximum Seated Height: 1.6 mm

Low seated height contributes to compact designs, suitable for modern sleek electronic devices.

Width: 10 mm

Compact width helps in size-constrained applications, allowing for versatility in design.

Data EEPROM Size: 1K

Sufficient EEPROM size supports data storage needs, valuable for configuration settings or variable storage.

Peripherals: BOD, POR, TIMER(9)

Integrated peripherals enhance functionality and reduce the need for external components, simplifying designs.

Maximum Clock Frequency: 16 MHz

A decent clock frequency provides adequate processing power for a wide range of embedded applications.

Maximum Time At Peak Reflow Temperature: 30 s

Prepared for standard soldering processes, ensuring compatibility with existing manufacturing practices.

Peak Reflow Temperature: 260 °C

High reflow temperature capability ensures reliability even during modern assembly processes.

Length: 10 mm

Compact length aids in designing space-efficient devices, making it suitable for various applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive use, ensuring it meets the rigorous standards required in this industry.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it is specifically designed for control-oriented applications, providing tailored solutions.

RAM Bytes: 2048

Adequate RAM size ensures smooth operation of applications, allowing for multitasking and data handling.

Technology: CMOS

CMOS technology leads to lower power consumption and higher integration capabilities, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals ease assembly and provide reliable connection to circuit boards.

Analog To Digital Converters: 9-Ch 10-Bit

Multiple ADC channels allow for simultaneous signal processing, enhancing the microcontroller's versatility.

Nominal Supply Voltage: 3.3 V

Preferred nominal voltage ensures compatibility with many low-power microcontroller applications.

PWM Channels: YES

Integrated PWM channels facilitate control of motors and other systems, broadening application uses.

Connectivity: I2C, IRDA, LIN, SPI, UART

Multiple connectivity interfaces provide flexibility and ease of integration into complex systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and rewrites of firmware, improving long-term usability.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for higher density component placement on PCBs, ideal for compact designs.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity indicates the need for proper handling during manufacturing, ensuring reliability.

Speed: 16 rpm

Appropriate speed rating for control applications makes it suitable for a variety of industries.

On Chip Program ROM Width: 32

Wider ROM width enhances data handling capacity, fitting modern requirements for program storage.

No. of I/O Lines: 34

A large number of I/O lines increases the potential for complex implementations, accommodating various project needs.

Technical Specifications

Microcontrollers STM8S105S6T3C attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

34

No. of Terminals:

44

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, LIN, SPI, UART

Peripherals:

BOD, POR, TIMER(9)

Analog To Digital Convertors:

9-Ch 10-Bit

Trade Compliance

STM8S105S6T3C Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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