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STM8S105C4T3TR

STMicroelectronics

STM8S105C4T3TR by STMicroelectronics

STM8S105C4T3TR microcontroller from STMicroelectronics features a 16 MHz CPU, 2 KB RAM, and operates b/w -40 °C to 125°C. With 35 external interrupts and low power modes, it's ideal for automotive applications. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,030 parts In-Stock

1+ parts

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7,030

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Digiode

USA . 2,499 parts In-Stock

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2,499

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Anansix

USA . 791 parts In-Stock

1+ parts

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791

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,146 parts In-Stock

1+ parts

$1.270

100+ parts

-

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3,146

$1.270

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Microchip USA

USA . 4,020 parts In-Stock

1+ parts

$10.861

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4,020

$10.861

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$16.368

100+ parts

$16.204

1k+ parts

$15.549

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10

$16.368

$16.204

$15.549

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AZTECH Wire

Italy . 152 parts In-Stock

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$22.170

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152

$22.170

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IDEA Electronic Components Group

UK . 489 parts In-Stock

1+ parts

$49.143

100+ parts

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$44.228

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489

$49.143

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$44.228

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MKK Technologies

India . 2,147 parts In-Stock

1+ parts

$92.410

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2,147

$92.410

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DigiPath Technology Company

USA . 2,147 parts In-Stock

1+ parts

$92.410

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2,147

$92.410

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Corphita

USA . 1,542 parts In-Stock

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1,542

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Parana Technologies

USA . 321 parts In-Stock

1+ parts

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$58.758

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321

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$58.758

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Overview

Elevate your projects with the STM8S105C4T3TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and reliability, this cutting-edge MCU excels in automotive and industrial applications, offering low power consumption and robust performance. With an 8-bit architecture and extensive I/O capability, it empowers developers to create efficient designs while benefiting from ST’s renowned quality and support, ensuring your success at every stage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protects the microcontroller from physical damage.

Surface Mount: YES

Surface mount technology allows for compact designs and is essential for modern circuit board layouts.

Maximum Supply Voltage: 5.5 V

This flexibility in voltage allows for a broader range of applications, ensuring compatibility with various power systems.

On Chip Data RAM Width: 8

An 8-bit RAM width is suitable for many lightweight applications while maintaining efficiency.

Package Shape: SQUARE

The square shape optimizes space on the PCB and can be more easily integrated with other components.

Bit Size: 8

An 8-bit architecture provides a good balance of performance and resource efficiency for a variety of tasks.

No. of Terminals: 48

A higher number of terminals allows for greater connectivity options, enabling more complex designs.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This style contributes to reduced space usage, making it ideal for compact applications.

Minimum Supply Voltage: 2.95 V

Lower supply voltage supports battery-operated devices, enhancing energy efficiency and extending device life.

Maximum Operating Temperature: 125 °C

High operating temperature capability makes this microcontroller suitable for automotive and other demanding environments.

CPU Family: STM8

The STM8 family is well-regarded for its performance and wide range of applications in embedded systems.

No. of External Interrupts: 35

A high number of interrupts allows the microcontroller to handle multiple inputs efficiently, enhancing responsiveness.

Minimum Operating Temperature: -40 °C

Extreme temperature tolerance ensures reliable operation in harsh environments, particularly for automotive use.

Terminal Finish: NICKEL PALLADIUM GOLD

This premium finish improves reliability by enhancing resistance to corrosion and providing better solderability.

ADC Channels: YES

Inclusion of ADC channels supports versatile applications requiring analog-to-digital conversion capabilities.

Terminal Position: QUAD

Quad terminal positioning aids in efficient layout designs and reduces interference between traces.

ROM Words: 16384

With 16 KB of ROM, this microcontroller can hold substantial program code, allowing for complex applications.

Maximum Seated Height: 1.6 mm

A low profile height is advantageous for compact applications and helps in optimizing the overall design.

RAM Words: 1024

1 KB of RAM is sufficient for many embedded applications, promoting smooth operations without excessive power consumption.

Width: 7 mm

A compact width facilitates space-efficient integrations into small electronic devices.

Maximum Clock Frequency: 16 MHz

The 16 MHz clock frequency provides adequate processing speed for a wide range of applications.

Maximum Time At Peak Reflow Temperature (s): 40

This specification ensures that the microcontroller can withstand typical soldering processes without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance is essential for compatibility with modern surface-mount soldering techniques.

Length: 7 mm

Short length further supports compact designs, making it ideal for portable or limited-space applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are built for durability and reliability, making them trustworthy for vehicle applications.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it offers integrated control, making it suitable for a variety of embedded system applications.

No. of Timers: 4

Multiple timers enhance the device's ability to handle timing functions and manage operations effectively.

RAM Bytes: 2048

2 KB of RAM supports more complex applications, allowing for better data handling during operation.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals offer good mechanical stability and are easier to solder, enhancing assembly reliability.

Maximum Supply Current: 8 mA

Low supply current enhances energy efficiency, making it suitable for low-power applications.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage is standard for many devices, ensuring easy integration into existing designs.

PWM Channels: YES

The presence of PWM channels allows for precise control over motors and lights, expanding application possibilities.

ROM Programmability: FLASH

Flash programmability allows for easy updating of firmware, providing flexibility in software development.

Terminal Pitch: 0.5 mm

A fine pitch of 0.5 mm helps in achieving higher density designs on PCBs, suitable for sophisticated electronic devices.

Format: FIXED POINT

Fixed point format offers efficient computation for many control algorithms, suitable for real-time applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, allowing for appropriate handling and storage procedures.

Speed: 16 rpm

The specified speed indicates suitability for various applications, particularly in control systems and motors.

Low Power Mode: YES

A low power mode enables energy saving during idle states, making it excellent for battery-operated devices.

On Chip Program ROM Width: 8

An 8-bit program ROM width complements the system architecture efficiently, achieving optimized performance.

No. of I/O Lines: 38

A high number of I/O lines enhances interaction with various peripherals and expands the microcontroller's versatility.

Technical Specifications

Microcontrollers STM8S105C4T3TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Boundary Scan:

NO

CPU Family:

STM8

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

35

No. of I/O Lines:

38

No. of Terminals:

48

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

2048

RAM Words:

1024

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Maximum Supply Current:

8 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.95 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Peripheral IC Type:

Trade Compliance

STM8S105C4T3TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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