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STM8L152C6T3

STMicroelectronics

STM8L152C6T3 by STMicroelectronics

STM8L152C6T3 microcontroller from STMicroelectronics features a 16 MHz CPU, operates b/w 1.65-3.6 V, and includes 25 ADC channels. Its automotive-grade design supports various applications with low power consumption and multiple connectivity options. Ideal for embedded systems requiring efficiency and versatility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,796 parts In-Stock

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5,796

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Digiode

USA . 2,748 parts In-Stock

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2,748

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Anansix

USA . 1,164 parts In-Stock

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1,164

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Distributors (Availability)

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AZTECH Wire

Italy . 1,152 parts In-Stock

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$8.600

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1,152

$8.600

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Microchip USA

USA . 4,118 parts In-Stock

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$13.383

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4,118

$13.383

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IDEA Electronic Components Group

UK . 525 parts In-Stock

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$30.990

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$27.891

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525

$30.990

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$27.891

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MKK Technologies

India . 1,258 parts In-Stock

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$58.275

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1,258

$58.275

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DigiPath Technology Company

USA . 1,258 parts In-Stock

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$58.275

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1,258

$58.275

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Kepictronics

USA . 3,750 parts In-Stock

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3,750

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Corphita

USA . 1,432 parts In-Stock

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1,432

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Eastek

USA . 750 parts In-Stock

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$2.650

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750

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$2.650

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GreenTree Electronics

Israel . 750 parts In-Stock

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750

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Parana Technologies

USA . 732 parts In-Stock

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$37.054

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732

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iodParts Technologies Inc.

India . 250 parts In-Stock

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250

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Overview

Elevate your next project with the STM8L152C6T3 microcontroller from STMicroelectronics, a brand synonymous with quality and innovation. Designed for efficiency and versatility, this low-power gem excels in automotive applications, offering robust performance in challenging environments. With advanced features like integrated DAC and ADC channels, it empowers developers to create smart solutions that stand out. Unlock the potential of your designs while benefiting from STMicroelectronics' trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environments.

Surface Mount: YES

Surface mount capability allows for easier integration into compact designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes the microcontroller suitable for low-voltage applications.

Package Shape: SQUARE

The square package shape is efficient for layout designs on PCBs.

Bit Size: 8

An 8-bit architecture is ideal for applications requiring moderate processing power.

DAC Channels: YES

Inclusion of DAC channels allows for precise analog output, enhancing functionality.

Power Supplies (V): 1.8/3.3

Flexible power supply options (1.8V and 3.3V) improve compatibility with various hardware.

No. of Terminals: 48

With 48 terminals, it offers plenty of connections for multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Low profile flatpack design is suited for space-constrained applications.

Minimum Supply Voltage: 1.65 V

A minimum supply voltage of 1.65 V allows the microcontroller to operate in battery-powered devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in extreme conditions.

CPU Family: ST8

The ST8 CPU family supports a range of applications due to its efficient architecture.

Minimum Operating Temperature: -40 °C

Ability to function in low temperatures makes it suitable for automotive and industrial applications.

ADC Channels: YES

Integration of ADC channels provides flexibility for sensing applications.

DMA Channels: YES

DMA channels enable efficient data transfer without burdening the CPU, improving performance.

Terminal Position: QUAD

Quad terminal position allows for easy mounting and good thermal performance.

ROM Words: 32768

Sufficient ROM space for storing firmware enhances application capabilities.

Maximum Seated Height: 1.6 mm

Low seated height is advantageous for dense PCB layouts.

Digital To Analog Converters: 1-Ch 12-Bit

12-bit resolution in DAC enhances the precision of analog outputs.

Width: 7 mm

Compact width allows for flexible integration in small devices.

Data EEPROM Size: 1K

1K EEPROM is beneficial for storing configuration data or calibration information.

Peripherals: BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Rich set of peripherals enables diverse applications from sensing to timing.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency provides adequate processing speed for many embedded applications.

Length: 7 mm

The length contributes to a compact design, suitable for modern electronics.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature range signifies suitability for vehicle applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture allows for efficient instruction processing, enhancing performance.

RAM Bytes: 2048

2KB of RAM supports complex applications and data handling.

Technology: CMOS

CMOS technology ensures low power consumption, extending battery life in portable applications.

Terminal Form: GULL WING

Gull wing terminals facilitate robust connections, ideal for soldering onto PCBs.

Analog To Digital Converters: 25-Ch 12-Bit

25-channel ADC capability allows for comprehensive data acquisition from multiple sources.

Maximum Supply Current: 80 mA

80 mA maximum supply current fits within the operational limits of many embedded designs.

Nominal Supply Voltage: 3 V

A nominal voltage of 3V is well-suited for a wide range of battery-operated devices.

PWM Channels: YES

PWM capabilities enhance control in motor and lighting applications.

Connectivity: I2C, IRDA, SPI, USART

Diverse connectivity options facilitate easy integration with various devices and sensors.

ROM Programmability: FLASH

Flash memory allows for easy updates and reprogramming of firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch (0.5 mm) is suitable for modern PCB designs requiring high density.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates appropriate handling requirements, ensuring reliability in production.

Speed: 16 rpm

Speed capabilities support control applications for motors and other rotary devices.

On Chip Program ROM Width: 8

8-bit program ROM width allows efficient coding practices in simpler applications.

No. of I/O Lines: 41

41 I/O lines provide extensive interfacing options for various peripherals.

Technical Specifications

Microcontrollers STM8L152C6T3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST8

Maximum Clock Frequency:

16 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

41

No. of Terminals:

48

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

2048

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

80 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, IRDA, SPI, USART

Peripherals:

BOD, COMPARATOR(2), DMA(4), LCD, POR, RTC, TIMER(7)

Analog To Digital Convertors:

25-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM8L152C6T3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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